北京德恒律师事务所 关于大连百傲化学股份有限公司 2026 年第一次临时股东会的 法律意见 北京市西城区金融街 19 号富凯大厦 B 座 12 层 电话:010-52682888 传真:010-52682999 邮编:100033 北京德恒律师事务所 关于大连百傲化学股份有限公司 2026 年第一次临时股东会的法律意见 北京德恒律师事务所 2026 年第一次临时股东会的 法律意见 德恒 01G20260095-1 号 致：大连百傲化学股份有限公司 关于大连百傲化学股份有限公司 北京德恒律师事务所受大连百傲化学股份有限公司（以下简称"公司"）委托， 指派律师（以下简称"本所律师"）出席公司 2026 年第一次临时股东会（以下简 称"本次股东会"），对本次股东会的合法性进行见证并出具法律意见。 本法律意见根据《中华人民共和国公司法》（以下简称"《公司法》"）、《中 华人民共和国证券法》《上市公司股东会规则》等有关法律、法规和规范性文件 以及《大连百傲化学股份有限公司章程》（以下简称"《公司章程》"）出具。 为出具本法律意见，本所律师审查了公司本次股东会的有关文件和材料。本 所律师得到公司如下保证，即其已提供了本所 ...

Market Overview - The agricultural chemical sector experienced a decline of 1.56% on January 29, with Nongda Technology leading the drop [1] - The Shanghai Composite Index closed at 4157.98, up 0.16%, while the Shenzhen Component Index closed at 14300.08, down 0.3% [1] Stock Performance - Notable gainers in the agricultural chemical sector included: - Guangxin Co., Ltd. (Code: 6655209) with a closing price of 15.50, up 10.01% and a trading volume of 779,400 shares, totaling 1.156 billion yuan [1] - Limin Co., Ltd. (Code: 002734) closed at 20.99, up 6.98% with a trading volume of 835,600 shares, totaling 1.696 billion yuan [1] - Major decliners included: - Nongda Technology (Code: 920159) with a closing price of 46.05, down 12.93% and a trading volume of 81,600 shares, totaling 3.81 billion yuan [2] - Zhongnong United (Code: 003042) closed at 22.87, down 10.00% with a trading volume of 455,700 shares [2] Capital Flow - The agricultural chemical sector saw a net outflow of 1.974 billion yuan from institutional investors, while retail investors contributed a net inflow of 1.463 billion yuan [2] - The capital flow for specific stocks showed: - Limin Co., Ltd. had a net inflow of 1.89 billion yuan from institutional investors, but a net outflow of 819.96 million yuan from retail investors [3] - Guangxin Co., Ltd. experienced a net inflow of 139 million yuan from institutional investors, with a net outflow of 668.65 million yuan from retail investors [3]

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 证券代码：603360 证券简称：百傲化学 公告编号：2026-019 重要内容提示 大连百傲化学股份有限公司（以下简称"公司"）控股股东大连通运投 资有限公司（以下简称"通运投资"）持有公司股份总数为 211,581,520 股，占 公司总股本的 29.96%。截至本公告日，通运投资累计质押的公司股份数为 89,480,000 股，占其持有公司股份总数的 42.29%，占公司总股本的 12.67%。 一、本次股份质押情况 公司近日接到股东通运投资通知，通运投资于 2026 年 1 月 27 日将其持有的 本公司 16,000,000 股股份质押给国民信托有限公司。具体情况如下： | 股东 | 是否为 控股股 | 本次质押股 | 是否 为限 | 是否 补充 | 质押起 | 质押到期日 | 质权人 | 占其所持 | 占公司总 | 质押融资 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | ...

Core Viewpoint - Advanced packaging is emerging as a new engine for computing power in the "post-Moore's Law" era, addressing the limitations of traditional chip performance improvements through innovative bonding technologies [4][5]. Group 1: Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [8][19]. - The development of hybrid bonding has evolved through various stages, from wire bonding to flip chip, and now to hybrid bonding, which enables ultra-fine pitch stacking and packaging [10][11]. - Hybrid bonding can be categorized into wafer-to-wafer (W2W) and chip-to-wafer (C2W) processes, with C2W offering higher flexibility and lower defect rates for smaller chips [14][16]. Group 2: Advantages and Challenges of Hybrid Bonding - The technology allows for extreme interconnect density and performance breakthroughs, achieving interconnect pitches below 1 μm, significantly enhancing data transfer bandwidth [23]. - Hybrid bonding is compatible with existing wafer-level manufacturing processes and can be integrated with TSV and micro-bump technologies, providing cost optimization potential [24]. - Challenges include yield issues, surface smoothness requirements, cleanliness standards, and complex testing processes that need to be addressed for successful mass production [26]. Group 3: Market Demand and Future Prospects - Major HBM manufacturers, including Samsung, Micron, and SK Hynix, have committed to adopting hybrid bonding technology for HBM5, which aims to meet the extreme demands of AI and high-performance computing [28]. - TSMC's SolC technology, which utilizes hybrid bonding, is expected to double its production by 2026, highlighting the growing adoption of this technology [29][30]. - The global market for hybrid bonding equipment is projected to exceed $600 million by 2030, with significant growth anticipated in the Asia-Pacific region [37]. Group 4: Competitive Landscape - The hybrid bonding equipment market is dominated by international players such as BESI, EV Group, and SUSS MicroTec, with BESI holding a market share of 67% in 2023 [44]. - The competitive landscape is evolving, with Chinese companies like Piotech entering the market, indicating advancements in domestic semiconductor equipment capabilities [42].

Investment Rating - The report suggests a positive investment outlook for the hybrid bonding technology, highlighting its critical role in the AI era and advanced packaging market [7]. Core Insights - Hybrid bonding is identified as a key enabling technology for overcoming performance bottlenecks in the post-Moore era, driven by explosive demand in AI and high-performance computing (HPC) [7]. - The market for hybrid bonding equipment is expected to experience significant growth, with demand projected to increase several times by 2030, particularly in high-performance computing and memory applications [5][44]. - The report emphasizes the competitive landscape, noting that while overseas companies like BESI dominate the market, domestic players in China are making significant strides [5][57]. Summary by Sections Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [14][28]. - The technology enables interconnect distances below 10μm, significantly enhancing data transmission bandwidth compared to traditional methods [29]. Market Demand and Growth - The demand for hybrid bonding technology is transitioning from an advanced option to a core infrastructure in the AI era, with major manufacturers like TSMC and Samsung adopting it for next-generation products [5][33]. - The global hybrid bonding equipment market is projected to exceed $600 million by 2030, with the Chinese market expected to surpass $400 million [48]. Key Players and Competitive Landscape - BESI holds a dominant position in the hybrid bonding equipment market, with a market share of approximately 67% in 2023, and is expected to maintain around 70% in 2024 [57]. - Domestic companies such as Tuojing Technology and Baiao Chemical are rapidly advancing, with Tuojing Technology launching its first mass-production hybrid bonding equipment [5][57]. Applications and Future Trends - Hybrid bonding is primarily applied in 3D NAND and is expanding into high-performance computing scenarios, including HBM4 and HBM5 technologies [25][44]. - The report indicates that the technology is becoming essential for various applications, including AI chips and advanced memory solutions, with significant investments being made in new packaging facilities globally [43][44].

大连百傲化学股份有限公司 2026 年第一次临时股东会会议资料 1 大连百傲化学股份有限公司 2026 年第一次临时股东会会议资料 （603360） 2026 年 01 月 | | | 大连百傲化学股份有限公司 2026 年第一次临时股东会会议资料 大连百傲化学股份有限公司 2026 年第一次临时股东会须知 为维护股东的合法权益，保障股东在大连百傲化学股份有限公司（以下简称 "公司"）2026 年第一次临时股东会会议期间依法行使权利，确保股东会的正常 秩序和议事效率，根据《中华人民共和国公司法》（以下简称"《公司法》"）、《上 市公司股东会规则》《大连百傲化学股份有限公司章程》（以下简称"《公司章程》"） 等有关规定，制定本须知。 一、各股东请按照本次股东会会议通知中规定的时间和登记方法办理参加会 议手续，详见公司在上海证券交易所网站（www.sse.com.cn）披露的《大连百傲 化学股份有限公司关于召开 2026 年第一次临时股东会的通知》（公告编号： 2026-014），证明文件不齐或手续不全的，谢绝参会。 二、本公司设立股东会会务组，由公司证券部负责会议程序和服务等各项事 宜。 三、会议期间，全体参会 ...

据天眼查APP显示，大连百傲化学股份有限公司成立于2003年09月22日，注册资本70622.3654万人民 币。（数据宝） （文章来源：证券时报网） 数据宝统计，截至14:50，百傲化学成交额15.59亿元，创上市以来新高。最新股价下跌2.54%，换手率 5.82%。上一交易日该股全天成交额为14.24亿元。 ...

Group 1 - The lithography machine concept sector rose by 2.76%, ranking 10th among concept sectors, with 39 stocks increasing in value, including Baidao Chemical and Woge Optoelectronics hitting the daily limit [1] - Notable gainers in the sector included ChipMOS Technologies, which increased by 16.26%, followed by Maolai Optics at 8.69% and Wavelength Optoelectronics at 8.10% [1] - The stocks with the largest declines were Jiangfeng Electronics, Su Da Weige, and Kema Technology, which fell by 3.02%, 1.32%, and 0.94% respectively [1] Group 2 - The lithography machine concept sector saw a net inflow of 1.075 billion yuan, with 31 stocks receiving net inflows, and 7 stocks exceeding 100 million yuan in net inflow [2] - Baidao Chemical led the net inflow with 232 million yuan, followed by Jingfang Technology, Saiwei Electronics, and Dazhu Laser with net inflows of 171 million yuan, 153 million yuan, and 144 million yuan respectively [2] - The top net inflow ratios were recorded by Woge Optoelectronics at 19.57%, Baidao Chemical at 16.33%, and Juguang Technology at 9.33% [3] Group 3 - The trading performance of Baidao Chemical showed a daily increase of 10.01% with a turnover rate of 5.45% and a net inflow of 232.45 million yuan [3] - Jingfang Technology increased by 4.03% with a turnover rate of 11.80% and a net inflow of 171.48 million yuan [3] - Other notable performers included Saiwei Electronics with a 2.46% increase and a net inflow of 152.86 million yuan, and Dazhu Laser with a 6.72% increase and a net inflow of 144.47 million yuan [3][4]

Group 1 - The agricultural chemical sector increased by 1.52% on January 21, with Bai'ao Chemical leading the gains [1] - The Shanghai Composite Index closed at 4116.94, up 0.08%, while the Shenzhen Component Index closed at 14255.12, up 0.7% [1] - Bai'ao Chemical's stock price rose by 10.01% to 38.13, with a trading volume of 384,600 shares and a transaction value of 1.424 billion yuan [1] Group 2 - The agricultural chemical sector saw a net inflow of 1.297 billion yuan from main funds, while retail investors experienced a net outflow of 989 million yuan [2][3] - Salt Lake Co. had a main fund net inflow of 435 million yuan, but retail investors had a net outflow of 382 million yuan [3] - Bai'ao Chemical experienced a main fund net inflow of 230 million yuan, with retail investors seeing a net outflow of 119 million yuan [3]

大连百傲化学股份有限公司（以下简称"公司"）董事会近日收到副总经理刘松先生提交的辞职报告，刘 松先生因个人原因，申请辞去公司副总经理的职务。辞职后，刘松先生不再担任公司及子公司任何职 务。 证券代码：603360 证券简称：百傲化学 公告编号：2026-017 大连百傲化学股份有限公司 关于副总经理离任的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担法律责任。 重要内容提示： 一、提前离任的基本情况 ■ 二、离任对公司的影响 根据《中华人民共和国公司法》《公司章程》以及法律法规的相关规定，刘松先生的辞职报告自送达董 事会之日起生效。 截至本公告日，刘松先生直接持有公司股票数量为55,076股，辞职后，刘松先生将继续按照相关法律、 法规及规范性文件的规定对其股份进行管理。 刘松先生所负责的工作已经妥善交接，其职务变动不会对公司正常经营活动产生不利影响。刘松先生在 担任公司副总经理期间恪尽职守、勤勉尽责，公司及董事会对刘松先生在任职期间为公司发展所做出的 贡献表示衷心的感谢！ 特此公告。 大连百傲化学股份有限公司董事会 2026年1月 ...