Group 1 - Northern Huachuang is a leading domestic semiconductor equipment manufacturer, covering core process equipment such as etching machines, thin film deposition equipment, and cleaning machines, which are essential for memory chip manufacturing [1] - The company is expected to benefit from the growth in equipment orders driven by the expansion and technological upgrades of domestic memory manufacturers during the memory chip price increase cycle [1] - Northern Huachuang has made breakthroughs in advanced process equipment for 3D NAND and HBM, establishing a core competitive advantage in the global memory equipment market [1] Group 2 - Hua Hong Semiconductor is a leading domestic specialty process manufacturer with mature memory chip foundry capabilities, focusing on NOR Flash, eMMC, and SPI NAND [2] - The company is expected to benefit from the rising demand for memory chip foundry services as domestic memory manufacturers expand production [2] - Hua Hong's layout in automotive-grade memory chip foundry will further enhance its resilience against economic cycles [2] Group 3 - Zhongwei Company is a core supplier of etching equipment, with its 5nm etching machine already integrated into the supply chain of memory manufacturers [3] - The demand for high-end equipment is expected to grow due to the trend of upgrading memory chips to advanced processes like 3D NAND and HBM [3] - Zhongwei's layout in thin film deposition equipment enhances its service capabilities for memory manufacturers [3] Group 4 - Lanke Technology is a global leader in memory interface chips, with its products widely used in servers and PCs, holding a leading share in the DDR5 interface chip market [4] - The demand for DDR5 interface chips is expected to surge due to the explosion in AI server and high-end PC demand during the memory chip price increase cycle [4] - Lanke's breakthroughs in HBM interface chips will further open up growth opportunities [4] Group 5 - GigaDevice is a leading domestic memory chip design company, focusing on NOR Flash while also expanding into NAND Flash and DRAM [5] - The company is expected to benefit from the price increase of NOR Flash products driven by the recovery of consumer electronics and AI terminal demand [5] - GigaDevice's layout in automotive-grade memory chips will further expand its downstream application space [5] Group 6 - Shengyi Technology is a leading domestic copper-clad laminate manufacturer, with its products being core raw materials for memory chip packaging [6][7] - The growth in demand for copper-clad laminates is expected to be driven by the expansion of memory manufacturers and the increase in packaging needs during the memory chip price increase cycle [6][7] - Shengyi's breakthroughs in high-frequency and high-speed copper-clad laminates will adapt to the upgrade demands of memory chips [6][7] Group 7 - Shenzhen South Circuit is a leading domestic PCB manufacturer, with its high-end PCB products being core carriers for storage servers and modules [8] - The demand for high-end PCBs is expected to grow due to the explosion in AI server demand and the expansion of memory manufacturers during the memory chip price increase cycle [8] - Shenzhen South Circuit's layout in storage packaging substrates further enhances its position in the memory industry chain [8] Group 8 - Jiangbolong is a leading domestic storage module manufacturer, focusing on the development and manufacturing of storage modules for various applications [9] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [9] - Jiangbolong's layout in automotive-grade storage modules will further open up downstream application spaces [9] Group 9 - Xi'an Yicai is a core enterprise in semiconductor materials, focusing on silicon-based materials essential for memory chip manufacturing [10] - The demand for silicon-based materials is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [10] - Xi'an Yicai's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [10] Group 10 - Tuojing Technology is a leading domestic thin film deposition equipment manufacturer, with its PECVD and ALD equipment being core process equipment for memory chip manufacturing [11] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of 3D NAND technology during the memory chip price increase cycle [11] - Tuojing's layout in HBM-related equipment will further adapt to the upgrade demands driven by AI [11] Group 11 - Maiwei Co. is a core domestic semiconductor equipment enterprise, with its equipment already integrated into the supply chain of leading domestic memory manufacturers [12] - The growth in equipment orders is expected to be driven by the expansion of memory manufacturers and the increase in advanced packaging demand during the memory chip price increase cycle [12] - Maiwei's breakthroughs in HBM packaging equipment will adapt to the upgrade demands driven by AI [12] Group 12 - Shengmei Shanghai is a leading domestic semiconductor cleaning equipment manufacturer, with its single-wafer cleaning equipment integrated into the supply chain of leading memory manufacturers [13] - The demand for cleaning equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [13] - Shengmei's breakthroughs in 3D NAND cleaning technology will adapt to the technical iteration needs of memory chips [13] Group 13 - Changdian Technology is a leading domestic packaging and testing enterprise, covering the packaging and testing of various memory chip types [14] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [14] - Changdian's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [14] Group 14 - Changchuan Technology is a leading domestic semiconductor testing equipment manufacturer, with its testing equipment covering memory and logic chips [15] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [15] - Changchuan's breakthroughs in DDR5 and HBM testing technologies will adapt to the upgrade demands driven by AI [15] Group 15 - Baiwei Storage is a leading domestic storage chip design and module manufacturer, focusing on various storage modules for different applications [16] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [16] - Baiwei's layout in automotive-grade storage will further open up downstream application spaces [16] Group 16 - China Resources Microelectronics is a leading domestic power semiconductor and storage chip manufacturer, focusing on NOR Flash and eMMC [17] - The company is expected to benefit from the recovery in consumer electronics and industrial control demand during the memory chip price increase cycle [17] - China Resources' layout in automotive-grade storage chips will enhance its resilience against economic cycles [17] Group 17 - Tongfu Microelectronics is a core domestic packaging enterprise, covering the packaging of various memory chip types [18] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [18] - Tongfu's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [18] Group 18 - Yitang Co. is a core domestic semiconductor equipment enterprise, focusing on thin film deposition and rapid thermal processing equipment [19] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [19] - Yitang's breakthroughs in 3D NAND-related equipment will adapt to the technical iteration needs of memory chips [19] Group 19 - Jingsheng Mechanical and Electrical is a leading domestic semiconductor silicon wafer equipment manufacturer, with its equipment integrated into the supply chain of leading memory manufacturers [20] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the increase in silicon wafer demand during the memory chip price increase cycle [20] - Jingsheng's breakthroughs in 300mm large silicon wafer equipment will adapt to the advanced process needs of domestic storage [20] Group 20 - Xichuang Data is a leading domestic storage module and smart terminal manufacturer, focusing on various storage modules for different applications [21] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [21] - Xichuang's layout in automotive-grade storage will further open up downstream application spaces [21] Group 21 - Shannon Chip is a leading domestic storage chip distribution and solution provider, focusing on distribution and technical services for storage chips [22] - The growth in distribution revenue is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [22] - Shannon's layout in storage module solutions will enhance customer stickiness [22] Group 22 - Hushi Silicon Industry is a leading domestic semiconductor silicon wafer manufacturer, covering various specifications essential for memory chip manufacturing [23] - The demand for silicon wafers is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [23] - Hushi's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [23] Group 23 - Unisoc is a leading domestic security chip and storage chip manufacturer, focusing on eMMC and UFS [24] - The company is expected to benefit from the recovery in consumer electronics and the growth in security storage demand during the memory chip price increase cycle [24] - Unisoc's layout in automotive-grade storage chips will enhance its resilience against economic cycles [24] Group 24 - Fudan Microelectronics is a leading domestic FPGA and storage chip manufacturer, covering various storage chip types [25] - The growth in demand for storage products is expected to be driven by the increase in industrial control demand and the acceleration of domestic substitution during the memory chip price increase cycle [25] - Fudan's layout in automotive-grade storage chips will further open up downstream application spaces [25] Group 25 - Zhongke Feicai is a leading domestic semiconductor testing equipment manufacturer, covering testing equipment for memory and logic chips [26] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [26] - Zhongke's breakthroughs in 3D NAND testing technology will adapt to the technical iteration needs of memory chips [26] Group 26 - Huahai Qingke is a leading domestic chemical mechanical polishing (CMP) equipment manufacturer, with its CMP equipment integrated into the supply chain of leading memory manufacturers [27] - The demand for CMP equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [27] - Huahai's breakthroughs in 3D NAND polishing technology will adapt to the technical iteration needs of memory chips [27]

股票简称：德明利 股票代码：001309 深圳市德明利技术股份有限公司 （Shenzhen Techwinsemi Technology Co., Ltd.） （深圳市福田区梅林街道梅都社区中康路 136 号深圳新一代产业园 1 栋 2301、2401、2501） 2025 年度向特定对象发行股票 并在主板上市 募集说明书 保荐机构（主承销商） （深圳市前海深港合作区南山街道桂湾五路128号前海深港基金小镇B7栋401） 公告日期：二〇二六年二月 重大事项提示 本公司特别提请投资者注意，在作出投资决策之前，务必仔细阅读本募集说 明书正文内容，并特别关注以下重要事项。 一、重大风险提示 公司特别提醒投资者仔细阅读本募集说明书"第七节 与本次发行相关的风 险因素"全文，并特别注意以下风险： （一）上游晶圆等原材料紧缺和价格波动的风险 晶圆等原材料紧缺可能对公司的生产经营造成不利影响。公司生产的产品主 要为闪存和内存模组，产成品的成本构成中 NAND Flash 和 DRAM 存储晶圆的 占比较高，全球 NAND Flash 和 DRAM 存储晶圆供应商只有三星电子、海力士、 美光、西部数据/闪迪、铠侠、长江存储、 ...

关于深圳市德明利技术股份有限公司 2025 年度向特定对象发行股票 并在主板上市 之 发行保荐书 保荐人（主承销商） （深圳市前海深港合作区南山街道桂湾五路128号前海深港基金小镇B7栋401） 3-1-0 发行保荐书 华泰联合证券有限责任公司 关于深圳市德明利技术股份有限公司 2025 年度向特定对象发行股票并在主板上市之发行保荐书 深圳市德明利技术股份有限公司（以下简称"发行人""德明利"）申请向特 定对象发行股票并在主板上市，依据《公司法》《证券法》《上市公司证券发行注 册管理办法》（以下简称《再融资注册办法》）《深圳证券交易所上市公司证券发 行上市审核规则》（以下简称《审核规则》）等相关的法律、法规的有关规定，提 交发行申请文件。华泰联合证券有限责任公司（以下简称"华泰联合证券""保 荐人"）作为其本次发行的保荐人，武祎玮和滕强作为具体负责推荐的保荐代表 人，特为其出具本发行保荐书。 保荐人华泰联合证券、保荐代表人武祎玮和滕强承诺：本保荐人和保荐代表 人根据《公司法》《证券法》等有关法律、法规和中国证监会、深圳证券交易所 的有关规定，诚实守信、勤勉尽责，严格按照依法制定的业务规则、行业执业规 范和道德 ...

邮编 100083 电话 Telephone：+86（10）82330558 传真 Fax： +86（10）82327668 网址 Internet： www.daxincpa.com.cn 大信会计师事务所 北京市海淀区知春路 1 号 学院国际大厦 22 层 2206 WUYIGE Certified Public Accountants.LLP Room 2206 22/F, Xueyuan International Tower No.1 Zhichun Road, Haidian Dist. 大信会计师事务所（特殊普通合伙） 《关于深圳市德明利技术股份有限公司申请向特定对象发行股 票的审核问询函》之回复 大信备字[2026]第 5-00003 号 深圳证券交易所: 贵所于 2026 年 1 月 20 日下发的《关于深圳市德明利技术股份有限公司申请向特定对 象发行股票的审核问询函》（审核函〔2026〕120004 号）（以下简称"问询函"）已经收悉， 大信会计师事务所(特殊普通合伙)(以下简称"本所")对问询函中提到的需要本所发表核查 意见的事项进行了审慎核查，现将有关问题的核查意见回复如下： 问题 1 ...

关于深圳市德明利技术股份有限公司 申请向特定对象发行股票 的审核问询函的回复 保荐人（主承销商） （深圳市前海深港合作区南山街道桂湾五路 128 号前海深港基金小镇 B7 栋 401） 1-1 深圳证券交易所： 深圳市德明利技术股份有限公司（以下简称"公司"、"发行人"或"德明 利"）收到贵所于 2026 年 1 月 20 日下发的《关于深圳市德明利技术股份有限公 司申请向特定对象发行股票的审核问询函》（审核函〔2026〕120004 号）（以下 简称"问询函"），公司已会同华泰联合证券有限责任公司（以下简称"华泰联 合证券"、"保荐人"）、广东信达律师事务所（以下简称"律师"）、大信会计师 事务所（特殊普通合伙）（以下简称"会计师"）进行了认真研究和落实，并按 照问询函的要求对所涉及的事项进行了资料补充和问题回复，现提交贵所，请 予以审核。 除非文义另有所指，本问询函回复中的简称与《深圳市德明利技术股份有 限公司向特定对象发行股票并在主板上市募集说明书》（以下简称"募集说明 书"）中的释义具有相同涵义。 本问询函回复的字体说明如下： | 问询函所列问题 | 黑体 | | --- | --- | | 对问询函 ...

关于深圳市德明利技术股份有限公司 2025 年度向特定对象发行股票的 补充法律意见书（一） 2025年度向特定对象发行股票的 补充法律意见书（一） 信达再意字（2025）第 003-1 号 中国 深圳 福田区 益田路6001号太平金融大厦11、12楼 邮政编码：518038 11&12F, TAIPING FINANCE TOWER, 6001 YITIAN ROAD, FUTIAN, SHENZHEN, CHINA 电话（Tel.）：（0755）88265288 传真（Fax.）：（0755）88265537 网址（Website）：www.sundiallawfirm.com 补充法律意见书（一） 广东信达律师事务所 关于深圳市德明利技术股份有限公司 致：深圳市德明利技术股份有限公司 广东信达律师事务所根据与深圳市德明利技术股份有限公司（以下简称"德 明利""公司"或"发行人"）签订的《专项法律顾问聘请协议》，接受公司的 委托担任公司 2025 年度向特定对象发行股票的特聘专项法律顾问，并于 2025 年 12 月 25 日出具了《广东信达律师事务所关于深圳市德明利技术股份有限公司 2025 年度向特定对 ...

上市保荐书 华泰联合证券有限责任公司关于 深圳市德明利技术股份有限公司 2025 年度向特定对象发行 股票并在主板上市之上市保荐书 作为深圳市德明利技术股份有限公司（以下简称"发行人""公司"）2025 年度向特定对象发行股票并在主板上市的保荐人，华泰联合证券有限责任公司及 其保荐代表人已根据《中华人民共和国公司法》（以下简称《公司法》）、《中华人 民共和国证券法》（以下简称《证券法》）等法律法规和中国证券监督管理委员会 （以下简称"中国证监会"）及深圳证券交易所的有关规定，诚实守信，勤勉尽 责，严格按照依法制定的业务规则和行业自律规范出具上市保荐书，并保证所出 具文件真实、准确、完整。 现将有关情况报告如下： 一、发行人基本情况 （一）发行人概况 发行人名称：深圳市德明利技术股份有限公司 注册地址：广东省深圳市福田区梅林街道梅都社区中康路 136 号深圳新一代 产业园 1 栋 2301、2401、2501 注册时间：2008 年 11 月 20 日 联系方式：0755-23579117 （二）发行人的主营业务 公司是一家专注于存储领域的解决方案提供商，以集成电路设计与研发为核 心技术根基，核心能力源于自主可 ...

证券代码：001309 证券简称：德明利 公告编号：2026-003 深圳市德明利技术股份有限公司 关于公司 2025 年向特定对象发行股票的审核问询函回复及募集说明 书等申请文件更新的提示性公告 深圳市德明利技术股份有限公司（以下简称"公司"）于 2026 年 1 月 20 日收到深圳证券交易所（以下简称"深交所"）出具的《关于深圳市 德明利技术股份有限公司申请向特定对象发行股票的审核问询函》（审核 函〔2026〕120004 号）（以下简称"问询函"），深交所上市审核中心对 公司提交的向特定对象发行股票的申请文件进行了审核，并形成了审核问 询问题。 公司在收到问询函后，会同中介机构对问询函所列问题进行了认真研 究和逐项落实，结合公司《2025 年第三季度报告》的内容，按照问询函的 要求对所涉及的事项进行了资料补充和回复，同时对募集说明书等申请文 件中涉及相关内容进行了更新，具体内容详见公司于同日在巨潮资讯网 （www.cninfo.com.cn）披露的相关公告文件。 公司本次向特定对象发行股票事项尚需通过深交所审核，并获得中国 证券监督管理委员会（以下简称"中国证监会"）作出同意注册的决定后 方可实施，最 ...

证券日报网讯 2月3日，德明利在互动平台回答投资者提问时表示，2026年1月31日并非定期持有人名册 下发日，公司无法获悉当天股东人数。截至最近一期定期持有人名册下发日，即2026年1月30日公司含 信用账户合并股东名册的股东数为65287户。 （文章来源：证券日报） ...

Investment Rating - The industry investment rating is maintained as "Positive" [4] Core Insights - The demand for AI computing power is driving a persistent shortage in storage [2][8] - Major storage companies are experiencing strong performance, with AI demand expected to continue creating incremental opportunities [6] - The supply of niche storage is under pressure from mainstream storage, leading to a sustained tight supply situation [7] Summary by Sections Investment Recommendations and Targets - Key investment targets include domestic storage chip design companies such as Zhaoyi Innovation, Puran, Jucheng, Dongxin, Beijing Junzheng, and Hengsuo [2][8] - Domestic storage module manufacturers like Jiangbolong, Demingli, and Baiwei Storage are also highlighted [2] - Companies benefiting from storage technology iterations include Lanke Technology, Lianyun Technology, and Aojie Technology [2] - Semiconductor equipment firms such as Zhongwei Company, Jingzhida, and Beifang Huachuang are recommended [2] - Domestic packaging and testing companies like Shentek, Huicheng, and Tongfu Microelectronics are included in the investment targets [2] Market Dynamics - TrendForce has revised upward the price growth rates for DRAM and NAND Flash products for the first quarter, with DRAM contract prices expected to rise by 90-95% and NAND Flash by 55-60% [7] - AI computing demand is becoming the dominant factor in storage demand, with significant price increases anticipated for Server DRAM and Enterprise SSDs [7] - The AI inference process is expected to significantly alter data center storage structures, leading to increased demand for active data storage [7] Niche Storage Supply - Niche storage products like NOR Flash and MLC/SLC NAND Flash are expected to remain in tight supply due to reduced production from major suppliers focusing on mainstream products [7] - The global capacity for MLC NAND Flash is projected to decrease by 41.7% in 2026 due to supply constraints [7]