公众号记得加星标⭐️，第一时间看推送不会错过。 供应链指出，台积电将高雄定位为2纳米家族主力据点，未来五座Phase将陆续量产2纳米与A16制程。业界观察，A16制程除提升效能与功耗比，更首次导入晶背供 电结构，是AI与高速运算晶片性能飞跃关键技术。随着高雄厂进入量产期，台积电在先进制程区域分工逐步成形。 据悉，A14制程预定2028年量产，由新竹宝山Fab20的P3、P4率先推进，主要量产基地则为台中Fab25，共计四座厂房，预计今年底动工、2028年下半年投产。若高 雄第六厂同步导入A14，将使整体产能更具弹性，也显示市场对AI与高效能运算需求强劲。 美国亚利桑那州厂则预计在P3、P4导入2nm/A16。根据目前厂务工程业者评估，尽管速度正在加快，但P3厂最快明年中下旬才会开始进行无尘室、水电系统等施 作，因此2028年前要在美国大量生产2纳米难度高。相较之下，高雄建厂进度明显领先，未来可望成为台积电2纳米以下制程的全球核心枢纽。 来源 ： 内容来自 工商时报 。 埃米（angstrom）时代即将来临，台积电先进制程布局马不停蹄。供应链透露，高雄将成为2纳米生产重镇，Fab22规划的五座厂区（Phase ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自半导体芯闻综合。 市场传出，台积电相当于1.4纳米的「A14」制程的良率进展已经超前。根据The Futurum Group 半 导 体 分 析 师 Ray Wang 透 过 社 交 平 台 X 公 布 的 讯 息 ， 台 积 电 A14 制 程 的 「 良 率 表 现 」 (yield performance)进展已经超前。 根 据 Wang 提 供 的 讯 息 ， 台 积 电 A16 制 程 整 合 了 片 电 晶 体 、 超 级 电 轨 (SPR) 及 创 新 的 背 面 接 面 (backside contact)设计，相较于N2P制程，A16的速度提升8~10%、功耗降低15~20%，芯片密度 增加约1.1倍，非常适合用于需要复杂讯号传输、稳定供电的高效能运算(HPC)产品。 相较之下，A14完整接续N2制程，专为AI及智能型手机应用量身打造，具备进阶的NanoFlex Pro 单元架构。 吴诚文解释，一是过去台湾半导体产业多仰赖国外，但现在晶圆制造、封测连结本地自有供应链比 重增加，尤其三大园区有些厂商过去不在供应链中，但半导体业发展快速、且 ...

Investment Rating - The report maintains a "Buy" rating for the company, indicating a strong expectation for future growth [4]. Core Insights - The company reported Q2 2025 revenue of $30.07 billion, a year-on-year increase of 44.4% and a quarter-on-quarter increase of 17.8%. The gross margin was 58.6%, up 5.4 percentage points year-on-year but down 0.2 percentage points quarter-on-quarter. Net profit reached $12.8 billion, reflecting a year-on-year increase of 60.7% and a quarter-on-quarter increase of 10.2% [2]. - The company has raised its full-year revenue growth guidance to approximately 30%, driven primarily by demand for advanced processes. In Q2 2025, revenue from N3, N5, and N7 processes accounted for 24%, 36%, and 14% of total wafer revenue, respectively, totaling 74% [3]. - The company is expected to benefit significantly from the growing demand for AI chips, with projections for net profits of $49.686 billion, $60.379 billion, and $66.768 billion for the years 2025 to 2027, respectively [4]. Summary by Sections Performance Review - In Q2 2025, the company achieved revenue of $30.07 billion, with a gross margin of 58.6% and net profit of $12.8 billion [2]. Operational Analysis - The decline in gross margin is attributed to the appreciation of the New Taiwan Dollar (TWD), which impacts revenue when converted from USD. A 1% appreciation in TWD results in a 1% revenue loss and a 40 basis points loss in gross margin. In Q2 2025, TWD appreciated by 4.4%, leading to a 180 basis points decline in gross margin, with further expected appreciation causing an additional 260 basis points loss [3]. - The company anticipates the first-generation N2 process to enter mass production in H2 2025, with subsequent processes expected in 2026 and 2028 [3]. Profit Forecast, Valuation, and Rating - The company is positioned as a leader in the wafer foundry industry, with a competitive edge in advanced processes, expected to benefit from the rise in AI chip demand. The projected net profits for 2025, 2026, and 2027 are $49.686 billion, $60.379 billion, and $66.768 billion, respectively [4].

Core Viewpoint - TSMC's employee bonuses and dividends for 2024 have reached a record high, reflecting strong revenue and profit growth from the previous year, with an average payout of over NT$200 million per employee [1][2]. Group 1: Employee Compensation - TSMC will distribute a total of NT$140.59 billion in employee performance bonuses and dividends for 2024, marking a year-on-year increase of over 40% [1][2]. - The average annual bonus per employee is NT$200.84 million, which represents a year-on-year increase of NT$51.32 million, or approximately 34.32% [2]. - Employees with six years of service can expect bonuses as high as NT$1.8 million, while those with five years and top performance ratings can receive around NT$1.16 million [1]. Group 2: Financial Performance - TSMC's total revenue for 2024 is projected to reach NT$2.8943 trillion, with a net profit of NT$1.1732 trillion, both figures representing new highs [1]. - The earnings per share (EPS) is expected to be NT$45.25, showcasing TSMC's strong competitive position in the semiconductor industry [1]. Group 3: Industry Context - The global semiconductor industry is facing challenges, with competitors like Samsung and Intel experiencing delays and operational difficulties in their advanced process technologies [4][5]. - TSMC maintains its leadership in advanced process technology, with plans to mass-produce 2nm processes in the second half of this year and A16 processes by the second half of 2026 [5]. - The demand for high-end processes is expected to rise due to the growing need for AI servers, further solidifying TSMC's position as a leading foundry [5].

Core Viewpoint - TSMC's recent technology forum in Shanghai highlighted the company's advancements in semiconductor technology and its market outlook, particularly focusing on the growth of the semiconductor market driven by high-performance computing (HPC) and AI integration, despite limitations in advanced process offerings to Chinese clients [3][4][5]. Market Outlook - The global semiconductor market is projected to exceed $1 trillion by 2030, with HPC accounting for 45%, smartphones for 25%, automotive for 15%, and IoT for 10% [5][6]. Advanced Process Technology - TSMC's 3nm family continues to evolve, with N3P expected to enter mass production in Q4 2024, enhancing performance by 5% or reducing power consumption by 5-10% compared to N3E [6][9]. - N2P is anticipated to begin production in H2 2026, offering an 18% performance increase at the same power level and a 36% reduction in power at the same performance level [11][13]. - The A16 process, set for mass production in H2 2026, integrates three innovative technologies, promising an 8-10% performance boost or a 15-20% reduction in power consumption compared to N2P [14][19][22]. - The A14 process, based on second-generation GAA technology, is expected to start production in 2028, with significant improvements in speed and energy efficiency [20][22]. Advanced Packaging Technology - TSMC's 3DFabric® technology includes SoIC platforms for 3D silicon stacking, with N3-on-N4 stacking expected to enter mass production in 2025 [23][25]. - The SoW-X platform, set for 2027, aims to enhance computational capabilities significantly, integrating essential components for AI training [30]. Special Process Technologies - TSMC is advancing automotive technology with its latest logic technologies, which enhance performance by approximately 20% per generation while reducing power consumption by 30-40% [32]. - The company is also focusing on IoT applications, with developments in ultra-low leakage SRAM and logic circuits to extend battery life [38]. Manufacturing Excellence - TSMC anticipates a twelvefold increase in wafer shipments for AI-related products by 2025 compared to 2021 [44]. - The company plans to add nine new facilities by 2025 to expand capacity, including six wafer fabs in Taiwan and two overseas [45]. - TSMC is committed to sustainable manufacturing, aiming for net-zero emissions by 2050 and a 98% resource recovery rate by 2030 [46][48].