证券代码：688020 证券简称：方邦股份公告编号：2026-002 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 一、本期业绩预告情况 （一）业绩预告期间 二、上年同期业绩情况和财务状况 公司上年同期（2024年1月1日至2024年12月31日）实现主营业务收入30,698.69万元，归属于母公司所有 者的净利润为-9,164.27万元，归属于母公司所有者的扣除非经常性损益的净利润为-11,276.88万元。 三、本期业绩变化的主要原因 （一）报告期内，公司主营业务收入较上年同期增长8.63%，主要是公司研发工作取得阶段性成果，相 关新产品逐步贡献收入，其中电阻薄膜（埋阻铜箔）报告期内首度实现量产，取得收入627.84万元，同 比大幅增长；FCCL实现收入3,893.6万元，同比增长71.23%。 （二）报告期内，公司预计实现归属于母公司所有者的净利润为-7,300万元至-11,000万元，实现归属于 母公司所有者扣除非经常性损益后的净利润-8,300万元到-12,000万元，主要原因为：（1）新产品逐步 放量，其中电 ...

（一）业绩预告期间 2025年1月1日至2025年12月31日。 1、经财务部门初步测算，预计2025年度实现主营业务收入33,348.06万元，与上年同期相比增长 8.63%；2025年度实现归属于母公司所有者的净利润为-7,300万元至-11,000万元。 广州方邦电子股份有限公司 2025年年度业绩预告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 一、本期业绩预告情况 （二）业绩预告情况 证券代码：688020 证券简称：方邦股份 公告编号：2026-002 2、经财务部门初步测算，预计2025年度实现归属于母公司所有者扣除非经常性损益后的净利润-8,300 万元到-12,000万元。 以上预告数据仅为初步核算数据，具体准确的财务数据以公司正式披露的经审计后的2025年年度报告为 准，敬请广大投资者注意投资风险。 特此公告。 三、本期业绩变化的主要原因 （一）报告期内，公司主营业务收入较上年同期增长8.63%，主要是公司研发工作取得阶段性成果，相 关新产品逐步贡献收入，其中电阻薄膜（埋阻铜箔）报告期内首度实现量产 ...

南财智讯1月29日电，方邦股份发布年度业绩预告，预计2025年全年归属于上市公司股东的净利润 为-7300万元至-11000万元；预计2025年全年归属于上市公司股东的扣除非经常性损益的净利润为-8300 万元至-12000万元。本期业绩变化的主要原因：（一）报告期内，公司主营业务收入较上年同期增长 8.63%，主要是公司研发工作取得阶段性成果，相关新产品逐步贡献收入，其中电阻薄膜（埋阻铜箔） 报告期内首度实现量产，取得收入627.84万元，同比大幅增长；FCCL实现收入3893.6万元，同比增长 71.23%。（二）报告期内，公司预计实现归属于母公司所有者的净利润为-7300万元至-11000万元，实 现归属于母公司所有者扣除非经常性损益后的净利润-8300万元到-12000万元，主要原因为：（1）新产 品逐步放量，其中电阻薄膜（埋阻铜箔）销售额大幅增长，对公司利润形成一定贡献；FCCL产品销售 额同比增加71.23%，销售规模提升带动固定成本摊薄，FCCL业务亏损较去年同期有所收窄；（2）铜 箔业务结构持续优化，业务毛利亏损有所减少。其中可剥铜通过了相关代表性载板厂商和头部芯片终端 的量产认证，持续获得小 ...

证券日报网12月24日讯 ，诺德股份在12月23日回答调研者提问时表示，公司积极布局高端铜箔领域， HVLP铜箔、RTF铜箔生产难点主要体现在高端设备精度要求、复杂生产工艺及客户认证门槛高等方 面。公司凭借长期的技术积累和研发实力，已经从技术上成功突破了这些难点。因为AI催动的PCB需求 剧增，明年高端电子铜箔市场将面临显著缺货的局面。公司也在抓紧这个难能可贵的产业升级和国产替 代进口的机遇，加速进入这个市场。目前公司的RTF-3及HVLP-1/2的产品，已进入国内和台系的多家头 部厂商的供应链体系。HVLP-3/4的产品，也在送样测试阶段。公司现有的14万吨产能中，有3万吨是具 备高端电子电路铜箔生产能力的产能。 （文章来源：证券日报） ...

Core Viewpoint - Zhejiang Hailiang Co., Ltd. is actively engaging in investor relations, focusing on advancements in copper foil products, overseas market expansion, and developments in the heat dissipation sector [1][2]. Group 1: Copper Foil Product Development - The company has made significant progress in the research and development of copper foil products, including nickel-plated copper foil for solid-state batteries, porous copper foil, double-sided rough copper foil, and ultra-high tensile copper foil, achieving industry-leading standards and receiving positive feedback from top domestic and international battery cell manufacturers [2]. - In the high-end standard copper foil sector, the company has optimized the bonding between PCB embedded circuit layers and substrates through reverse roughening treatment of RTF copper foil, reducing signal loss, while HVLP copper foil meets ultra-high frequency requirements with extremely low surface roughness [2]. Group 2: Overseas Market Expansion - As the first Chinese copper foil factory to expand overseas, Hailiang's Indonesian facility is accelerating its international business development and has established deep cooperation with five of the top ten global power battery clients and two of the top three 3C digital clients, with supply agreements set to commence in 2026 [3]. - The company anticipates further strengthening its competitive edge in the international copper foil market through the progress of its Indonesian operations [3]. Group 3: U.S. Market Performance - The Texas base of the company is experiencing favorable operating conditions, with a steady development trajectory. The processing fees for copper products in the U.S. are showing differentiated increases due to varying demand across different products and customer segments [4]. - The company plans to accelerate capacity ramp-up at its Texas facility to meet local market demand while focusing on high-value-added product lines to enhance profitability in the U.S. market [4]. Group 4: Heat Dissipation Sector - The company is leveraging over thirty years of copper processing expertise to meet the growing demand for heat dissipation materials driven by the explosion of AI computing power and global demand for cooling solutions [5]. - The company is currently providing various products for data centers and AI computing, including self-developed heat pipe materials and oxygen-free copper, and plans to increase investment in the heat dissipation sector to explore more market opportunities [5].

Core Viewpoint - The company has achieved technological leadership in the lithium battery copper foil sector, with positive feedback from leading domestic and international battery cell manufacturers, and is set for stable mass delivery [1] Group 1: Product Development - The company has developed new types of copper foil products, including nickel-plated copper foil, porous copper foil, double-sided rough copper foil, and ultra-high tensile copper foil [1] - In the electronic circuit copper foil segment, RTF copper foil and HVLP copper foil have made breakthrough progress in the high-end market [1] Group 2: International Expansion - Indonesia Hailiang, as the first overseas copper foil factory from China, has signed supply agreements with 5 out of the top 10 global power battery customers and 2 out of the top 3 3C digital customers [1] - The cooperation agreements will commence in 2026 and will cover product specifications, quantities, and monetary amounts, which is expected to enhance the company's international competitive advantage in the copper foil business [1]

Core Insights - Nvidia has confirmed the use of M9-grade copper-clad laminates (CCL) in its new product Rubin, indicating a significant market opportunity in the CCL and PCB production sectors [1] Industry Overview - The M9-grade CCL production involves upstream raw materials, which are critical for the manufacturing of high-performance PCBs [1] Company Summaries - **Ping An Electric**: Market cap of 2.385 billion; positive feedback on quartz fabric products for AI servers, focusing on low dielectric constant and loss characteristics [1] - **International Composites**: Market cap of 8.862 billion; specializes in high-frequency applications [1] - **Honghe Technology**: Market cap of 33.850 billion; engaged in the development of ultra-thin quartz electronic fabrics [1] - **Philihua**: Market cap of 42.808 billion; ultra-thin quartz electronic fabric is in testing phase, expected to be a growth driver [1] - **China National Materials**: Market cap of 54.237 billion; largest producer of electronic fabrics with a focus on low dielectric materials [1] - **China Jushi**: Market cap of 64.250 billion; annual production capacity of 1.3 billion meters, specializing in low-Dk and ultra-thin fabrics [1] High-End Copper Foil - **Longyang Electronics**: Market cap of 5.150 billion; involved in HVLP5 series ultra-low profile copper foil production [2] - **Nord Shares**: Market cap of 11.435 billion; products include RTF for AI servers and high-end electronic circuit copper foil [2] - **Defu Technology**: Market cap of 13.274 billion; focuses on high-end copper foil domestic substitution [2] - **Hengtong Holdings**: Market cap of 13.533 billion; has mass-produced RTF and low-profile copper foils [2] - **Copper Crown Foil**: Market cap of 26.611 billion; HVLP4 copper foil has completed customer testing, with mass production expected in 2026 [2] Resin Production - **Shiming Technology**: Market cap of 3.494 billion; produces electronic-grade hydrocarbon resin with a capacity of 500 tons/year [2] - **Dongcai Technology**: Market cap of 18.774 billion; M9 resin has leading dielectric loss indicators [2] - **Shengquan Group**: Market cap of 24.768 billion; expanding electronic-grade hydrocarbon resin capacity to support AI server performance [2]

Group 1 - The company Hongtian Co., Ltd. (603800) confirmed on September 18 that its high-end copper foil equipment can be used for processing and producing RTF copper foil [1]

Core Viewpoint - The company is continuously improving its electronic circuit copper foil product matrix, which now covers a complete range from 9μm to 210μm, and is developing a 12oz ultra-thick copper foil to further extend the product thickness limit [1] Group 1 - The product matrix includes a complete range of thicknesses from 9μm to 210μm [1] - The company is developing a 12oz ultra-thick copper foil to extend the product thickness limit [1] - The maximum width of the products remains at 1,325mm, maintaining an industry-leading position [1] Group 2 - In the high-frequency and high-speed fields, RTF copper foil has already been supplied to customers [1] - HVLP copper foil is currently in the customer verification stage [1]

Group 1 - The company has continuously improved its electronic circuit copper foil product matrix, forming a complete product system covering thicknesses from 9μm to 210μm [1] - The company is developing a 12oz ultra-thick copper foil, which will further extend the upper limit of product thickness, while maintaining an industry-leading maximum width of 1,325mm [1] - In the high-frequency and high-speed field, RTF copper foil has been supplied to customers, and HVLP copper foil has entered the customer verification stage [1]