存储主控芯片
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江波龙:10月30日接受机构调研,富国基金、恒越基金等多家机构参与
Sou Hu Cai Jing· 2025-11-05 01:21
证券之星消息,2025年11月4日江波龙(301308)发布公告称公司于2025年10月30日接受机构调研,富国 基金、恒越基金、东北证券、国信证券、巴克莱参与。 具体内容如下: 问:如何看待存储涨价的幅度? 5、公司 UFS4.1 目前的进展情况如何?公司未来会在高端嵌入式领域取得多大的业务规模? 答:根据 CFM 闪存市场公布的信息,随着北美云服务商持续加码 I 投资,大规模 I 基础设施建设落地, HDD 供应已难以满足巨量数据存储需求,预计 HDD 将持续缺货并出现明显的供应缺口;云服务商纷纷 追加大容量 QLC SSD 订单,导致服务器市场需求远超原厂原先的供应预期;原厂产能转向服务器市场, 导致消费级及嵌入式存储供应收紧。根据CFM 闪存市场报道,9月至 10 月下旬,现货市场 512Gb TLC/1Tb TLC/QLC NND 普遍价格累计涨超近 40%。 2、晶圆涨价将如何影响公司的利润水平? 晶圆采购至存储器销售的生产周期间隔,决定了存储晶圆价格上行时对公司毛利率将产生正面影响,但原 材料价格波动仅为业绩结果的部分因素。近年来公司在企业级存储、高端消费类存储、海外业务以及自研 主控芯片等方面 ...
江波龙(301308) - 2025年10月30日-31日投资者关系活动记录表
2025-11-04 11:48
答:晶圆采购至存储器销售的生产周期间隔,决定了存 储晶圆价格上行时对公司毛利率将产生正面影响,但原材料 价格波动仅为业绩结果的部分因素。近年来公司在企业级存 储、高端消费类存储、海外业务以及自研主控芯片等方面持 续取得突破,内生性成长因素将更直接且持续地驱动公司盈 利能力的提升。 3、如果存储供应出现短缺,公司如何保障资源供应稳 定性? 深圳市江波龙电子股份有限公司 投资者关系活动记录表 编号:2025-028 | 投资者关系活动 | √特定对象调研 □分析师会议 □媒体采访 | | --- | --- | | 类别 | □业绩说明会 □新闻发布会 □路演活动 | | | √电话会议 □现场参观 □其他 | | 参与单位名称及 | 富国基金、恒越基金、东北证券、国信证券、巴克莱 | | 人员姓名 | | | | 2025 年 10 月 30 日 (周四) 下午 15:00-16:00 | | | 年 月 日 (周四) 下午 2025 10 30 16:00-17:30 | | 时间 | 2025 年 10 月 31 日 (周五) 上午 10:00-11:30 | | | 年 月 日 (周五) 下午 2025 ...
江波龙(301308) - 2025年10月29日投资者关系活动记录表
2025-10-31 10:52
深圳市江波龙电子股份有限公司 投资者关系活动记录表 编号:2025-027 | 投资者关系活动 类别 | □特定对象调研 □业绩说明会 | □分析师会议 □新闻发布会 | | □媒体采访 □路演活动 | | --- | --- | --- | --- | --- | | | □现场参观 | √电话会议 | | □其他 | | 参与单位名称及 人员姓名 | 详见附件 | | | | | 时间 | 年 月 2025 10 29 | 日 (周三) | 20:00~21:00 | | | 地点 | 电话会议 | | | | | 上市公司接待人 | 副总经理、董事会秘书 | 许刚翎 | | | | 员姓名 | 投资者关系经理 | 黄琦 | | | | | 1、近期存储涨价的原因以及幅度? | | --- | --- | | | 答:根据 CFM 闪存市场公布的信息,随着北美云服 | | | 务商持续加码 AI 投资,大规模 AI 基础设施建设正在落 | | | 地,但 HDD 已难以满足巨量数据存储需求,预计 HDD 将 | | | 持续缺货并出现明显的供应缺口;云服务商纷纷追加大 | | | 容量 QLC SSD 订 ...
预计未来90%的芯片公司会破产或重组!
是说芯语· 2025-08-21 03:03
Core Viewpoint - The Chinese semiconductor industry has faced significant adjustments since 2025, with many companies nearing bankruptcy or restructuring due to multiple pressures, including market saturation, technological shortcomings, and financial vulnerabilities [2][29]. Company Summaries 1. LiKeXin Semiconductor - Background: Former subsidiary of Datang Telecom, focused on smart IoT and smartphone SoC chip development - Dilemma: Filed for bankruptcy in July 2025 with debts exceeding 100 million yuan, unable to secure large-scale orders, and faced severe inventory backlog due to market saturation [2]. 2. Jianwenlu (Zhejiang) Semiconductor - Background: IDM model RF chip company targeting the 5G filter market - Dilemma: Entered bankruptcy review in July 2025 due to a 30% drop in production line utilization caused by declining global smartphone shipments and high operational costs [3]. 3. Times Chip Storage Semiconductor - Background: Planned to invest 13 billion yuan in a 12-inch storage chip wafer factory - Dilemma: Failed restructuring in June 2025 due to equipment payment defaults and plummeting storage chip prices [5]. 4. Sichuan Shangda Electronics - Background: FPC supplier with a 35% order growth in 2024 - Dilemma: Filed for bankruptcy in June 2025 due to delayed customer payments and external financing interruptions [8]. 5. Jiangxi Chuangcheng Microelectronics - Background: DSP chip design company supported by local government - Dilemma: Entered bankruptcy in April 2025 due to technological lag and fierce market competition [11]. 6. Xiangxin Integrated Circuit - Background: Leading power management chip packaging company in East China - Dilemma: Filed for bankruptcy in August 2025 due to a 40% revenue decline from customer concentration and order fluctuations [14]. 7. Paixin Semiconductor - Background: Focused on automotive-grade power device packaging - Dilemma: Filed for bankruptcy in June 2025 due to delayed technology implementation and cash flow issues [15]. 8. Juleicheng Semiconductor - Background: GaN epitaxial wafer and chip manufacturer - Dilemma: Filed for bankruptcy in May 2025 due to poor technology choices and equipment payment defaults [16]. 9. Lixin Chuangyuan Semiconductor - Background: Packaging company focusing on power management and MCU chips - Dilemma: Filed for bankruptcy in July 2025 due to delayed customer payments and external financing interruptions [17]. 10. Zhenjiang New District Zhenxin Semiconductor - Background: Chip testing company established in 2018 - Dilemma: Filed for bankruptcy in April 2025 due to equipment payment defaults and declining customer demand [19]. Industry Lessons 1. Technical Research Shortcomings - 80% of companies have R&D investment below 15%, significantly lower than international giants like TSMC [29]. 2. Financial Vulnerability - 90% of companies rely on external financing, with industry financing down 40% in 2025 [30]. 3. Market Demand Fluctuations - Continuous decline in smartphone shipments and high certification barriers in automotive electronics have pressured many companies [31]. 4. Supply Chain Constraints - Heavy reliance on imported equipment and materials poses significant risks, with less than 20% domestic production for equipment below 28nm [32]. 5. Strategic Management Errors - Companies often pursue blind expansion and have a concentrated customer base, leading to vulnerabilities [33]. Future Outlook - By the end of 2024, it is expected that 90% of chip companies will face bankruptcy or restructuring, with a significant concentration of market share among leading firms [35].
深康佳A联姻宏晶微电子告败 布局半导体八年营收仅占1.53%
Chang Jiang Shang Bao· 2025-06-11 23:43
Core Viewpoint - The company Shenkangjia A has decided to terminate its acquisition of 78% of Hongjing Microelectronics, which reflects ongoing challenges in its semiconductor business expansion efforts [1][2][3] Group 1: Acquisition and Restructuring - Shenkangjia A announced the termination of its plan to acquire Hongjing Microelectronics after nearly six months of restructuring efforts [2] - The acquisition was intended to enhance Shenkangjia A's semiconductor business and create synergies with its packaging and testing (封测) and PCB businesses [2][3] - The failure of this acquisition also signifies a setback for Hongjing Microelectronics in its attempt to go public through a backdoor listing [3] Group 2: Financial Performance - In 2024, Shenkangjia A's semiconductor and storage chip business generated revenue of 170 million yuan, a significant decline of 94.99% year-on-year, accounting for only 1.53% of total revenue [1][7] - The company has reported continuous net losses for 14 consecutive years, with a net loss of 3.296 billion yuan in 2024 [4][6] - In the first quarter of 2025, Shenkangjia A achieved revenue of 2.544 billion yuan, a year-on-year increase of 3.32%, but still reported a net loss of 94.81 million yuan [4] Group 3: Semiconductor Business Development - Shenkangjia A has been developing its semiconductor business since 2018, but it has not yet achieved the expected results after nearly eight years [1][6] - The company has made investments in Micro LED technology and has seen some progress in Mini LED product sales, but the semiconductor business remains in the early stages of industrialization [7][8] - The semiconductor business's revenue has fluctuated significantly, with 2023 revenue dropping to 3.397 billion yuan, a decrease of 67.37% year-on-year [7]