Core Viewpoint - The acquisition of Lijing Technology by Shangluo Electronics is a strategic move to enhance market share and operational efficiency in the semiconductor distribution sector, aligning with the company's long-term development strategy [3][19][20]. Group 1: Company Overview - Lijing Technology, established in 1999, specializes in providing chip solutions for industrial and automotive electronics, with a significant portion of its revenue coming from IC value-added distribution [5][12]. - In 2019, Lijing Technology reported a revenue of 1.887 billion yuan, with IC value-added distribution accounting for 83.25% of its total revenue [5]. - Shangluo Electronics, founded in 1999, has evolved from passive component distribution to a balanced business model that includes both active and passive electronic components, with a revenue of 5.103 billion yuan in 2023 [10][11][15]. Group 2: Financial Performance - Shangluo Electronics' revenue grew from 2.068 billion yuan in 2019 to 5.103 billion yuan in 2023, with a projected increase to 6.546 billion yuan in 2024, reflecting a growth rate of 28.27% [15][18]. - Lijing Technology's revenue structure shows a significant reliance on NXP, which accounted for over 50% of its procurement from 2017 to 2020 [7][12]. - In 2023, Shangluo Electronics reported a net profit of 71 million yuan, a substantial increase of 108.28% year-on-year, despite facing pricing pressures in the industry [18]. Group 3: Strategic Rationale for Acquisition - The acquisition aims to leverage synergies between Shangluo Electronics and Lijing Technology, enhancing their distribution capabilities and expanding their customer base [19][20]. - The move aligns with Shangluo's strategy of growth through acquisitions, as seen in previous investments in companies focused on automotive electronics and domestic chip production [20]. - Lijing Technology's previous unsuccessful IPO attempts may have prompted its shareholders to consider selling equity to secure a more stable financial future [21].

| 品牌 | 케틱 | 数量 | 年份 | | --- | --- | --- | --- | | TI | TPS78230DRVR | l રાજ | 24+ | | TI | TLV70218DBVR | 12000pcs | 24+ | | 博通 | BCM5338MKQMG | 165pcs | 12+及11+ | | TI | BQ25890RTWR | 3k | 22+ | | TI | BQ25892RTWR | 9k | 21+ | | | | | 3-7 天 | | NXP | FS32K144HAT0MLHT | ર00 | 21+ | | NXP | TJA1101AHN/0Z | 8000 | 22+ | | NXP | TJA1145T/FDJ | 7500 | 22+ | | NXP | TJA1042TK/3/1J | 3000 | 22+ | | NXP | TJA1028TK/5V0/20/1 | 6000 | 22+ | | NXP | FS32K142HAT0MLHT | 1 ୧୦୦ | 22+ | | NXP | MT53D1024M32D4DT-046 | ર00 ...

我是芯片超人花姐，入行20年，有50W+芯片行业粉丝。 有很多不方便公开发公众号的， 关于芯片买卖、关于资 源链接等， 我会分享在朋友圈 。 扫码加我本人微信 2 、 2 场深度沙龙，助力链接当地资源 从去年开始，越来越多的芯片人开始把目光投向海外市场。在技术创新与本土竞争趋于白热化的背 景下， "出海" 成为产业升级与持续增长的新选项。 但芯片人想要做到真正出海并不容易，背后需要对终端市场、区域法规、技术趋势与产业节奏的真 正理解，真正看清趋势、理解产业、建立链接，比 "走出去"本身更重要。 因此， 9 月 4 日至 9 月 14 日 ，芯片超人决定开启 "挖掘欧洲电子领域芯动向" 德国商 务考察活动 ，实地走访德国 柏林、莱比锡、德累斯顿、斯图加特以及慕尼黑 五个城市，重点聚 焦 全球两大顶级展会： IFA 柏林国际消费电子和家电产品展览会 与 IAA 德国国际汽车及 智慧出行博览会 （简称"慕尼黑车展"） ，带大家一起走进欧洲电子产业的最前沿，实地理解消 费电子与汽车电子的真实需求与发展方向。 IFA ，源于 1924 年，作为 世界上规模和影响力最大的国际视听及消费类电子产品展览会之一 ，上一届 IF ...

Core Viewpoint - The article provides a detailed teardown of the Black Hawk 2Si-12 controller used in the Green Horse electric vehicle, highlighting its components, design, and manufacturing quality. Group 1: Product Specifications - The controller operates at a voltage of 72V and a current of 32A, with the product launched in June 2021 [2]. - The main control chip is the AT32F421C8T7 from Yateli, indicating a shift towards domestic 32-bit MCUs in the market [36]. Group 2: Design and Construction - The controller features a C-shaped aluminum alloy shell with a well-executed potting process for waterproofing [11][14]. - The PCB design integrates power and signal management on a single board, utilizing floating copper busbars for power distribution [22]. Group 3: Component Analysis - The controller uses two 330uF 100V electrolytic capacitors for power input [27]. - The MOSFETs are from China Resources Microelectronics, specifically the SKD503T model, with a VDS rating of 100V and Rdson of 3.6mΩ [31]. - The DC-DC buck converter is a SD4938 from Silan Micro, designed for switch-mode power supply applications [38]. Group 4: Market Context - The article notes the increasing use of domestic components in the wake of supply shortages and price hikes over the past 20 years, reflecting a trend towards localization in the semiconductor industry [36][44].

Core Viewpoint - The article emphasizes the importance of exploring overseas markets for the chip industry, particularly in Europe, as a strategy for industry upgrade and sustained growth amidst intense domestic competition and technological innovation [3]. Group 1: Overview of the European Market Exploration - Since last year, an increasing number of chip professionals have shifted their focus to overseas markets, with "going abroad" becoming a new option for industry growth [3]. - A business investigation activity titled "Exploring European Electronic Trends" is scheduled from September 4 to September 14, focusing on key cities in Germany and major exhibitions like IFA and IAA [3][4]. Group 2: Key Events and Activities - IFA, one of the largest international consumer electronics exhibitions, attracted over 1,800 exhibitors and more than 210,000 visitors from 138 countries in its last edition, with AI being a significant theme [4]. - IAA, one of the top five auto shows globally, had 750 exhibitors from 38 countries and over 500,000 visitors, covering the entire automotive supply chain [4]. - The itinerary includes deep-dive salons and visits to renowned companies and universities, enhancing local resource connections [5][6]. Group 3: Itinerary Highlights - The itinerary includes visits to five key German cities: Berlin, Leipzig, Dresden, Stuttgart, and Munich, each representing significant industrial characteristics [7]. - The schedule features visits to major exhibitions, local enterprises, and cultural sites, providing a comprehensive understanding of the German industry landscape [15][16][18][19]. Group 4: Previous Experience and Networking - The organization has conducted multiple business investigations in Germany since 2018, optimizing itineraries based on feedback from industry participants [10]. - Previous events have successfully facilitated networking among industry leaders, including major manufacturers and investment institutions [6][12].

Core Insights - The company "Chip Superhero" operates a 1,600 square meter intelligent chip storage base with over 1,000 stock models and a total inventory of 50 million chips valued at over 100 million [1] Group 1: Inventory and Services - The company has a diverse inventory with over 100 brands and a total weight of 10 tons [1] - It serves over 8,000 users by providing inventory listings, demand matching, and trading of surplus materials [4] Group 2: Procurement and Sales - The company is actively seeking specific chip models, including ADI and Microchip products, with quantities ranging from 2,000 to 20,000 units [2] - It offers advantageous materials for sale at special prices, including various brands and models with quantities from 60 to 100,000 [3] Group 3: Market Trends - The article hints at ongoing trends in the chip market, including the impact of tariffs and price increases from major manufacturers like TI and ADI [7]

Core Viewpoint - The article emphasizes the importance of the Japanese semiconductor industry, highlighting its strengths in upstream semiconductor materials and equipment despite its relatively low profile in the global market [4]. Industry Overview - Since Trump's administration, high-intensity tariff policies have significantly impacted the global semiconductor supply chain, leading to increased focus on Asian semiconductor industries, including those in China, Japan, and South Korea [3]. - Japan's semiconductor industry, while understated, maintains a dominant position in several key categories of semiconductor materials, with Japanese companies leading in three out of five categories in a new survey for 2024 [4]. Market Position - In the field of photoresists, Tokyo Ohka Kogyo holds a 22.8% market share, with leading Japanese companies collectively accounting for 75.9% of the market [4]. - Shin-Etsu Chemical leads the silicon wafer market with a 24.7% share, while three Japanese companies monopolize the photomask substrate market [4]. Technical Expertise - The semiconductor materials and equipment market is characterized by smaller market sizes and lower profit margins, but it requires high technical expertise. Japan's "artisan spirit" and emphasis on fundamental research have created a unique monopolistic barrier in this field [4]. Event Participation - SEMICON Japan is highlighted as a crucial event for those looking to gain deeper insights into the Japanese semiconductor industry. It is recognized as one of the most influential semiconductor industrial exhibitions globally and in Asia [5]. - The upcoming SEMICON Japan 2025 will feature participation from over 1,100 companies and organizations from 35 countries, with a significant number of local Japanese enterprises [5]. Business Exploration - The company plans to organize a six-day business exploration trip to Japan, focusing on SEMICON Japan 2025, which includes visits to notable semiconductor companies and universities to explore opportunities within the Japanese semiconductor industry [5][8]. - The exploration aims to facilitate efficient connections between local semiconductor enterprises and participants, enhancing collaboration opportunities [7]. Experience and Optimization - The company has extensive experience in organizing overseas business explorations, having led over a hundred executives to various countries, including Vietnam, India, Germany, Japan, the UK, and South Korea, since early 2018 [9][12]. - Continuous optimization of the exploration itinerary is based on feedback and deep engagement with industry stakeholders, ensuring a rich and professional experience for participants [9].

Core Insights - The article highlights the current inventory status and capabilities of a chip distribution company, emphasizing its extensive stock and quality control measures [1]. Group 1: Inventory and Capabilities - The company operates a 1,600 square meter smart warehouse with over 1,000 stock models and around 100 brands, totaling 50 million chips with a weight of 10 tons and a value exceeding 100 million [1]. - An independent laboratory is established in Shenzhen for quality control (QC) inspections on every material [1]. Group 2: Purchase Requests - The company is actively seeking specific components from various brands, including BEL FUSE, ADI, and Infineon, with quantities ranging from 500 to 50,000 units [2]. Group 3: Special Offers - The company is offering advantageous materials for sale, including various models from TI and NXP, with quantities from 165 to 27,500 units, and ages ranging from 11+ to 24+ years [3]. Group 4: Market Trends - The article suggests a focus on factory surplus materials as a potential revenue stream [4].

Core Insights - The article discusses significant developments in the semiconductor industry, including production statistics, market trends, and strategic initiatives by major companies and governments [8][9][10][11][12][14][16]. Industry Developments - Major EDA companies have suspended services to Chinese semiconductor firms, prompting a response from the Chinese Ministry of Commerce regarding the impact of U.S. restrictions [10][11]. - China's Ministry of Industry and Information Technology reported a 6.8% year-on-year decline in mobile phone production for the first four months of the year, while integrated circuit production increased by 5.4% [9]. - TSMC plans to establish a chip design center in Munich, Germany, aimed at supporting high-performance chip designs for various applications [10][13]. - Renesas Electronics has abandoned its plans for SiC power chip production due to declining demand in the electric vehicle market [10][16]. Market Trends - TrendForce forecasts a slowdown in DRAM price increases by Q3 2025, with current NAND flash prices stabilizing after a recent rise [18]. - Japan's semiconductor equipment sales reached a record high in April, with a 14.9% year-on-year increase, indicating strong demand in the sector [11]. - China's semiconductor equipment spending is projected to reach $49.55 billion in 2024, a 35% increase from the previous year, solidifying its position as the largest market for semiconductor equipment globally [12]. Company-Specific Updates - NVIDIA reported a 69% year-on-year revenue increase for Q1 2026, but anticipates a significant revenue drop due to U.S. export restrictions on AI chips to China [14]. - AMD is developing a chip for Sony's next-generation PlayStation Portable, potentially utilizing Samsung's 2nm process technology [15]. - Marvell's Q1 revenue reached a record $1.895 billion, reflecting a 63% year-on-year growth driven by strong demand in data center operations [16]. Technological Innovations - Cerebras Systems launched the world's largest chip, the Cerebras WSE, which boasts a processing speed significantly faster than NVIDIA's offerings [19]. - AMD acquired the silicon photonics startup Enosemi to enhance its capabilities in high-performance interconnect innovations [16].

Core Viewpoint - The article provides a detailed overview of the traditional packaging process in semiconductor manufacturing, highlighting the various steps involved and the technologies used in each stage. Group 1: Traditional Packaging Process - The traditional packaging process begins with thinning the wafer, reducing its thickness from 600-800μm to tens to a hundred μm for better heat dissipation and electrical performance [8][9]. - Cutting the wafer involves applying a protective blue film and using advanced techniques like laser cutting, which offers higher precision compared to mechanical cutting [10][11]. - The die attach process connects the die to the substrate using various methods, including adhesive bonding, soldering, and eutectic bonding, with epoxy resin being a common adhesive [13][14][16]. Group 2: Electrical Connection and Testing - Wire bonding is used to establish electrical connections between the die and the substrate, utilizing materials like gold, silver, copper, and aluminum [19][17]. - After bonding, the components undergo cleaning and inspection, often using Automatic Optical Inspection (AOI) for high efficiency and defect detection [21][24][25]. - The final steps include molding, de-flashing, post-mold curing, and final testing to ensure the functionality and quality of the packaged chips before shipping [28][36][37]. Group 3: Packaging Materials and Techniques - Packaging can be categorized into plastic, ceramic, and metal types, with plastic packaging being the most common due to its cost-effectiveness and lightweight properties [28]. - The use of epoxy molding compound (EMC) is prevalent in plastic packaging, providing protection against environmental factors [28]. - The process also includes the application of solder balls for BGA packaging and the use of lead-free plating to meet regulatory standards [33][34].