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景旺电子: 景旺电子关于珠海金湾基地扩产投资计划的补充公告
Zheng Quan Zhi Xing· 2025-08-24 16:13
Expansion Investment Overview - The company plans to invest a total of 5 billion RMB in the expansion of its Zhuhai Jinwan base, with an estimated payback period of approximately 7.5 years, including the construction period [1][2] - The investment will be implemented in phases, including the renovation of existing facilities and the construction of a new high-end HDI factory, expected to produce 800,000 square meters of high-end HDI by mid-2026 [1][2] Market Demand and Feasibility - The expansion is driven by the high demand for high-end PCBs, particularly in AI servers and high-speed network infrastructure, with a projected compound annual growth rate of 15.7% for multilayer boards with 18 layers or more from 2024 to 2029 [1][3] - The company has over 30 years of experience in PCB manufacturing and has established a solid technical foundation and customer base at the Zhuhai Jinwan base, ensuring the feasibility of the expansion project [2][3] Strategic Alignment - The investment aligns with national industrial policies and meets the long-term, high-standard demand for high-end PCBs in emerging fields, enhancing the company's competitive advantage in high-end products [3][4] - The project supports the company's strategy to focus on AI and expand its second growth curve, aiming to increase the proportion of high-end products in its portfolio [3][4] Financial Position - As of March 31, 2025, the company reported a revenue of 3.343 billion RMB, with a net cash flow compound growth rate of 21.34%, indicating a strong financial position to support the investment [5] - The funding will come from self-owned or self-raised funds, and the company plans to optimize its capital structure and financing costs to ensure sufficient funds for the project [5]
景旺电子拟50亿元扩产珠海金湾基地 部分产线可年内投入使用
Group 1 - The core investment plan for the Zhuhai Jinwan base involves a total investment of RMB 5 billion, with a tax return period of approximately 7.5 years, including the construction period from 2025 to 2027 [1] - The investment includes RMB 1 billion for targeted technological upgrades in high-layer factories and the addition of advanced HDI production lines for AI servers, aimed at overcoming existing production bottlenecks and enhancing technical capabilities, expected to be completed in the second half of 2025 [1] - A planned investment of RMB 3.2 billion for a new high-end HDI factory is expected to achieve an annual production capacity of 800,000 square meters, with construction starting in the second half of 2025 and production commencing in mid-2026 [1] Group 2 - The market for high-end PCBs is projected to grow significantly, driven by advancements in AI servers and high-speed network infrastructure, with a compound annual growth rate of 15.7% for multilayer boards over 18 layers and 6.4% for HDI from 2024 to 2029 [2] - The company has over 30 years of experience in PCB manufacturing and is recognized as a national high-tech enterprise, providing a solid technical foundation for the successful implementation of the expansion project [2] - The expansion aligns with national industrial policies and industry trends, addressing the long-term demand for high-end PCBs in emerging fields, while enhancing the company's production capacity for advanced HDI, SLP, and HLC products [2]