Group 1 - Lenovo (Singapore) Private Limited has applied for a patent titled "Electronic Device" with publication number CN121277314A, filed on June 2025 [1] - The patent summary indicates that the electronic device is designed to ensure cooling performance while enhancing aesthetic quality [1] - The electronic device includes a housing with an air intake on the bottom surface, a fan located within the housing, and leg components positioned on the bottom surface of the housing, which partially cover the air intake at a raised position relative to the opening surface [1]

Core Insights - The AI industry is experiencing a wave of architectural innovations, with significant developments from DeepSeek and collaborations between Princeton and UCLA, as well as a new model architecture from Yann LeCun expected within 12 months [1] - The emergence of new model architectures is seen as a crucial driver to overcome the diminishing returns associated with existing models, particularly as companies like OpenAI face limitations in performance improvements [1] - The integration of different architectural innovations will lead to a new phase of application acceleration in the AI sector, emphasizing the importance of user experience and model capability enhancement [1] Group 1: Architectural Innovations - DeepSeek introduced the mHC framework, which enhances stability and scalability while reducing computational and energy demands, making it valuable for industrial applications [6] - The DDL architecture allows neural networks to dynamically manage their internal memory states, catering to complex information processing needs in government, research, and commercial sectors [6] - Yann LeCun's JEPA architecture breaks the reliance on text, enabling understanding through video and spatial data, which is essential for applications like smart glasses and robotics [6][7] Group 2: Market Dynamics - The competition among AI model vendors is intensifying, with varying progress and strategies in implementing new architectures, leading to differentiation in capabilities across different fields [1][5] - Lenovo's multi-model integration strategy allows users to access various top-tier models, enhancing the "AI Twin" experience and addressing diverse application needs [6][9] - The rise of large-scale AI enterprises, such as Lenovo's Tianxi AI with over 280 million active users, poses challenges for smaller startups in selecting appropriate architectural paths [3][5] Group 3: Infrastructure and Hardware - The new model architectures necessitate upgrades in computational infrastructure, presenting opportunities for suppliers like Lenovo, which has shown proactive market responsiveness [2][10] - Lenovo's introduction of the WR5215 G5 server, featuring significant performance improvements and compatibility with domestic software ecosystems, highlights its strategic alignment with emerging architectural needs [10][12] - The collaboration between Lenovo and NVIDIA to develop a revolutionary server indicates a strong focus on integrating advanced chip technology to support diverse AI applications [12][13] Group 4: Future Outlook - Anticipation surrounds potential major releases from DeepSeek, which could further stimulate practical applications and economic value in the AI sector [14] - The ability of companies to adapt to the evolving landscape of model architectures and effectively integrate them into their offerings will be critical for maintaining competitive advantages [9][14]

声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 本文源自：市场资讯 作者：情报员 国家知识产权局信息显示，联想（新加坡）私人有限公司取得一项名为"具有推荐子载波间距值的指示 的CSI报告"的专利，授权公告号CN116134775B，申请日期为2021年8月。 ...

将在CES期间正式举行 围绕这场科技盛宴上集中呈现的前沿创新 联想将开启一场长达4小时的超级直播 带你第一时间直击盛会的超级核心亮点 炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 来源：联想集团 北京时间明天一早 史上最大规模的联想创新科技大会 现在预约看直播 你将有机会抽取FIFA世界杯门票 即使不在现场 也能云感受这场大会的震撼 史上规模最大一届 全'球'Tech World 本次大会所在空间极具象征意义 作为拉斯维加斯最新地标 全球首座全沉浸式球幕场馆Sphere 可容纳超过1.5万名观众 洞察全球科技热潮涌动方向 通过直播 你也将拥有Sphere的云坐席 见证这场属于全球创新科技的关键时刻 AI时代首届世界杯 混合式AI路线成范本 到场者多来自全球顶级 科技企业、产业机构与创新生态圈 他们来到这里，只为一件事 在CES 2026期间 今年FIFA世界杯将在美加墨三国举行 它被普遍认为是AI时代首届世界杯 超越体育赛事本身的是 足球还是一项人类历史上规模最大 复杂度最高的计算工程 在这片无声却激烈的技术战场上 联想集团的一支技术军团 正以最先进的混合式AI技术与解决方案 深度 ...

Group 1: AI and Technology Trends - Goldman Sachs forecasts significant growth in AI servers driven by strong ASIC performance and high-speed connections (800G/1.6T) boosting supply chain growth [1] - The demand for optical modules is expected to benefit from the AI infrastructure cycle and technology migration, including advancements in 800G/1.6T, silicon photonics, and co-packaged optics (CPO) [1] - Increased penetration of liquid cooling solutions is anticipated, particularly in the ASIC AI server sector [1] Group 2: ODM and Manufacturing - ODMs with strong commitments and capacity planning in the U.S. market, such as Hon Hai Precision, Wistron, and Quanta, are expected to perform well [1] - Leading suppliers with robust design and manufacturing capabilities will be favored as AI server complexity increases and chip platform diversification occurs [1] Group 3: Personal Computers and Smartphones - Global leaders in the PC market are expected to show resilience amid rising storage costs, with high-end PCs being less price-sensitive [2] - The upcoming 2026 CES is anticipated to showcase more AI PCs, potentially featuring the latest Panther Lake platform with performance up to 180 TOPS [2] - In the smartphone sector, Apple suppliers are expected to stand out in 2026, while Android smartphone demand may remain weak in 2024-2025 [2] Group 4: Semiconductor Industry - Domestic leaders in the semiconductor sector, such as SMIC and Hua Hong Semiconductor, are pursuing ambitious expansion plans in advanced processes, which will benefit local semiconductor equipment companies [3] - The capital expenditure for China's semiconductor industry is projected to remain high at $45-46 billion from 2026 to 2030, driven by a shift towards more storage and advanced process technologies [3] Group 5: Autonomous Driving and Satellite Technology - Continuous upgrades in L4 autonomous driving chips and robotaxi services are expected to drive growth for chip, software, and sensor suppliers [3] - The acceleration of satellite launches and performance improvements in rockets are projected to lower launch costs and enhance satellite constellation infrastructure [3]

国家知识产权局信息显示，联想（北京）有限公司申请一项名为"一种操作动作确定方法及装置"的专 利，公开号CN121255024A，申请日期为2025年9月。 声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 本文源自：市场资讯 作者：情报员 专利摘要显示，本申请公开了一种操作动作确定方法及装置，该方法包括：获得用户的脑电波特征；基 于脑电波特征，确定用户的粗粒度意图；基于电子设备的操作内容信息，生成匹配粗粒度意图的细粒度 意图；确定完成细粒度意图指示的目标操作任务所需的至少一个操作动作。 天眼查资料显示，联想（北京）有限公司，成立于1992年，位于北京市，是一家以从事计算机、通信和 其他电子设备制造业为主的企业。企业注册资本565000万港元。通过天眼查大数据分析，联想（北京） 有限公司共对外投资了107家企业，参与招投标项目5000次，财产线索方面有商标信息1747条，专利信 息5000条，此外企业还拥有行政许可238个。 ...

声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 本文源自：市场资讯 国家知识产权局信息显示，联想（新加坡）私人有限公司取得一项名为"信息处理设备的制备方法和移 动计算机"的专利，授权公告号CN115373590B，申请日期为2022年5月。 作者：情报员 ...

Core Insights - Lenovo is set to launch the new smartphone model, moto X70 Air Pro, which emphasizes a lightweight design and features a metal frame with a textured back for aesthetic appeal and grip comfort [2][3] - The device will be powered by the fifth-generation Snapdragon 8 mobile platform, specifically the Snapdragon 8 Gen5 processor, offering robust computing capabilities and supporting 8K resolution for photography and video recording [2][3] - The imaging system has been optimized with a main camera sensor comparable to those found in mainstream flagship models, aiming to enhance image quality and establish the device as a "lightweight imaging flagship" in the market [2][3] - The moto X70 Air Pro will include a stylus that activates various AI functions, enhancing user interaction and versatility in usage scenarios [2][3] Previous Model Reference - The previous model, moto X70 Air, was released in October 2023, featuring an ultra-thin design at 5.99 mm and weighing 159 grams [2][3] - Key specifications of the moto X70 Air include the fourth-generation Snapdragon 7 chip, a 6.67-inch 1.5K OLED display, a triple-camera system with 50MP sensors on both front and back, a 4800mAh battery, 68W wired fast charging, 15W wireless charging, and IP68 and IP69 water and dust resistance ratings, with a starting price of 2399 yuan [2][3]

证券研究报告 日期：2026年1月5日 【中泰电子】2026 CES前瞻 端侧AI蓄势待发 分析师： 王芳 S0740521120002，杨旭 S0740521120001，洪嘉琳 S0740524090003 1 主题演讲 | 厂 商 | 会议主题 | 亮 点 | | --- | --- | --- | | 英伟达 | NVIDIA CEO主旨演讲 | 英伟达创始人兼首席执行官黄仁勋将介绍英伟达与合作伙伴的突破性技术进展 ，预计将介绍 | | | | Rubin平台最新进度以及NVLink与ASIC生态系合作进展 | | AMD | CES开幕主题演讲 | AMD首席执行官苏姿丰将将深入探讨AMD CPU、GPU、自行调适计算技术、AI软件与解决方案 | | | | 并揭露最新Zen 6架构及AI 等相关解决方案 ，预计将释出MI400系列最新信息 PC平台产品线 ， | | 英特尔 | 英特尔 CES 2026 主题演讲 | 主题演讲将由英特尔客户端计算事业部CCG总经理Jim Johnson主持 将重点阐述英特尔AI PC战 ， | | | 略 | Ultra "Panther ，预计将首发酷睿 第3代 ...

2026年1月5日，联想宣布将推出多款与2026年国际足联世界杯合作的联名产品，涵盖笔记本和平板设 备。除此前已曝光的游戏本和轻薄本外，最新信息显示，联想还将至少发布四款主题联名设备。 其中，Legion Tab Gen 3对应国内市场中的拯救者Y700第三代平板，配备高通骁龙8 Gen 3处理器，主打 高性能移动体验。面向商务用户的ThinkBook 16 Gen 9将搭载英特尔酷睿Ultra 7 300系列"Panther Lake"处理器，兼顾效率与算力。 高端系列Yoga Slim 7i Ultra Aura Edition同样采用"Panther Lake"架构，但配备更高端的酷睿Ultra X9 300 系列处理器，定位旗舰级轻薄本。另一款重磅产品为全新推出的ThinkPad X9 14 Gen1，该机型首次采 用英特尔酷睿Ultra 7 200V系列"Lunar Lake"处理器，强调能效表现与续航能力，延续ThinkPad经典设计 理念的同时融入赛事专属元素。 上述新品均融合世界杯主题设计，预计将在全球范围内同步上市，相关细节将在近期的国际消费电子展 期间进一步公布。 2026年1月5日，联想 ...