Core Insights - The article highlights the collaboration and competition among four major chip companies: NVIDIA, Intel, AMD, and Qualcomm, during the Lenovo Tech World event, emphasizing the evolving landscape of the AI industry [2] - A new partnership between Lenovo and NVIDIA aims to quadruple their business collaboration over the next three years, focusing on AI infrastructure and deployment [3][4] - The shift from traditional computing to AI-driven applications is reshaping the IT industry, with an estimated investment of $10 to $15 trillion needing upgrades to accommodate new AI architectures [4] Group 1: Collaboration and Partnerships - Lenovo and NVIDIA announced a new initiative called "Lenovo AI Cloud Super Factory," which aims to standardize AI infrastructure and streamline AI deployment for clients [5] - This collaboration is expected to help cloud service providers reduce the "time to first token" for AI deployment and scale up to 100,000 GPUs [7] - Lenovo will also be one of the first adopters of AMD's Helios AI platform, indicating a strategic partnership to address enterprise needs for local inference and data security [8] Group 2: Industry Trends and Innovations - NVIDIA's focus is on GPU-accelerated computing, while AMD emphasizes system-level architecture, showcasing the need for a comprehensive computing ecosystem rather than a single chip solution [8] - Intel's new AI PC, Aura Edition, represents a shift in the traditional PC market towards AI integration, highlighting the convergence of legacy computing systems with new AI paradigms [9] - Qualcomm is targeting AI-native endpoints, collaborating with Lenovo to develop wearable devices that function as "personal intelligent companions," indicating a trend towards low-power, always-connected devices [10] Group 3: Market Potential and Future Outlook - The wearable device market is projected to exceed one billion units, showcasing significant growth potential in this segment [11] - The article emphasizes that the true value of AI lies not in having the most powerful chip but in the ability to transform computing power into usable capabilities for businesses and consumers [11]

Core Insights - The 2026 International Consumer Electronics Show (CES 2026) has commenced in Las Vegas, where Lenovo is hosting its TechWorld innovation conference [1] - Lenovo's Chairman and CEO Yang Yuanqing announced a collaboration with NVIDIA to launch the "Lenovo AI Cloud Super Factory" plan, aimed at significantly reducing the "time to first token" for AI deployment [1] - The plan will enable cloud service providers to rapidly scale up to 100,000 GPUs, supporting trillion-parameter-level intelligent agents and large language models [1] - NVIDIA's accelerated computing platform, including the newly released next-generation training and inference system, NVIDIA Vera Rubin, will provide robust support for this initiative [1]

Core Viewpoint - The article highlights the collaboration and competition among major chip manufacturers, including NVIDIA, Intel, AMD, and Qualcomm, during the Lenovo Tech World event, emphasizing the shift in the AI landscape from training to inference and the need for integrated systems that can leverage diverse computing power [3][4]. Group 1: Collaboration and New Opportunities - NVIDIA's CEO Jensen Huang and Lenovo's Chairman Yang Yuanqing aim to quadruple their business collaboration over the next three years, reflecting a long-standing partnership that has evolved through various technological shifts [5][6]. - The collaboration focuses on the "Lenovo AI Cloud Super Factory," which aims to standardize AI infrastructure, transforming highly customized AI deployments into industrialized solutions [6][8]. - This partnership is expected to help cloud service providers reduce the "time to first token" for AI deployment and scale up to support trillion-parameter models [8]. Group 2: Competitive Landscape - AMD's CEO Lisa Su introduced the Helios rack-level AI platform, positioning it as a challenge to NVIDIA's GPU-centric approach, emphasizing the need for robust system-level infrastructure to support larger models and higher throughput [10][11]. - Intel's new CEO Pat Gelsinger announced the Aura Edition AI PC, showcasing a shift from traditional PCs to AI-enhanced computing experiences, indicating a blend of legacy computing with new AI paradigms [11]. - Qualcomm's CEO Cristiano Amon focused on AI-native endpoints, highlighting the evolution of wearable devices into "personal intelligent companions," which aligns with Lenovo's strengths in ecosystem and global channels [12]. Group 3: Industry Trends and Insights - The article notes that the market for wearable devices is expected to exceed one billion units, indicating significant growth potential in this segment [13]. - The collaboration among the four chip giants illustrates a new industry consensus that the true value of AI lies not in having the most powerful chip, but in the ability to transform computing power into usable capabilities for businesses and users [13].

Core Viewpoint - Lenovo (Singapore) Private Limited has applied for a patent for an electronic device designed to suppress the surface temperature of its casing, indicating a focus on thermal management technology in electronic devices [1]. Group 1: Patent Details - The patent, titled "Electronic Device," has a publication number CN121277313A and was filed on June 2025 [1]. - The device features a casing with a protruding part from the bottom surface and an exhaust port located on the side surface, which allows for an expansion of the internal space towards the protruding direction [1]. Group 2: Technical Specifications - The electronic device includes a substrate with a heating element, where one edge is oriented towards the exhaust port [1]. - A cooling module is incorporated, featuring a fan with an outlet to cool the heating element [1]. - A partition separates the upper and lower air flow paths between the substrate's edge and the exhaust port, facilitating efficient airflow management [1].

Group 1 - Lenovo Group held its largest Tech World event in history at CES 2026, showcasing the world's first personal AI super-intelligent agent, Lenovo Qira, and a new inference-optimized server product lineup [1][2] - The company aims to accelerate the global adoption of AI through a hybrid AI approach, integrating personal, enterprise, and public intelligence to meet diverse user needs [1][3] - Lenovo's partnership with NVIDIA led to the launch of the "Lenovo AI Cloud Super Factory" initiative, designed to significantly reduce AI deployment time and scale up to 100,000 GPUs [4] Group 2 - Lenovo Qira serves as a cross-platform AI terminal that connects various devices, remembers user preferences, and interacts in a personalized manner while ensuring privacy [2] - The newly released inference-optimized server products, including SR675i, SR650i, and SE455i, aim to enhance inference efficiency and data security for enterprise AI deployments [2] - The "2026 World Cup AI Action Plan" was introduced to demonstrate how hybrid AI can empower major sports events, providing a reference model for future applications in various industries [3] Group 3 - The Football AI Pro can efficiently retrieve and analyze vast amounts of data (603,138 entries) to assist coaches, players, and analysts in tactical decision-making [3] - NVIDIA's CEO highlighted the rapid expansion of AI model scales and the need for cloud service providers to accelerate their AI deployment capabilities [4]

快科技1月7日消息，在CES 2026上的众多概念设备中，最引人注目的无疑是联想Legion Pro Rollable横 向卷轴屏笔记本。 这是一款基于Legion Pro 7i打造的概念性产品，打破了传统屏幕尺寸的物理限制，搭载了全球首创的16 英寸横向可伸缩柔性显示屏。 其采用双电机及张力调节设计，屏幕可从两端平滑展开，用户可以在 16 英寸、21.5 英寸及 24 英寸三种 规格间自如切换，按两次键会跳过中间模式，完全扩展或收缩屏幕。 从侧面观察，即使作为一款原型机，联想在消除屏幕展开时可能出现的大间隙或空隙方面也做得相当出 色。 LEGION 199 1 . 6 Texampley and . and LEGIC 200 Lenovo 其专用的张力系统确保OLED面板在整个展开过程中始终保持紧绷，同时低摩擦材料的应用也保护了面 板免受磨损。 其搭载了最新的Intel酷睿Ultra处理器，并配备了基于Blackwell架构的GeForce RTX 5090笔记本电脑 GPU。 ...

Core Insights - The gathering of the four major chip giants—NVIDIA, Intel, AMD, and Qualcomm—at the Lenovo Tech World during CES 2026 highlights the evolving dynamics of the semiconductor industry, where collaboration and competition coexist in the AI narrative [1] - The focus is shifting from individual chip manufacturers to system-level players that can integrate diverse computing power and facilitate the deployment of intelligent hardware solutions [1] Group 1: Industry Transformation - Jensen Huang, CEO of NVIDIA, emphasized the significance of AI as a foundational architecture akin to operating systems, marking a new platform shift in computing [4] - The IT industry has invested approximately $10 to $15 trillion over the past thirty years, necessitating a complete overhaul to adapt to AI applications [5] - Huang and Lenovo's CEO, Yang Yuanqing, announced a new collaboration plan to create a "Lenovo AI Cloud Super Factory," aiming to standardize AI infrastructure and transition from highly customized deployments to industrialized solutions [5][7] Group 2: Competitive Landscape - AMD's CEO, Lisa Su, introduced the Helios rack-level AI platform, positioning it as a direct challenge to NVIDIA's GPU-centric approach, highlighting the need for robust system-level infrastructure to support larger models and higher throughput [8] - Intel's new CEO, Pat Gelsinger, showcased the Aura Edition AI PC, which integrates the latest Intel processors, indicating a shift from traditional PCs to data centers and cloud computing [9][10] - Qualcomm's focus on AI-native endpoints, particularly in wearable devices, reflects a broader trend towards personal intelligent companions that require low power consumption and continuous connectivity [10] Group 3: Collaborative Ecosystem - The collaboration among the four chip giants illustrates a new industry consensus that the true value of AI lies not in possessing the most powerful chip but in transforming computing power into usable capabilities for enterprises and users [11] - Lenovo's role as a "system integrator" and "scene amplifier" is crucial in this collaborative ecosystem, as it bridges the various offerings from NVIDIA, AMD, Intel, and Qualcomm [11] - The wearable device market is projected to exceed one billion units, showcasing the potential for growth in AI-driven consumer technology [11]

Core Insights - Lenovo has moved its global innovation technology conference to CES 2026, marking the largest scale in the event's history, with key figures from major tech companies like NVIDIA, AMD, Intel, and Qualcomm in attendance [1] - Lenovo's CEO emphasized that the new wave of computing power will stem from the explosion of AI inference [1] Group 1: AI Strategy and Product Development - Lenovo is focusing on "hybrid AI," which encompasses diverse AI models to meet user needs and the ability for cross-device collaboration among smart devices [3] - The company introduced three key technologies: Intelligent Model Orchestration, Agent Core, and Multi-agent Collaboration, aimed at matching models to user needs, understanding user intent, and enabling collaborative AI operations [3] - Lenovo's AI super intelligent agent, Lenovo Qira, was launched for overseas markets, showcasing cross-device collaboration capabilities among various devices [5] Group 2: Cloud and Local Model Integration - The Qira model has shifted from purely local calls to a combination of cloud and edge collaboration, although local models may lose about 40% of their capabilities compared to cloud models [5][6] - Lenovo's AI strategy involves optimizing partner models rather than developing them in-house, with a focus on integrating cloud models into their existing scheduling system [6] - The company plans to implement cross-device task distribution, allowing users to execute commands across devices [6] Group 3: Partnerships and Market Positioning - Major chip manufacturers are aligning with the trend of enterprise AI transformation, with NVIDIA's CEO stating that companies need to integrate advanced models with their data to build proprietary intelligent systems [8] - Lenovo announced a significant partnership with NVIDIA to establish an "AI Cloud Super Factory," aiming to support large-scale AI models and quadruple their business collaboration over the next 3-4 years [9] - Lenovo will also be among the first to adopt AMD's Helios architecture and collaborate with Intel on AI PCs, indicating a strong commitment to AI-driven enterprise solutions [10]

联想1月6日在拉斯维加斯举行的CES展会上发布名为Qira的人工智能平台，可在联想和摩托罗拉品牌的 产品上协同工作。联想补充称，该AI工具在系统层面集成。由于进行了深度软件整合，用户无需像使 用ChatGPT等热门聊天机器人那样打开单独应用，即可使用相关功能。 联想集团发布新的人工智能(AI)平台以及多款概念设备，这家全球最大的个人电脑生产商试图证明其有 能力在炙手可热的AI领域占据一席之地。 除了AI平台外，联想还展示了全新的Legion概念笔记本电脑，其屏幕可向侧面延展，带来更宽的显示体 验。联想表示，Qira也是其AI眼镜概念的核心，该产品可与连接的智能设备无线协同工作，并提供实时 翻译、图像识别与情境理解等功能。 ...

Core Insights - Lenovo's Chairman and CEO, Yang Yuanqing, introduced the concept of "hybrid AI" during the 2026 CES, emphasizing the need for collaboration among tech companies [1] Group 1: Hybrid AI Concept - The hybrid AI integrates personal, enterprise, and public intelligence to create a personalized and diverse AI experience, which is seen as the ultimate path for AI accessibility [2] - Lenovo unveiled three core technologies: Intelligent Model Orchestration, Agent Core, and Multi-agent Collaboration, which form the technical foundation of hybrid AI [2] - The personal AI superintelligence, Lenovo Qira, was launched to connect and coordinate multiple smart devices seamlessly [2] Group 2: AI in Enterprise Applications - Yang highlighted that the new wave of computing power will stem from the explosion of AI inference, which will be crucial for enterprise competitiveness [4] - Lenovo announced a collaboration with AMD to launch the AI inference server ThinkSystem SR675i, aimed at enhancing AI deployment efficiency and reducing operational costs [4][5] - The company also introduced a range of inference-optimized server products to help enterprises deploy AI models locally and at the edge [5] Group 3: Strategic Partnerships - Lenovo and NVIDIA announced a partnership to create the "Lenovo AI Cloud Super Factory," which aims to industrialize AI infrastructure and significantly reduce deployment time [7] - The collaboration with NVIDIA is expected to quadruple business scale over the next 3 to 4 years [7] - Lenovo is also working with Qualcomm to innovate in the AI-native wearable device sector, with a market potential exceeding one billion units [7] Group 4: Market Trends and Predictions - The integration of AI technology in smart hardware is anticipated to drive growth, with predictions indicating that AI penetration rates in smartphones and PCs could reach 45% and 62% respectively by 2026 [7] - The edge AI market is projected to grow from 321.9 billion yuan in 2025 to 1.22 trillion yuan by 2029, with a compound annual growth rate of 40% [7]