FF305 翌日披露報表 (股份發行人 ── 已發行股份或庫存股份變動、股份購回及/或在場内出售庫存股份) 表格類別： 股票 狀態： 新提交 公司名稱： 山東天岳先進科技股份有限公司 呈交日期： 2025年9月17日 如上市發行人的已發行股份或庫存股份出現變動而須根據《香港聯合交易所有限公司（「香港聯交所」）證券上市規則》(「《主板上市規則》」)第13.25A條 / 《香港聯合交易所有限公司GEM證券 上市規則》(「《GEM上市規則》」)第17.27A條作出披露，必須填妥第一章節 。 | 第一章節 | | | | | | | | --- | --- | --- | --- | --- | --- | --- | | 1. 股份分類 普通股 | 股份類別 H | | 於香港聯交所上市 | 是 | | | | 證券代號 (如上市) 02631 | H 股 說明 | | | | | | | A. 已發行股份或庫存股份變動 | | | | | | | | | 已發行股份（不包括庫存股份）變動 | | 庫存股份變動 | | | | | 事件 | 已發行股份（不包括庫存股份）數 目 | 佔有關事件前的現有已發 行股份（不 ...

智通财经APP讯，天岳先进(02631)发布公告，于2025年9月17日根据悉数行使超额配股权而发行及配发 716.18万股H股股份。 ...

天岳先进(02631)发布公告，于2025年9月17日根据悉数行使超额配股权而发行及配发716.18万股H股股 份。 ...

Group 1 - Silicon carbide (SiC) is a third-generation wide bandgap semiconductor material that significantly outperforms traditional silicon-based devices in high-temperature, high-voltage, and high-frequency applications, making it widely used in electric vehicles, photovoltaic energy storage, and 5G communication [1] - The explosive growth of AI computing power has created a new demand for SiC, which addresses the heat dissipation challenges of high-power chips and supports energy efficiency upgrades in data centers [2][4] - SiC's thermal conductivity reaches 490W/mK, over three times that of silicon, and its thermal expansion coefficient is well-matched with chip materials, enhancing heat dissipation and packaging stability [4] Group 2 - NVIDIA's H100 GPU has a power consumption of 700W, with the next-generation Rubin processor expected to exceed 1000W, highlighting the limitations of traditional silicon intermediates [2] - NVIDIA plans to replace silicon intermediates in its CoWoS packaging with SiC, resulting in a temperature drop from 95°C to 75°C for the H100 chip, reducing cooling costs by 30% and doubling chip lifespan [4] - By 2027, SiC intermediates are expected to meet 10% of high-end GPU demand, as TSMC advances SiC packaging technology [6] Group 3 - The demand for electricity in AI data centers is projected to increase nearly 100-fold, necessitating a shift from traditional 54V power supply architectures to an 800V high-voltage direct current (HVDC) framework [7] - Implementing SiC devices in data centers can reduce copper usage by 45% and save over $100,000 in electricity costs annually for every 10MW data center, significantly improving energy efficiency [7] Group 4 - The silicon carbide supply chain has the highest technical barriers and value concentration in the substrate segment, which accounts for 47% of total device costs [11] - Tianyue Advanced is a leading domestic supplier of SiC substrates, holding over 50% market share in China and 22.8% globally, focusing on automotive-grade and power device sectors [12] - Tianjie Heda, another key player, has a significant market share in 6-inch substrates and is positioned to benefit from the growing demand in the photovoltaic sector [13] Group 5 - Jing Sheng Mechanical and Electrical is a leading domestic semiconductor equipment manufacturer, achieving a dual advantage in equipment manufacturing and material production in the SiC sector [15] - The company has developed core equipment for the entire substrate processing chain, enabling a 30% reduction in substrate processing costs [16] - By 2025, Jing Sheng plans to expand its production capacity significantly, supported by substantial investments from national funds [16]

（文章来源：每日经济新闻） 每经AI快讯，9月16日，港股天岳先进(02631.HK)涨超5%，截至发稿，涨5.17%，报62港元，成交额2.7 亿港元。 ...

Core Viewpoint - Tianyue Advanced (02631) has seen a stock price increase of over 5%, attributed to its inclusion in the Hong Kong Stock Connect list and advancements in silicon carbide substrate applications [1] Group 1: Stock Performance - Tianyue Advanced's stock rose by 5.17%, reaching HKD 62, with a trading volume of HKD 270 million [1] Group 2: Market Announcements - The Shanghai and Shenzhen Stock Exchanges announced that Tianyue Advanced will be added to the Hong Kong Stock Connect list effective September 15, following the end of its price stabilization period in the Hong Kong market and after 10 trading days of A-share listing [1] Group 3: Technological Developments - NVIDIA plans to replace silicon with silicon carbide in the advanced packaging process of its next-generation Rubin processors, which is expected to enhance performance [1] - According to Dongfang Securities, silicon carbide's excellent thermal conductivity presents application potential in high-heat environments, benefiting related manufacturers like Tianyue Advanced [1] Group 4: Product Applications - Tianyue Advanced's silicon carbide substrates are applicable in power semiconductor devices, RF semiconductor devices, optical waveguides, TF-SAW filters, and thermal components [1] - Key industries for these applications include electric vehicles, photovoltaics, energy storage systems, power grids, rail transportation, communications, AI glasses, smartphones, and semiconductor lasers [1] - The company's silicon carbide substrates are utilized by clients to manufacture power electronic devices, which are then used in end products across various sectors, including electric vehicles, AI data centers, and photovoltaic systems [1]

Group 1 - Tianyue Advanced (02631) shares increased by over 5%, reaching HKD 62 with a trading volume of HKD 270 million [1] - The Shanghai and Shenzhen Stock Exchanges announced the inclusion of Tianyue Advanced in the Hong Kong Stock Connect eligible securities list, effective from September 15, following the end of the price stabilization period in the Hong Kong market and the completion of 10 trading days since its A-share listing [1] - NVIDIA plans to replace silicon with silicon carbide in the intermediate substrate material of its next-generation Rubin processor to enhance performance, which may benefit related manufacturers, including Tianyue Advanced [1] Group 2 - Tianyue Advanced stated that its silicon carbide substrates can be widely applied in power semiconductor devices, RF semiconductor devices, optical waveguides, TF-SAW filters, and heat dissipation components, with key industries including electric vehicles, photovoltaics, energy storage systems, power grids, rail transportation, communications, AI glasses, smartphones, and semiconductor lasers [1] - The company's silicon carbide substrates are used by clients to produce power electronic devices, which are ultimately applied in various end products such as electric vehicles, AI data centers, and photovoltaic systems [1]

Group 1 - Yihau New Materials plans to reduce its shareholding by up to 1% of the company's total shares, amounting to 165,500 shares, due to personal funding needs [1] - Fuxing Pharmaceutical's subsidiary has received approval for a new indication for its drug, which is used in the treatment of certain types of breast cancer [1][2] - Shantui Co. has submitted its H-share issuance application to the China Securities Regulatory Commission, which has been accepted [3] Group 2 - Sierte's chairman plans to increase his shareholding by an amount between 3 million to 6 million yuan [4] - Borui Pharmaceutical's BGM0504 tablet has received approval for clinical trials in overweight and obese adults [5] - Ganyue Expressway reported vehicle toll service revenue of 349 million yuan for August [6] Group 3 - Chip Microelectronics has submitted its H-share issuance application to the China Securities Regulatory Commission, which has been accepted [7] - Lingrui Pharmaceutical's director plans to reduce his shareholding by up to 200,000 shares, representing 0.0353% of the total shares [8] - Jiahu Energy has adjusted its share repurchase price limit to 11.63 yuan per share [10] Group 4 - Spring Airlines reported a year-on-year increase of 12.23% in passenger turnover for August [11] - Kaida has received an invention patent for a self-calibrating sensor technology [12] - Chuanheng Co. has obtained a new utility model patent aimed at improving industrial waste utilization [14] Group 5 - Huashi Technology received a government subsidy of 2.21 million yuan, accounting for 22.71% of its latest audited net profit [15] - Shanghai Pharmaceuticals' controlling shareholder plans to increase its H-share holdings by up to 74 million shares [16] - Hongrun Construction has won a bid for a significant segment of the Shanghai Metro Line 21 project, valued at 126 million yuan [18] Group 6 - Sanfangxiang plans to invest 100 million yuan to establish a wholly-owned subsidiary focused on green technology [19] - Lao Fengxiang's subsidiaries plan to jointly invest in luxury goods sales and gold refining companies [20][21] - China Eastern Airlines reported an 8.72% year-on-year increase in passenger turnover for August [22] Group 7 - Inner Mongolia First Machinery has signed a railway freight car procurement contract worth 186 million yuan [22] - Jiuqiang Bio has received five invention patents related to diagnostic reagents [24] - Longmag Technology plans to invest 210 million yuan in its second phase project in Vietnam [25] Group 8 - Galaxy Magnetics plans to acquire 100% equity of Kyoto Longtai, with its stock suspended for trading [26] - Jinlong Co.'s controlling shareholder will have 30 million shares auctioned [27] - Haishi Co.'s controlling shareholder has released the pledge on 29.97 million shares [28] Group 9 - Qiu Tianwei plans to reduce its shareholding by up to 1.17% of the total shares [29] - Xiaocheng Technology's directors plan to reduce their shareholding by a total of 0.08% [30] - Victory Co. reported that Sunshine Life Insurance has reduced its shareholding by 4.4 million shares [31] Group 10 - Xindong Technology plans to distribute a cash dividend of 0.156 yuan per share [32] - Huaqin Technology plans to distribute a cash dividend of 0.13 yuan per share [33] - Kexing Pharmaceutical's controlling shareholder intends to transfer 5% of the company's shares [35] Group 11 - Guojin Securities has completed the repayment of its second short-term financing bond for 1.0205 billion yuan [38] - Chunhui Intelligent Control's application for asset acquisition has been accepted by the Shenzhen Stock Exchange [39] - Chaohongji has submitted its H-share issuance application to the Hong Kong Stock Exchange [40] Group 12 - Tianyue Advanced has fully exercised its over-allotment option, involving 716,180 H-shares [40] - Chengfeng Technology's vice president has resigned due to internal adjustments [41] - Yingpais plans to establish a 100 million yuan technology sports industry investment fund [43]

Group 1 - The core point of the article is that Tianyue Advanced (02631) has been added to the Hong Kong Stock Connect eligible securities list due to the end of its price stabilization period in the Hong Kong market and after being listed on the A-share market for 10 trading days [1] Group 2 - The effective date for this inclusion in the Hong Kong Stock Connect is September 15 [1]

Core Viewpoint - Tianyue Advanced (02631) has seen a significant increase in stock price, rising over 7% following its inclusion in the Hong Kong Stock Connect program, effective from September 15 [1] Group 1: Company Performance - Tianyue Advanced's stock opened up over 7% and is currently trading at 61.9 HKD with a transaction volume of 11.33 million HKD [1] - The company is recognized as a leading player in silicon carbide substrates and has successfully expanded its overseas customer base [1] Group 2: Market Developments - The Shanghai and Shenzhen Stock Exchanges announced the inclusion of Tianyue Advanced in the Hong Kong Stock Connect eligible securities list, marking a significant milestone for the company [1] - The company has established business partnerships with over half of the top ten global power semiconductor manufacturers [1] Group 3: Product Applications - Tianyue Advanced is actively expanding its overseas market presence, with high-quality conductive silicon carbide substrate products being adopted in various sectors [1] - The company's products are utilized in electric vehicles, AI data centers, and photovoltaic systems, indicating a diverse application range [1]