证券代码：600460 证券简称：士兰微 公告编号：临 2025-028 杭州士兰微电子股份有限公司 2024年年度股东大会决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 本次会议是否有否决议案：无 一、 会议召开和出席情况 （一） 股东大会召开的时间：2025 年 6 月 12 日 （二） 股东大会召开的地点：浙江省杭州市西湖区黄姑山路 4 号公司三楼 大会议室 （三） 出席会议的普通股股东和恢复表决权的优先股股东及其持有股份情 况： | 1、出席会议的股东和代理人人数 | 3,046 | | --- | --- | | 2、出席会议的股东所持有表决权的股份总数（股） | 666,438,136 | | 3、出席会议的股东所持有表决权股份数占公司有表决权 | 40.0486 | | 股份总数的比例（%） | | （四） 表决方式是否符合《公司法》及《公司章程》的规定，大会主持情 况等。 本次股东大会采用现场投票与网络投票相结合的方式对本次股东大会通知 中列明的事项进行了投票表决。现场出席本次股东大会 ...

证券代码：600460 证券简称：士兰微 编号：临 2025-029 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 杭州士兰微电子股份有限公司（以下简称"公司"）于2025年5月22日召开 了第八届董事会第三十五次会议和第八届监事会第二十五次会议，审议通过了 《关于2021年股票期权激励计划首次授予的股票期权第四个行权期行权条件未 成就及注销相应股票期权的议案》，同意注销2021年股票期权激励计划首次授予 的股票期权第四个行权期对应的股票期权452.2875万份。具体内容详见公司于 2025年5月23日在上海证券交易所网站（www.sse.com.cn）披露的相关公告，公 告编号：临2025-025。 公司向中国证券登记结算有限责任公司上海分公司提交了注销上述股票期 权的申请。经中国证券登记结算有限责任公司上海分公司审核确认，上述 452.2875 万份股票期权注销事宜已于近日办理完毕。本次部分股票期权注销不会 影响公司股本结构。本次股票期权注销完成后，公司 2021 年股票期权激励计划 全部完结。 特此公告。 杭州士兰微电 ...

国浩律师（杭州）事务所 关 于 杭州士兰微电子股份有限公司 2024 年年度股东大会 法律意见书 网址/Website：http://www.grandall.com.cn 二〇二五年六月 国浩律师（杭州）事务所 法律意见书 国浩律师（杭州）事务所 地址：杭州市上城区老复兴路白塔公园 B 区 2 号、15 号国浩律师楼 邮编：310008 Grandall Building, No.2＆No.15, Block B, Baita Park, Old Fuxing Road, Hangzhou, Zhejiang 310008, China 电话/Tel: (+86)(571) 8577 5888 传真/Fax: (+86)(571) 8577 5643 电子邮箱/Mail：grandallhz@grandall.com.cn 关 于 杭州士兰微电子股份有限公司 2024 年年度股东大会 法律意见书 致：杭州士兰微电子股份有限公司 国浩律师（杭州）事务所（以下简称"本所"）接受杭州士兰微电子股份有限 公司（以下简称"公司"）委托，指派律师出席公司 2024 年年度股东大会（以 下简称"本次股东大会"），并依据《 ...

内容概况：中国半导体二极管行业正处于快速发展与转型升级的关键阶段。2024年，中国半导体二极管 行业市场规模为22.57亿美元，同比增长15.33%，主要得益于新能源汽车、5G通信、工业控制等下游应 用领域的强劲需求。技术层面，国内企业加速突破。第三代半导体材料（如碳化硅、氮化镓）的应用成 为焦点，推动二极管向高频、高效、耐高压方向发展。例如，SiC肖特基二极管已在电动汽车充电桩、 光伏逆变器等领域实现规模化应用。此外，光电集成领域取得创新，中国科学技术大学团队提出的三电 极光电二极管结构，通过场效应调控实现光通信带宽提升60%，为下一代高速光电芯片提供技术支撑。 相关上市企业：扬杰科技（300373）、苏州固锝（002079）、捷捷微电（300623）、华微电子 （600360）、华润微（688396）、士兰微（600460） 相关企业：江西铜业股份有限公司、中环半导体股份有限公司、北方华创科技集团股份有限公司、华海 诚科科技股份有限公司、华海清科股份有限公司、上海微电子装备（集团）股份有限公司、华为技术有 限公司、小米科技有限责任公司、比亚迪股份有限公司、小鹏汽车科技有限公司、有研半导体硅材料股 份公司、 ...

600460 士兰微 2024 年年度股东大会会议资料 杭州士兰微电子股份有限公司 2024 年年度股东大会 会议资料 1 / 28 600460 士兰微 2024 年年度股东大会会议资料 会议资料目录 | 议案之一：2024 | 年年度报告及摘要 | 3 | | --- | --- | --- | | 议案之二：2024 | 年度董事会工作报告 | 4 | | 议案之三：2024 | 年度监事会工作报告 | 7 | | 议案之四：2024 | 年度财务决算报告 | 10 | | 议案之五：2024 | 年度利润分配方案 | 15 | | 议案之六：关于 2024 | 年度董事薪酬的议案 16 | | | 议案之七：关于 2024 | 年度监事薪酬的议案 18 | | | 议案之八：关于与士兰集科日常关联交易的议案 15 | | | | 议案之九：关于续聘 | 2025 年度审计机构的议案 20 | | | 议案之十：关于 2025 | 年度对子公司提供日常担保额度的议案 | 23 | | 议案之十一：关于开展 | 年度外汇衍生品交易业务的议案 2025 | 26 | 2 / 28 600460 士兰微 20 ...

Core Viewpoint - The company has announced an adjustment in the guarantee amount provided for its subsidiary, Xiamen Silan Ming Gallium Semiconductor Co., Ltd., increasing the guarantee ratio and amount for a long-term loan from the National Development Bank [3][5][9]. Summary by Sections Guarantee Overview - The company signed a guarantee contract amendment on May 29, 2025, adjusting the guarantee ratio for a 950 million yuan long-term loan from 30% to 56.5638%, increasing the guarantee amount from a maximum of 285 million yuan to a maximum of 537.4 million yuan [3][5]. - As of the announcement date, the actual guarantee amount provided by the company for Silan Ming Gallium is 578 million yuan, which is within the approved limit by the shareholders' meeting [3][8]. Financial Condition of the Guaranteed Entity - Silan Ming Gallium's latest audited debt-to-asset ratio is 70.86%, indicating a significant level of leverage [4]. - The company is involved in the manufacturing of LED chips and 6-inch SiC chips, with expectations of increased shipment volumes in 2025 due to technological improvements and efficiency enhancements [9]. Internal Decision-Making Process - The adjustment of the guarantee amount was approved in the board meeting on April 23, 2025, and the first extraordinary shareholders' meeting on May 9, 2025 [7][10]. - The company has no overdue external guarantees, and the guarantee is not related to any connected parties [6][7]. Total External Guarantees - As of the announcement date, the total external guarantees approved by the company and its subsidiaries amount to 5.1658 billion yuan, which is 42.29% of the company's latest audited net assets [11]. - The guarantees provided to subsidiaries total 4.2374 billion yuan, representing 34.69% of the company's latest audited net assets [11].

证券代码：600460 证券简称：士兰微 编号：临 2025-027 杭州士兰微电子股份有限公司 截至本公告披露日，公司为士兰明镓实际提供的担保余额为 5.78 亿元，担 保余额在公司相关股东大会批准的担保额度范围内。 ● 本次担保无反担保。 ● 本公司不存在逾期对外担保。 ● 特别风险提示： 关于为控股子公司提供担保的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大 遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： ● 被担保人名称： 厦门士兰明镓化合物半导体有限公司（以下简称"士兰明镓"）。士兰明镓 为杭州士兰微电子股份有限公司（以下简称"公司"或"本公司"）之控股子公 司。 ● 本次预计担保金额及已实际为其提供的担保余额： 公司于 2025 年 5 月 29 日签署了《保证合同变更协议》，按最新持股比例调 整对士兰明镓 9.5 亿元中长期贷款所提供的担保比例，即担保比例从 30%变更为 56.5638%，对应的担保额度从不超过 2.85 亿元变更为不超过 5.374 亿元。 上述担保无反担保。上述担保非关联担保。 被担保人士兰明镓最近一期经审计的 ...

Core Viewpoint - The article discusses the advancements and applications of Silicon Carbide (SiC) technology in various sectors, particularly in electric vehicles and renewable energy, highlighting the industry's growth potential and challenges ahead [2][4][16]. Group 1: Industry Developments - The third generation of SiC MOSFET products is being developed by STMicroelectronics, with a focus on the Chinese market, aiming for better alignment with local automotive needs [5][6]. - National Electronic has achieved significant advancements in SiC technology, with their MOSFET chips demonstrating a minimum on-resistance of 11mΩ and trench chips as low as 9mΩ, indicating a strong competitive edge [6][7]. - SiC products from various companies are being increasingly adopted in industrial applications, including energy storage systems and AI data centers, showcasing the versatility of SiC technology [8][9]. Group 2: Market Opportunities - The electric vehicle (EV) sector remains the primary market for SiC, accounting for nearly 80% of its application, but emerging markets such as AI server power supplies and industrial applications are expected to drive future growth [16][24]. - The potential for SiC applications in eVTOL (electric vertical takeoff and landing) and electric shipping is being explored, with significant weight and efficiency advantages noted for eVTOL applications [10][13]. - The demand for SiC in the power supply sector, including charging stations and fast charging for electric trucks, is anticipated to grow, driven by the need for efficient energy solutions [17][18]. Group 3: Challenges and Considerations - The industry faces challenges in standardization and cost-effectiveness for SiC applications in new markets, particularly in eVTOL and electric shipping, where high voltage requirements and cost considerations are critical [11][12]. - Companies are urged to focus on product maturity, cost optimization, and innovation to capture emerging market opportunities effectively [25][26]. - The need for tailored solutions in industrial applications is emphasized, as diverse customer requirements necessitate customized designs and approaches [27][28].

Summary of Hangzhou Silan Microelectronics Co. Ltd. Conference Call Company and Industry - **Company**: Hangzhou Silan Microelectronics Co. Ltd. (600460.SS) - **Industry**: Semiconductors, specifically focusing on power semiconductors in Greater China Core Points and Arguments - **Stock Rating**: Equal-weight [3] - **Industry View**: In-Line [3] - **Price Target**: Rmb22.50, with the current stock price at Rmb24.55 as of May 16, 2025 [5] - **52-Week Range**: Rmb34.69 - Rmb16.32 [5] - **Earnings Forecasts**: - 2025 EPS forecast decreased by 11% due to a 1Q25 earnings miss [5] - 2026 EPS forecast increased by 2% [5] - 2027 EPS forecast remains largely unchanged [5] - **Revenue Growth**: Expected revenue CAGR of 23% from 2024 to 2027, with gross margin improving to 30% by 2025-2027 from 19% in 2024 [10] - **Investment Thesis**: Silan is positioned to benefit from China's power semiconductor localization trend, but faces near-term challenges due to competition [12] Financial Metrics - **Fiscal Year Ending**: - 2025e EPS: Rmb0.2 (consensus Rmb0.7) [22] - 2026e EPS: Rmb0.6 (consensus Rmb0.4) [22] - 2027e EPS: Rmb1.1 (consensus Rmb1.4) [22] - **Net Income**: Projected at Rmb321.4 million for 2025 [22] - **Return on Equity (ROE)**: Expected to be 2.7% for 2025 [22] Risk Factors - **Margin Pressure**: Due to increased competition [6] - **Market Dynamics**: Potential slow sales growth and gross margin decline in bear case scenarios [16] - **Economic Conditions**: Risks include weak demand due to economic recession and slower-than-expected capacity expansion [26] Additional Insights - **Market Share**: Anticipated gains from Chinese auto OEMs adopting Silan's IGBT and SiC modules [10] - **Technology Improvements**: Focus on advancements in IGBT modules and MOSFET technology [26] - **Investment Drivers**: Stronger demand from electric vehicle penetration and market share gains in home appliance IPM [26] Consensus and Ratings Distribution - **Consensus Rating Distribution**: 14% Overweight, 43% Equal-weight, 43% Underweight [14] - **Price Target Distribution**: Consensus price target ranges from Rmb15.90 to Rmb27.92 [7] This summary encapsulates the key points from the conference call regarding Hangzhou Silan Microelectronics Co. Ltd., highlighting its financial outlook, market position, and associated risks.

Investment Rating - The industry investment rating is "Outperform" (maintained) [2] Core Insights - The profitability of the power semiconductor industry is steadily improving, with the automotive sector and data centers being the main growth drivers. The domestic production of medium and low voltage devices for automobiles is continuously advancing [4][7] - The penetration of SiC MOSFETs in new energy vehicles is increasing, with a notable rise in the market share of domestic suppliers in the IGBT module sector [38][39] - The overall industry is entering a stable phase, with demand from consumption and industrial control maintaining steady growth, while the new energy vehicle market continues to expand [6][21] Summary by Sections Power Semiconductor Performance - The industry is experiencing a recovery in profitability as revenues improve, with automotive and data center applications being the primary growth areas [4] - The sales volume of new energy vehicles in March reached 1.24 million units, a year-on-year increase of 40.1%, with a penetration rate of 42.4% [32][34] New Energy Vehicles - The market share of new energy vehicles with a peak power of over 200kW has increased from 9% in 2022 to 25% in the first quarter of 2025 [35] - The penetration rate of SiC MOSFETs in new energy vehicles reached 18.9% in the first quarter of 2025, indicating a shift towards higher power modules [38] Charging Infrastructure - The number of charging stations in March 2025 increased by 634,000 units, with public charging stations showing a year-on-year decrease of 18.35% [5] Market Dynamics - The competition among leading companies in the IGBT module market is stabilizing, with domestic suppliers gaining market share as overseas competitors decline [38][39] - The industry is expected to continue its growth trend in 2024, driven by the demand for automotive power devices and the ongoing transition to electric vehicles [6][21]