Group 1 - Tianyue Advanced (02631.HK) announced that the overall coordinator and underwriters fully exercised the over-allotment option as of September 14, 2025, involving a total of 7,161,800 H-shares, accounting for approximately 15.0% of the initially available shares for subscription under the global offering [1] - The over-allotted shares will be issued at a price of HKD 42.80 per H-share, which is the same as the global offering price, excluding various fees [1] - The over-allotted shares will be used to expedite the delivery of H-shares to subscribers who agreed to delay their delivery under the global offering [1] Group 2 - The stabilization period for the global offering ended on September 14, 2025, which is 30 days after the deadline for submitting applications for the Hong Kong public offering [1]

根据香港法例第571W章证券及期货(稳定价格)规则第9(2)条，公司进一步宣布，全球发售的稳定价格期 间已于2025年9月14日(星期日)即递交香港公开发售申请截止日期后第30天)结束。 智通财经APP讯，天岳先进(02631)公布，招股章程所述超额配股权已于2025年9月14日(星期日)获保荐 人兼整体协调人(为其本身及代表国际包销商)悉数行使，涉及合共716.18万股H股，占全球发售项下初 步可供认购的发售股份总数约15.0%(于任何超额配股权获行使前)。超额配发股份将由公司按每股H股 42.80港元配发及发行。超额配发股份将用于加快向同意延迟交付其根据全球发售认购的相关H股的承配 人交付部分H股。 ...

天岳先进(02631)公布，招股章程所述超额配股权已于2025年9月14日(星期日)获保荐人兼整体协调人(为 其本身及代表国际包销商)悉数行使，涉及合共716.18万股H股，占全球发售项下初步可供认购的发售股 份总数约15.0%(于任何超额配股权获行使前)。超额配发股份将由公司按每股H股42.80港元配发及发 行。超额配发股份将用于加快向同意延迟交付其根据全球发售认购的相关H股的承配人交付部分H股。 根据香港法例第571W章证券及期货(稳定价格)规则第9(2)条，公司进一步宣布，全球发售的稳定价格期 间已于2025年9月14日(星期日)即递交香港公开发售申请截止日期后第30天)结束。 ...

超额配售股份将按发售价每股42.80港元配发及发行。超额配发股份将用于加快向同意延迟交付其根据 全球发售认购的相关发售股份的承配人交付部分H股。前述超额配售权悉数行使后，本次发行上市的H 股由47,745,700股增加至54,907,500股。香港联交所已批准该等超额配售股份上市及买卖，预计将于2025 年9月17日(星期三)上午9时开始在香港联交所主板上市交易。 本次发行有关全球发售的稳定价格期已于2025年9月14日(星期日)(即递交香港公开发售申请截止日期后 第30日)结束。 格隆汇9月14日丨天岳先进(688234.SH)公布，公司发行的47,745,700股境外上市外资股(H股)已在香港联 交所主板挂牌并上市交易。根据发行方案，招股章程所述超额配售权已于2025年9月14日获悉数行使， 涉及合计7,161,800股H股股份。 ...

A 股证券代码：688234 证券简称：天岳先进 公告编号：2025-063 港股证券代码：02631 证券简称：天岳先进 山东天岳先进科技股份有限公司 关于悉数行使超额配售权、稳定价格行动 及稳定价格期结束的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、悉数行使超额配售权情况 经香港联合交易所有限公司（以下简称"香港联交所"）批准，山东天岳先 进科技股份有限公司（以下简称"公司"）发行的 47,745,700 股（行使超额配售 权之前）境外上市外资股（H 股）已于 2025 年 8 月 20 日在香港联交所主板挂牌 并上市交易（以下简称"本次发行上市"）。公司 H 股股票中文简称为"天岳先 进"，英文简称为"SICC"，股份代号为"2631"，具体内容详见公司于 2025 年 8 月 21 日在上海证券交易所网站（www.sse.com.cn）披露的《关于境外上市外资 股（H 股）挂牌并上市交易的公告》（公告编号：2025-055）。 根据本次发行方案，招股章程所述超额配售权已于 2025 年 9 月 14 ...

Core Viewpoint - Tianyue Advanced (688234.SH) has seen significant stock price increases recently, driven by the growing demand for silicon carbide (SiC) substrates in the semiconductor industry, particularly in AI applications [1][2][4] Group 1: Stock Performance - On September 11, Tianyue Advanced's stock price rose over 10%, and on September 12, it continued to increase, reaching a high of 99.88 CNY per share, closing at 90.71 CNY, a 0.8% increase [1] - The stock had previously surged on September 5, hitting a daily limit increase and closing at 77.28 CNY [1] - In the Hong Kong market, Tianyue Advanced (02631.HK) also performed well, with stock price increases of 18.24% on September 5, 10.12% on September 11, and 8.26% on September 12 [5] Group 2: Company Overview - Tianyue Advanced is a leading domestic producer of wide bandgap semiconductor materials, focusing on the research, production, and sales of silicon carbide semiconductor materials, including semi-insulating and conductive SiC substrates [1][4] - The company was established in 2010, headquartered in Jinan, and became the only listed company in the SiC substrate field when it went public on the Shanghai Stock Exchange's Sci-Tech Innovation Board in 2022. It also listed on the Hong Kong Stock Exchange in August 2023, making it the only "A+H" listed SiC substrate company [4] Group 3: Industry Applications - Tianyue Advanced's SiC substrates are widely used in power semiconductor devices, RF semiconductor devices, optical waveguides, TF-SAW filters, and thermal components, with applications in electric vehicles, photovoltaics, energy storage systems, power grids, rail transportation, communications, AI glasses, smartphones, and semiconductor lasers [1] - The company has established business relationships with over half of the top ten power semiconductor manufacturers globally, with clients like Infineon and ON Semiconductor successfully entering the supply chains of industry giants like NVIDIA [2]

Group 1 - Tianyue Advanced (02631) is expected to be included in the Hong Kong Stock Connect after the price stabilization period, which typically lasts for 30 days, with predictions for inclusion around September 15 or mid to late September [1] - Inclusion in the Hong Kong Stock Connect is anticipated to attract more southbound funds, enhance market liquidity, and increase the company's visibility in the capital market, which may also boost the entire silicon carbide industry chain [1] - The stock price has shown a significant upward trend, with an increase of over 30% since September, and on September 12, the stock price surged by as much as 15%, approaching a market capitalization of 30 billion HKD [1] Group 2 - Tianyue Advanced is recognized as a leading company in the domestic silicon carbide substrate sector, having achieved mass production of 8-inch substrates and being the first to launch 12-inch substrate products, demonstrating technological leadership [2] - The company's customer base includes top international semiconductor manufacturers such as Infineon, Bosch, and ON Semiconductor, with applications in electric vehicles, AI data centers, and photovoltaics, indicating strong customer recognition and downstream expansion capabilities [2]

Group 1 - Tianyue Advanced (02631) is expected to be included in the Hong Kong Stock Connect after the price stabilization period, which typically lasts for 30 days, with predictions for inclusion around September 15 or mid to late September [1][2] - Inclusion in the Hong Kong Stock Connect is anticipated to attract more southbound capital, enhance market liquidity, and increase the company's visibility in the capital market, which may also boost the entire silicon carbide industry chain [1] - Historical data indicates that stocks included in the Hong Kong Stock Connect often experience significant short-term benefits, with passive funds, especially ETF funds tracking related indices, likely to buy in for allocation needs, providing support for the stock price [1] Group 2 - Tianyue Advanced is recognized as a leading company in the domestic silicon carbide substrate sector, having achieved mass production of 8-inch substrates and being the first to launch 12-inch substrate products, demonstrating technological leadership [2] - The company's customer base includes top international semiconductor manufacturers such as Infineon, Bosch, and ON Semiconductor, with applications in electric vehicles, AI data centers, and photovoltaics, showcasing strong customer recognition and downstream expansion capabilities [2]

每经AI快讯，9月12日，天岳先进(02631.HK)午后涨幅扩大至15%，总市值逼近300亿港元。截至发稿， 涨14.26%，报60.9港元，成交额3.87亿港元。 （文章来源：每日经济新闻） ...

Core Viewpoint - Tianyue Advanced (02631) has seen a significant stock price increase, with a rise of 15% and a market capitalization approaching HKD 30 billion, driven by developments in silicon carbide substrate applications in advanced packaging for next-generation GPU chips [1] Group 1: Company Developments - Tianyue Advanced's stock price rose by 14.26% to HKD 60.9, with a trading volume of HKD 387 million [1] - The company is positioned as a leader in the silicon carbide substrate industry, which is gaining attention due to its potential applications in high-performance computing chips [1] Group 2: Industry Trends - NVIDIA plans to use silicon carbide substrates in the advanced packaging of its next-generation GPU chips, indicating a shift in material usage [1] - TSMC is also planning to apply 12-inch single crystal silicon carbide for thermal substrates, replacing traditional materials like aluminum oxide, sapphire, or ceramic substrates [1] - Despite concerns about the saturation of silicon carbide in the electric vehicle sector, there is still significant untapped potential for its application in high-end computing chips, particularly in advanced packaging [1]