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港股异动 | 天岳先进(02631)午后涨超4% 公司与东芝电子元件达成合作 共同开发SiC功率半导体
智通财经网· 2025-08-22 05:42
智通财经APP获悉,天岳先进(02631)午后涨超4%,截至发稿,涨3.19%,报44.6港元,成交额1.08亿港 元。 据悉,东芝电子元件以铁路用SiC功率半导体的开发、制造及供应实绩为基础,正加速推进服务器电源 用、车载用等SiC器件开发,未来将致力于进一步降低SiC功率半导体损耗,开发面向高效电力转换应 用的高可靠性、高效率产品。为此,除东芝电子元件自主研发外,与SiC衬底技术改良的紧密协作也至 关重要。此次与在SiC衬底开发及量产技术领域具有全球领导地位的天岳先进达成具体合作,有望为各 应用场景提供最优解决方案,加速业务拓展。 消息面上,8月22日,天岳先进与东芝电子元件及存储装置株式会社就天岳先进开发制造的SiC功率半导 体用衬底达成基本协议,双方将开展以下合作:针对SiC功率半导体特性提升与品质改善的技术协作, 以及运用合作成果扩大高品质稳定衬底供应的商业合作。 ...
天岳先进午后涨超4% 公司与东芝电子元件达成合作 共同开发SiC功率半导体
Zhi Tong Cai Jing· 2025-08-22 05:40
消息面上,8月22日,天岳先进与东芝电子元件及存储装置株式会社就天岳先进开发制造的SiC功率半导 体用衬底达成基本协议,双方将开展以下合作:针对SiC功率半导体特性提升与品质改善的技术协作, 以及运用合作成果扩大高品质稳定衬底供应的商业合作。 据悉,东芝电子元件以铁路用SiC功率半导体的开发、制造及供应实绩为基础,正加速推进服务器电源 用、车载用等SiC器件开发,未来将致力于进一步降低SiC功率半导体损耗,开发面向高效电力转换应 用的高可靠性、高效率产品。为此,除东芝电子元件自主研发外,与SiC衬底技术改良的紧密协作也至 关重要。此次与在SiC衬底开发及量产技术领域具有全球领导地位的天岳先进达成具体合作,有望为各 应用场景提供最优解决方案,加速业务拓展。 天岳先进(02631)午后涨超4%,截至发稿,涨3.19%,报44.6港元,成交额1.08亿港元。 ...
天岳先进(02631)与东芝电子元件达成合作协议 加速业务拓展
智通财经网· 2025-08-22 04:50
智通财经了解到,承担电力供应与控制功能的功率半导体,是实现所有电气设备节能化及碳中和不可或缺的半导体元件。在设备电力使用效率提升等需求背 景下,预计未来其市场需求将持续扩大。其中采用SiC衬底的功率半导体,因其应用于电动汽车、可再生能源系统等要求高效电力转换场景,在电力效率之 外,可靠性与品质稳定性也成为重要课题。 基于此,东芝电子元件以铁路用SiC功率半导体的开发、制造及供应实绩为基础,正加速推进服务器电源用、车载用等SiC器件开发,未来将致力于进一步 降低SiC功率半导体损耗,开发面向高效电力转换应用的高可靠性、高效率产品。为此,除东芝电子元件自主研发外,与SiC衬底技术改良的紧密协作也至 关重要。此次与在SiC衬底开发及量产技术领域具有全球领导地位的天岳先进达成具体合作,有望为各应用场景提供最优解决方案,加速业务拓展。 智通财经APP获悉,8月22日,天岳先进(02631)与东芝电子元件及存储装置株式会社就天岳先进开发制造的SiC功率半导体用衬底达成基本协议,双方将开展 以下合作:针对SiC功率半导体特性提升与品质改善的技术协作,以及运用合作成果扩大高品质稳定衬底供应的商业合作。 据悉,天岳先进自201 ...
天岳先进(02631) - 海外监管公告
2025-08-21 10:11
香港交易及結算所有限公司及香港聯合交易所有限公司對本公佈的內容概不負責,對其準確 性或完整性亦不發表任何聲明,並明確表示概不會對本公告的全部或任何部分內容所產生或 因依賴該等內容而引致的任何損失承擔任何責任。 山東天岳先進科技股份有限公司 SICC CO., LTD. (於中華人民共和國註冊成立的股份有限公司) (股份代號:2631) 海外監管公告 本公告乃根據香港聯合交易所有限公司證券上市規則第13.10B條刊發。 玆載列山東天岳先進科技股份有限公司於上海證券交易所網站( www.sse.com.cn ) 所刊發的公告,僅供參考。 承董事會命 山東天岳先進科技股份有限公司 董事長、執行董事兼總經理 宗艷民先生 关于持股 5%以上股东持股比例被动稀释跨越 5%整数倍及 触及 1%刻度的提示性公告 投资者宗艳民及其一致行动人上海麦明企业管理中心(有限合伙)、上海铸 傲企业管理中心(有限合伙);国材股权投资基金(济南)合伙企业(有限合伙); 哈勃科技创业投资有限公司保证向本公司提供的信息真实、准确、完整,没有虚 假记载、误导性陈述或重大遗漏。 本公司董事会及全体董事保证公告内容与信息披露义务人提供的信息一致。 重 ...
天岳先进挂牌港交所,山东已拥有71家港股上市企业
Da Zhong Ri Bao· 2025-08-21 04:54
2025年8月20日,天岳先进(02631.HK)正式在香港联交所主板挂牌上市,成为两市唯一"A+H"上市的碳化硅衬底公司,迈出公司国际化发展的关键一 步。 在天岳先进上市后,山东已经拥有71家港股上市企业,国资港股上市企业18家。 同时,8月18日,来自山东日照东港区的山东沪鸽口腔医疗集团有限公司的控股公司Huge Dental Limited(简称:沪鸽口腔)在港交所递交招股书,这是继其 于2025年2月18日递表失效后的再一次申请,该公司是一家专业的口腔材料公司。2024年和2025年前六个月,营收分别是3.99亿和1.97亿元,相应的净利润 分别为7656.9万元和2610.0万元。 今年以来,山东企业明显加快香港资本市场进军步伐,除了"沪鸽口腔,目前排队的还有山东重工集团旗下的山推股份、潍柴雷沃智慧农业科技,山东黄 金集团旗下的山金国际,济南知名企业建邦集团旗下的建邦高科,潍坊高科技企业歌尔股份旗下的歌尔微电子,以及烟台企业玲珑轮胎、青岛企业酷特智 能、国恩股份、圣桐特医、文达通,泰安企业快驴科技、东营企业胜软科技。 天岳先进自成立以来即专注于高品质碳化硅衬底的研发与产业化。公司是全球少数能够实现8 ...
碳化硅衬底龙头天岳先进(02631.HK)正式登陆港交所,国际化战略布局迈出关键一步
Xin Lang Cai Jing· 2025-08-21 02:20
Core Viewpoint - Tianyue Advanced (02631.HK) officially listed on the Hong Kong Stock Exchange on August 20, 2025, becoming the only "A+H" listed silicon carbide substrate company in both markets, reflecting strong market interest and investor confidence in the company’s growth potential [1][2]. Group 1: IPO and Market Performance - Tianyue Advanced's IPO involved a global offering of 47.7457 million H-shares, accounting for 10% of the total share capital post-issue, with an issue price of HKD 42.80 per share [1]. - The company experienced a high subscription rate of 2809.19 times for its shares, indicating significant investor enthusiasm [1]. - The company's A-shares have shown a strong performance, with a maximum increase of approximately 16% since the start of the subscription on August 11 [1]. Group 2: Company Position and Strategy - Tianyue Advanced focuses on high-quality silicon carbide substrate research and industrialization, being one of the few companies capable of mass production of 8-inch silicon carbide substrates [2]. - The company holds a 22.80% market share, making it the second-largest silicon carbide substrate manufacturer globally, with a strong brand presence in international markets [2]. - The IPO is part of the company's internationalization strategy, with funds allocated for overseas capacity construction and further research on large-size products [2]. Group 3: Technological Advancements - The company has achieved mass supply of 8-inch conductive substrates and is set to launch the industry's first 12-inch silicon carbide substrate in November 2024, enhancing chip production efficiency [3]. - Tianyue Advanced has made breakthroughs in substrate types and production processes, including the successful delivery of high-quality low-resistance P-type silicon carbide substrates [3]. Group 4: Intellectual Property and Recognition - As of the end of 2024, the company has obtained 194 invention patents and 308 utility model patents, ranking among the top five globally in terms of patent quantity [4]. - The company received the "Golden Bull Listed Company Innovation Award" and a prestigious semiconductor materials award, marking significant achievements in the field [5]. Group 5: Market Growth and Applications - The global silicon carbide substrate market is projected to grow from RMB 2.6 billion in 2019 to RMB 66.4 billion by 2030, with a compound annual growth rate (CAGR) of 39.0% [7]. - The demand for silicon carbide is primarily driven by the electric vehicle sector, which accounts for nearly 80% of the demand [7]. - Tianyue Advanced is actively expanding into emerging applications such as AI data centers and AR glasses, positioning itself for future growth [8][9]. Group 6: Global Expansion and Revenue Growth - The company reported overseas revenue of RMB 840 million in 2024, a year-on-year increase of 104.43%, with overseas revenue surpassing domestic revenue for the first time [10]. - Tianyue Advanced has established partnerships with over half of the top ten power semiconductor manufacturers globally, enhancing its market reach [10]. - The funds raised from the IPO will support overseas capacity construction to meet the growing demand from international clients [10].
港交所上半年收入创半年度历史新高;天岳先进上市首日收涨6.4%丨港交所早参
Mei Ri Jing Ji Xin Wen· 2025-08-20 16:44
Group 1: Hong Kong Stock Exchange Performance - Hong Kong Stock Exchange reported a record high total revenue of HKD 14.076 billion and a shareholder profit of HKD 8.519 billion for the first half of 2025, marking a historical peak for the semi-annual performance [1] - The new stock market financing amount has returned to the top of global exchanges, reinforcing Hong Kong's leading position in the global capital market [1] Group 2: Tianyue Advanced Listing - Tianyue Advanced, a semiconductor silicon carbide substrate manufacturer, officially listed on the Hong Kong Stock Exchange, with its stock price rising by 6.4% on the first day of trading [2] - The company issued 47.7457 million shares at a price of HKD 42.80 per share, focusing on the research and industrialization of silicon carbide substrates [2] Group 3: Zhaochuang Information's IPO Plans - Zhaochuang Information announced plans to issue H-shares and list on the Hong Kong Stock Exchange to enhance its global strategy and brand image [3] - The details of the H-share issuance and listing are yet to be determined, but this move aims to provide new opportunities in the international market [3] Group 4: Hansoh Pharmaceutical Fundraising - Hansoh Pharmaceutical announced a placement agreement to raise approximately HKD 3.897 billion by issuing 108 million shares at a price of HKD 36.30 per share, representing a discount of about 6.49% from the previous closing price [4] - The fundraising is expected to improve the company's financial position and support future research and business expansion [4] Group 5: Hong Kong Stock Market Overview - The Hong Kong stock market index closed at 25,165.94, with a slight increase of 0.17% on August 20 [5] - Other indices showed minor fluctuations, indicating a stable market environment [5]
8月20日晚间重要公告一览
Xi Niu Cai Jing· 2025-08-20 10:23
伟测科技:上半年净利润1.01亿元 同比增长831.03% 8月20日晚,伟测科技(688372)发布2025年半年度报告,公司上半年实现营业收入6.34亿元,同比增 长47.53%;实现归属于上市公司股东的净利润1.01亿元,同比增长831.03%;基本每股收益为0.68元/ 股。 资料显示,伟测科技成立于2016年5月,主营业务是晶圆测试、芯片成品测试以及与集成电路测试相关 的配套服务。 所属行业:电子–半导体–集成电路封测 长华集团:收到客户项目定点通知书 8月20日晚,长华集团(605018)发布公告称,公司近期收到国内车企的定点开发通知书,定点产品主 要为关键金属结构件。此次定点项目生命周期为8年,预计生命周期总销售金额约1.9亿元,计划于2026 年第三季度逐步开始量产。 资料显示,长华集团成立于1993年11月,主营业务是汽车金属零部件的研发、生产、销售。 所属行业:汽车–汽车零部件–其他汽车零部件 君禾股份:上半年净利润3099.93万元 同比下降19.53% 8月20日晚,君禾股份(603617)发布2025年半年度报告,公司上半年实现营业收入5.78亿元,同比增 长5.53%;实现归属于上 ...
220亿,济南前首富又去IPO了
创业家· 2025-08-20 10:12
Core Viewpoint - The article highlights the successful IPO of Tianyue Advanced on the Hong Kong Stock Exchange, marking a significant step in the company's internationalization strategy and its ambition to enhance its capital strength and competitiveness in the semiconductor materials sector [4][5][19]. Group 1: Company Overview - Tianyue Advanced, a leading player in the silicon carbide substrate industry, was listed on the Hong Kong Stock Exchange on August 20, 2023, with an initial share price of HKD 42.8, which rose by 6% on its first day, giving it a market capitalization of approximately HKD 22 billion [4]. - The company aims to accelerate its international strategy and overseas business layout through this listing, achieving an "A+H" dual listing format [4][5]. - The founder, Zong Yanmin, previously ranked as the wealthiest individual in Jinan, has seen fluctuations in his wealth due to changes in the company's market value but remains a prominent figure in the region [4][10]. Group 2: Financial Performance - In 2024, Tianyue Advanced reported a revenue of CNY 1.768 billion, representing a 41.37% increase from 2023, continuing a trend of revenue growth over three consecutive years [18]. - The company holds a top-three global market share in conductive silicon carbide substrate materials and has introduced the industry's first 12-inch silicon carbide substrate, enhancing its production capabilities [18][19]. - The anticipated growth in AI data center capacity and the increasing demand for high-quality silicon carbide materials in various applications, including electric vehicles and renewable energy, are expected to significantly boost the company's profitability [19]. Group 3: Market Trends - The Hong Kong Stock Exchange has seen a surge in IPO activities, with over 50 A-share companies applying for listings in 2025, indicating a strong trend of domestic companies seeking international capital markets [23][25]. - The total IPO fundraising in Hong Kong for the first half of 2025 reached HKD 107.1 billion (approximately USD 13.9 billion), marking a 22% increase compared to the previous year [25]. - The Chinese government's supportive policies for capital market development are expected to further enhance Hong Kong's position as a global financial hub, attracting more companies to list [26].
股价涨超11%,山东半导体材料巨头上市,中国第一,华为持股,市值228亿
3 6 Ke· 2025-08-20 03:46
芯东西8月20日报道,刚刚,山东半导体材料龙头天岳先进成功登陆港交所。 其H股发行价为42.80港元/股,开盘价为45.60港元/股,上涨6.54%。截至09点55分,天岳先进最高股价上涨11.68%至47.80港元/股,最新总市值为228亿港 元(约合人民币210亿元)。 | 天岳先进 (02631.HK) | | | | | | --- | --- | --- | --- | --- | | 交易中 08-20 09:56:06 | | | | | | 47.700 HKD | | | | BMP : | | +4.900 +11.45% 半导体设备与材料 +3.10% > | | | | | | 今 开 | 45.600 | 最 高 47.800 | 成交量 1522.06万股 | | | 昨 收 | 42.800 | 最低 | 45.000 成交额 | 7.19亿 | | 换手率 | 31.88% | 市盈TIM 7 = | 148.59 总市值▼ 227.75亿 | | | 量 比 | | 市盈动 | 616.85 总股本 1 | 4.77亿 | | 委 比 | -92.63% | 市盈能 | 11 ...