Core Viewpoint - The announcement by Daoshi Technology regarding its strategic cooperation and joint venture with Hunan Peisen Electronic Technology Co., Ltd. marks a significant step in optimizing their collaboration in the AI and materials sector [3][4] Group 1: Strategic Cooperation and Share Transfer - Daoshi Technology has signed a share transfer agreement to sell its 50% stake in the joint venture Guangdong Turing Daosen Technology Co., Ltd. for 5 million yuan, which will no longer be included in Daoshi Technology's consolidated financial statements [3] - The joint venture was established following a strategic cooperation agreement signed on November 8, 2024, with a registered capital of 10 million yuan, where Daoshi Technology contributed 5 million yuan for a 50% stake [3] Group 2: Business Focus and Synergy - The share transfer is part of the company's strategy to anchor its "AI + materials" approach, focusing on resource optimization and collaboration [4] - Both Turing Daosen and Chip Peisen serve as strategic platforms for AI atomic computing, with Chip Peisen focusing on the development and sales of computing chips and servers, while Turing Daosen provides AI-driven research and development services for new energy materials [4] Group 3: Technological Advancements and Future Plans - Chip Peisen has achieved significant milestones, including the successful verification of its self-developed APU chip, which shows advantages in computing power and energy consumption in core calculation scenarios [4] - The transaction aims to enhance cooperation in the AI atomic computing field and establish a closed-loop ecosystem of "chip-algorithm-scenario" through Chip Peisen, accelerating the commercialization of related technologies [4]

Core Viewpoint - Del Shares has announced the completion of the "Automotive Electronics (Intelligent Control System) Industrialization Project" and will allocate the remaining funds of 26.34 million yuan to a new project, the "Mechatronic Automotive Component Technological Transformation Project" [2][3] Group 1: Project Completion and Fund Allocation - The board of Del Shares approved the conclusion of the previous fundraising project, with a total investment of 38.56 million yuan planned for the automotive electronics project, which aimed to add an annual production capacity of 300,000 sets of controllers [2] - The actual investment in the automotive electronics project reached 12.49 million yuan, with the project nearly completed except for some equipment payments [2] - The remaining funds of 26.34 million yuan will be fully invested in the new mechatronic project, which has a total investment of 41.03 million yuan [3] Group 2: New Project Details - The mechatronic project will be implemented by the parent company of Del Shares and is located in Fuxin City, focusing on the technological transformation of existing production lines for motors, pumps, and mechanical pumps [3] - The project is expected to enhance automation levels, production flexibility, and the self-manufacturing rate of components, thereby improving the core competitiveness of the products [3] - The core products, including motors and pumps, generated revenues of 1.21 billion yuan and 596 million yuan for the years 2024 and the first half of 2025, respectively, accounting for 26.84% and 24.42% of total revenue [3]

诺基亚强调，此次收购旨在"优化其在中国的所有权结构"并"简化其在中国的所有权结构"。完成全资控股后，诺基亚贝尔将完全 并入诺基亚的全球运营体系，与其全球战略和管理模式保持一致。这意味着诺基亚在华业务的决策链条将更为顺畅，有利于资源 整合与效率提升。 诺基亚贝尔的前身上海贝尔股份有限公司成立于1984年，是中国第一家中外合资通信企业，股权结构长期为中外各持50%左右 （诺基亚方多1股）。2017年，诺基亚完成对阿尔卡特朗讯的收购后，将其在华业务与上海贝尔整合，成立了上海诺基亚贝尔股份 有限公司，作为其在华的独家运营平台。 根据股权转让时披露的财务信息，诺基亚贝尔2024年实现营收83.91亿元，净利润4209.29万元；2025年前三季度营收46.06亿元， 净利润显著增长至9046万元。截至2025年9月30日，公司总资产达115.69亿元，净资产69.51亿元，为此次股权交易提供了明确的估 值基础。 在全球5G网络建设高峰期渐过、地缘政治环境复杂的背景下，诺基亚此番全资控股在华核心运营实体，被业界视为对中国市场的 长期信心和战略加码。 近日，诺基亚宣布，已于2025年12月12日完成收购中国华信邮电科技有限 ...

Core Viewpoint - The company announced an investment of 600 million yuan in a new automotive lightweight components production base in Chongqing, focusing on the production of lightweight parts for new energy vehicles and automation solutions for the automotive sector [2][3] Group 1: Project Details - The project will be located in the Shapingba District of Chongqing, covering an area of approximately 119 acres [2] - The production capacity is planned to reach 11 million pieces annually upon completion [2] - The construction timeline includes obtaining construction permits within 3 months after acquiring land use rights and completing the project within 15 months [2] Group 2: Collaboration and Compliance - The company will collaborate with Chongqing Shared Industrial Investment Co., Ltd., which will assist in providing necessary infrastructure and support for the project [2] - The company is required to acquire land use rights through legal bidding processes and is responsible for all related costs [3] - The agreement stipulates strict adherence to environmental regulations, with penalties for non-compliance [3] Group 3: Strategic Importance - This investment aligns with the company's core business and national industrial policies, aiming to enhance competitiveness and meet customer demands in the lightweight automotive parts sector [3] - Successful implementation of the project is expected to have a positive long-term impact on the company's business development [3]

据了解，原合同签署于2024年8月26日，HDI拟向四川阿尔特采购专用混合动力变速器产品（DHT），合同总金额预计不低于人民币14.51亿元（不含税）， 曾被视为阿尔特拓展海外业务的重要举措。 此次签署的《终止协议》明确，自协议生效之日起，原合同终止履行，双方不存在任何争议或潜在争议，互不承担违约责任，亦无未了结的债权债务关系 （如有相关权利双方均予以放弃）。同时，原合同项下所有设备、技术文件及商业信息已按约定归还或销毁，包括保证、保密、知识产权等在内的衍生义务 也已终止，双方不再基于原合同提出任何索赔主张。 12月15日，阿尔特发布公告称，其控股子公司四川阿尔特新能源汽车有限公司（以下简称"四川阿尔特"）与HDI TRADING CO., LIMITED（以下简 称"HDI"）正式签署《终止协议》，双方一致同意终止此前签署的专用混合动力变速器产品（DHT）采购合同，此次合同终止系受HDI最终客户所在地区市 场环境影响，经友好协商后达成一致。 关于《终止协议》的争议解决条款，公告显示，协议受新加坡法律管辖及解释，若双方就协议相关争议未能在30日内友好协商解决，将提交国际商会国际仲 裁院按规则进行仲裁，仲裁地为 ...

Core Viewpoint - Company has officially received a bid notification confirming its status as the winning bidder for a project involving multiple systems, marking a significant advancement in project progression [2] Group 1: Project Details - The project awarded to the company includes the chip mold tooling XX system, tooling XX system, and human-machine remote collaboration XX system (medium) [2] - The total amount of the awarded project is 27,502,100 yuan [2] Group 2: Company Capabilities - Company asserts it has the necessary funding, personnel, technology, and production capacity to successfully execute the awarded project [2] - The successful signing of the contract and implementation of the project is expected to have a positive impact on the company's future operating performance [2] Group 3: Next Steps - Company plans to promptly sign a formal contract with the bidding enterprise as per the requirements of the bid notification [2] - Specific project details and implementation arrangements will be determined based on the final signed contract [2]

自成立以来，公司持续深耕GPU产品技术创新与迭代，构建了具备自主优势的GPU产品体系及开放的软件生态，为云端计算提供高能效、高通用性算力支 持。目前，沐曦股份已在教科研、金融、交通、能源、医疗健康、大文娱等多个行业实现应用布局，成为推动我国智能算力基础设施自主可控进程的重要力 量。 作为国内高性能GPU领域的领军企业之一，沐曦股份以"不负历史，为民族复兴、国家强盛贡献科技力量"为使命，持续打造具有行业竞争力的GPU核心产 品，助力数字经济发展。 GPU作为现代信息技术的底层基础设施，技术门槛高、迭代速度快，对企业自主研发能力与持续创新提出严苛要求。长期以来，我国算力基础设施市场由境 外厂商主导，国产替代空间广阔。近年来，在地缘政治摩擦加剧与新一代人工智能浪潮的双重背景下，以沐曦股份为代表的国内GPU企业积极投入产品研发 与技术突破，逐步打破国外垄断，不断提升市场份额，推动我国人工智能产业链在底层算力领域实现自主可控，为新质生产力发展注入强劲动力。 沐曦股份始终以推动智能算力产业链自主可控为目标，长期聚焦GPU与人工智能领域，组建了一支具备全球视野、掌握顶尖GPU技术及全流程量产经验的核 心研发团队。通过持续技 ...

Core Viewpoint - Angrui Microelectronics Technology Co., Ltd. has successfully listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board, with a significant initial stock price increase, indicating strong market interest and confidence in the company's growth potential in the RF communication sector [1][2]. Group 1: Company Overview - Angrui focuses on the RF communication field, offering a comprehensive range of RF front-end chip products for smart mobile terminals, including 5G/4G/3G/2G front-end modules and power amplifiers [1][3]. - The company has achieved mass production of various RF front-end modules, breaking the monopoly of international manufacturers and establishing itself as an industry leader in 5G RF front-end modules [3][4]. Group 2: Product Offerings - Angrui's core product lines include RF front-end chips designed using multiple processes such as GaAs, CMOS, and SiGe, covering various communication standards [3]. - The company has developed high-performance, low-power RF SoC chip products, including low-power Bluetooth and 2.4GHz private protocol chips, which are essential for IoT applications [5][6]. Group 3: Market Applications - Angrui's RF front-end chips are widely adopted by major brands such as Honor, Samsung, Vivo, Xiaomi, and OPPO, demonstrating strong market penetration and customer trust [4][6]. - The company has also introduced satellite communication products and automotive RF front-end chips, achieving mass production for high-end mobile terminal customers and passing automotive-grade certification [4]. Group 4: Technological Advancements - Angrui has received awards for its innovative technologies, including the "China Chip" Excellent Technology Innovation Product Award, highlighting its commitment to technological excellence [3][6]. - The company actively collaborates with domestic suppliers to develop and validate local RF supply chains, contributing to the localization of the RF industry [6].

景嘉微表示，诚恒微CH37系列的顺利点亮，是公司与诚恒微集中优势资源、协同推进核心技术自主研发与产业化落地的重要成果。这不仅将进一步丰富公 司和诚恒微的产品线与核心技术储备，更有助于拓宽产品应用场景，服务更广泛的客户领域。 在当前人工智能向边端侧加速渗透的产业浪潮下，诚恒微CH37系列的突破，被视为景嘉微深化"GPU+边端侧AISoC芯片"产品矩阵、响应国家科技自立自强 战略的关键一步。该芯片旨在为具身智能、边缘计算等前沿应用提供高能效、自主可控的算力引擎。 强劲AI算力：提供高达64TOPS@INT8的峰值AI算力，为复杂的视觉识别与多模态感知模型在设备端侧实时运行提供了充沛动力。 灵活高效处理：支持混合精度计算，兼顾了算法开发的灵活性与推理效率；同时具备高实时性与低延迟特性，确保快速精准的决策执行。 多传感融合优化：芯片架构专为多传感器（如视觉、雷达）融合场景深度优化，能高效协同处理多元数据，构建统一的实时环境感知能力。 12月15日，景嘉微发布公告称，公司控股子公司无锡诚恒微电子有限公司（以下简称"诚恒微"）自主研发的边端侧AISoC芯片CH37系列，已顺利完成流 片、封装、回片及成功点亮等全部关键流程 ...

Core Viewpoint - The China Securities Regulatory Commission has disclosed the IPO guidance report for Tongchuang Purun New Materials Co., Ltd., marking a significant step for the company in the semiconductor key materials sector as it seeks to enter the capital market for broader development opportunities [1] Company Overview - Tongchuang Purun was established in December 2012 by Dr. Yao Lijun, the founder and CTO of Jiangfeng Electronics, along with a team of high-level talents returning from overseas [3] - The company focuses on the research, development, and production of high-purity (5N, 6N, and above) metal materials used in integrated circuit manufacturing, having developed a fully autonomous core technology system [3] Technological Achievements - After over a decade of efforts, Tongchuang Purun has built a complete and controllable industrial chain from raw material purification to product application, with a modern advanced production line [3] - The product line includes ultra-high-purity aluminum, tantalum, copper, manganese, and various key alloy materials, achieving international advanced technical standards [3] - The company has broken the long-standing reliance on imports in the high-end high-purity metal materials sector in China and has become one of the few Chinese companies capable of providing key high-purity metal materials for the most advanced 3nm process chips globally [3] Market Position - High-purity metal materials are foundational for strategic emerging industries such as semiconductor chips, display panels, aerospace, and new energy, with high technical barriers historically dominated by a few US and Japanese companies [3] - Tongchuang Purun has transitioned from a follower to a peer and even a leader in certain areas due to its strong technical accumulation and continuous innovation investment [3] Strategic Partnerships - As an important partner and core supplier to Jiangfeng Electronics, Tongchuang Purun has successfully integrated several ultra-high-purity metal sputtering targets into the supply chains of top global wafer manufacturers, widely used in high-end electronic products like AI chips [4] - The collaboration has resulted in a global market share exceeding 40% for the jointly developed ultra-high-purity aluminum, copper, and manganese targets, ranking first in the world [4] Financial Developments - The company completed a Pre-IPO financing round exceeding 1 billion RMB in October, attracting notable industry investors such as Shangqi Capital and SAIC Capital, which will support further investment in core technology R&D, accelerate technological iteration and industrial upgrades, and expand market applications [4] - The founder, Dr. Yao Lijun, holds 17.61% of the company's shares, making him the controlling shareholder [4] IPO Significance - The initiation of the IPO guidance is a significant milestone in the development of Tongchuang Purun, especially against the backdrop of profound adjustments in the global semiconductor industry and the increasing demand for supply chain autonomy [4]