通富微电：大多数世界前20强半导体企业和绝大多数国内知名集成电路设计公司都已成为公司客户 金十数据5月22日讯，就公司与小米公司的玄戒O1项目是否有合作的问题，通富微电5月22日在互动平 台表示，公司主营集成电路封装测试业务，公司客户资源覆盖国际巨头企业以及各个细分领域龙头企 业，大多数世界前20强半导体企业和绝大多数国内知名集成电路设计公司都已成为公司客户。 ...

Core Viewpoint - The company, Tongfu Microelectronics (002156), clarified on May 22 that it does not have a collaboration with Xiaomi on the Xuanjie O1 project, emphasizing its focus on integrated circuit packaging and testing services [1] Group 1: Company Overview - The company specializes in integrated circuit packaging and testing services [1] - It has a diverse client base that includes major international corporations and leading companies in various niche sectors [1] - Most of the world's top 20 semiconductor companies and a significant number of well-known domestic integrated circuit design firms are among its clients [1]

Company Overview - Tongfu Microelectronics is an integrated circuit packaging and testing service provider, offering one-stop services for design simulation and packaging testing across various fields including AI, high-performance computing, and 5G [2][5] - The company has established production bases in multiple locations, including Jiangsu, Anhui, and Malaysia, enhancing its ability to serve clients locally [2][3] - In 2024, the company acquired a 26% stake in Jinglong Technology, which is expected to improve investment returns and create more value for shareholders [2][3] Financial Performance - Revenue for 2021, 2022, 2023, and 2024 was 15.812 billion, 21.429 billion, 22.269 billion, and 23.882 billion CNY respectively [3] - Net profit for the same years was 0.957 billion, 0.502 billion, 0.169 billion, and 0.678 billion CNY respectively [3] - In Q1 2025, revenue reached 6.092 billion CNY, a 15.34% increase year-on-year, with net profit of 0.101 billion CNY, a 2.94% increase [4] Industry Trends - The semiconductor industry is entering an upward cycle, with global semiconductor sales expected to reach 627.6 billion USD in 2024, a 19.1% increase from 2023 [3] - Memory products, particularly high-performance DRAM and server SSDs, are projected to grow significantly, with memory product growth rates reaching 75.6% [3] - The global integrated circuit packaging and testing market is expected to reach 82 billion USD in 2024, a 7.8% increase [3] Business Operations - The company has seen significant growth in its core areas, including a 46% increase in mobile SOC and over 200% growth in automotive products [6][7] - In 2024, the company applied for 95 patents, achieving a total of 142 authorized patents, reflecting its commitment to innovation [7][9] - The company plans to invest 6 billion CNY in 2025 for facility construction, production equipment, IT, and R&D [12] Strategic Initiatives - The company is focusing on high-value products and advanced packaging technologies, including Chiplet and 2D+ packaging [5][6] - It has successfully localized procurement for over 100 materials, significantly reducing costs [7] - The company is enhancing its market share in advanced packaging through strategic collaborations with international clients [8]

Core Viewpoint - The article discusses the recent share reduction plan by the National Integrated Circuit Industry Investment Fund, highlighting its significance in the semiconductor industry and the strategic partnership between Tongfu Microelectronics and AMD [2][3][4]. Group 1: Share Reduction Plan - The National Integrated Circuit Industry Investment Fund, holding 13,315.6578 million shares (8.77% of total shares) in Tongfu Microelectronics, plans to reduce its holdings by up to 3,793.9922 million shares (2.5% of total shares) within three months starting from June 11, 2025 [2]. Group 2: National Integrated Circuit Industry Investment Fund - The National Integrated Circuit Industry Investment Fund, known as the "Big Fund," is the largest industrial investment fund in China, established to support the development of the integrated circuit industry and address financing challenges [3]. - The first phase of the Big Fund entered a recovery period in 2019 after five years of investment, while the second phase was established in October 2019 with a registered capital of 204.15 billion [3]. - The third phase of the Big Fund is set to launch in May 2024, aiming to attract social capital for multi-channel financing support across the entire integrated circuit industry chain [3]. Group 3: Tongfu Microelectronics - Tongfu Microelectronics is a provider of integrated circuit packaging and testing services, offering comprehensive solutions across various sectors, including AI, high-performance computing, big data storage, 5G, and automotive electronics [3]. - The company has established a strong partnership with AMD, being its largest packaging and testing supplier, handling over 80% of AMD's total orders [4].

Core Viewpoint - The National Integrated Circuit Industry Investment Fund (referred to as "the Big Fund") is accelerating its exit from investments in semiconductor companies, particularly through the reduction of its stake in Tongfu Microelectronics, indicating a shift in investment strategy amid a sluggish semiconductor market [1][2][4]. Group 1: Investment Activities - The Big Fund plans to reduce its holdings in Tongfu Microelectronics by 37.94 million shares, not exceeding 2.5% of the total share capital, with an estimated total value of approximately 9.56 billion yuan [1][2]. - The Big Fund has been reducing its stake in Tongfu Microelectronics for three consecutive quarters, with the latest reduction bringing its ownership down from 11.26% to 8.77% [3][4]. - As of the end of Q1 2024, the Big Fund held over 14% of Tongfu Microelectronics, with the first phase holding 133 million shares (8.77%) and the second phase holding 20.52 million shares (5.49%) [2][4]. Group 2: Financial Performance - In Q1 2024, Tongfu Microelectronics reported revenue of 6.092 billion yuan, a year-on-year increase of 15.34%, while net profit grew by 2.94% to 101 million yuan [5][6]. - Despite the growth in revenue, the net profit growth rate lagged behind revenue growth, and both revenue and net profit saw a quarter-on-quarter decline of 10.41% and 18.94%, respectively [5][6]. - The company aims for a revenue target of 26.5 billion yuan in 2025, representing a year-on-year growth of 10.96% [7]. Group 3: Market Trends - The Big Fund's investment strategy focuses on key segments of the semiconductor industry, including wafer manufacturing, design, packaging, and equipment materials, with a significant portion allocated to wafer manufacturing [2]. - The semiconductor market is expected to benefit from the growing demand for AI applications, particularly in automotive AI chips and smart factory equipment, which will drive the demand for industrial chips [7].

Group 1 - The China Securities Regulatory Commission has recently issued a decision to amend the "Measures for the Administration of Major Asset Restructuring of Listed Companies," encouraging private equity funds to participate in mergers and acquisitions of listed companies. The investment period for private equity funds is linked to the lock-up period for shares obtained through restructuring, reducing the lock-up period from 12 months to 6 months for those who have held investments for 48 months [1] - The U.S. Department of Commerce has announced that using Huawei's Ascend chips is considered a violation of U.S. export control regulations, which has been met with strong opposition from China [3] - Nvidia's CEO has indicated that due to U.S. government restrictions on the export of the Hopper architecture H20 chip to China, the company is reassessing its market strategy in China and will not launch the Hopper series chips in the future [3] Group 2 - The 15th China Airshow showcased the "Jiutian" drone, which is expected to complete its first flight by the end of June. A notable feature of this drone is the integrated "heterogeneous hive mission cabin," capable of carrying over a hundred loitering munitions or small drones, earning it the nickname "aerial drone carrier" [2] - China's J-10CE fighter jet has achieved its first combat success by shooting down multiple enemy aircraft without sustaining any losses, drawing significant attention from global military enthusiasts [2] - The National Financial Supervision and Administration has approved China Life Asset Management to participate in the third batch of long-term investment reform pilot programs for insurance funds, with the Honghu Fund having successfully invested 50 billion yuan by early March 2025 [3] Group 3 - Ningde Times has announced an H-share offering price of 263.00 HKD per share, with H-shares expected to be listed on the Hong Kong Stock Exchange on May 20. The company also plans to invest up to 225 million USD in an industrial investment fund [4] - Wentai Technology has announced plans to sell assets worth 4.389 billion yuan to Luxshare Precision and Luxshare Communications, focusing on the development of its semiconductor business [4] - Guizhou Moutai has reported a total share repurchase of 2.6421 million shares, amounting to 4.05 billion yuan [4]

Group 1: Stock Trading Anomalies - Chengfei Integration reported severe abnormal stock fluctuations, indicating a potential market sentiment overheating, with 96.91% of revenue from automotive parts and tooling, and only 1.74% from aerospace components [3] - Lijun Co. noted short-term market sentiment overheating in its stock, attributed to increased attention on military aircraft-related stocks due to geopolitical changes [4][5] - Yuzhong A stated that its stock has seen significant short-term gains, but there have been no major changes in its operational environment [8] Group 2: Risk Warnings and Suspensions - Zitian Technology received a delisting risk warning due to false financial reporting, with a deadline for rectification that was not met, leading to a potential delisting [6] - ST Mingjia announced the removal of its delisting risk warning but will continue to face other risk warnings, with a temporary suspension of trading [7] - ST Shengda's stock will be suspended for one day before resuming trading after the removal of other risk warnings [11] Group 3: Mergers and Acquisitions - Guangyang Co. is planning to acquire 100% of Ningbo Yinqiu Technology, leading to a suspension of its stock trading [9] - Electric Power Investment is also planning to acquire shares in Baiyin Hua Coal Power, with its stock set to resume trading [10] Group 4: Shareholder Reductions - Ruiling Co.'s controlling shareholder plans to reduce its stake by up to 3%, with specific figures provided for individual executives [13] - New Meixing's controlling shareholder intends to reduce its stake by up to 3% as well [14] - Yujian Intelligent's actual controllers plan to collectively reduce their stake by up to 2.99% [15] Group 5: Major Contracts - Qunxing Toys announced a 113 million yuan contract with Tencent for providing computing power services [23]

申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 5月18日，通富微电（002156）公告称，第二大股东国家集成电路产业投资基金（简称"大基金"）计划 在6月11日至9月8日期间，通过集中竞价或大宗交易减持不超过3793.99万股，占总股本2.5%，按最新股 价估算套现规模或超9.5亿元。这是大基金自2024年第四季度以来第三次减持，持股比例将从8.77%进一 步降至6%左右，减持原因为"自身经营管理需要"。 公告发布后， 股吧讨论热度飙升，投资者形成两大阵营。 乐观派 ：投资者注意到此次减持比例低于此前预期的3%，且大基金仍保留6%持股，并非清仓式退出， 叠加公司近期完成对京隆科技26%股权收购（强化测试环节布局），部分资金认为这是产业资本的正常 周期退出， 不影响公司与AMD等核心客户的合作稳定性 ——通富微电2023年先进封装产量占中国市场 22.25%，深度绑定AMD（订单占比超80%），在Chiplet、HBM封装等前沿领域技术储备扎实。 谨慎派 ：作为行业"风向标"的大基金连续减持，难免引发对板块情绪的担忧： 近期半导体板块已有26 家公司发布减持公告，形成"减持潮"效应 ，而通富微电一季 ...

通富微电（002156）公告，公司持股8.77%的股东国家集成电路产业投资基金股份有限公司(简称"产业 基金")计划以集中竞价或大宗交易方式减持持有的公司股份不超过3793.99万股(即不超过公司股份总数 的2.5%)。 ...

证券代码：002156 证券简称：通富微电 公告编号：2025-027 通富微电子股份有限公司 大股东减持股份预披露公告 持股 5%以上的股东国家集成电路产业投资基金股份有限公司保证向本公司 提供的信息内容真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 特别提示： 持有通富微电子股份有限公司（以下简称"公司"或"本公司"）股份 133,156,578 股（占公司总股本比例 8.77%）的股东国家集成电路产业投资基金 股份有限公司（以下简称"产业基金"或"首期基金"）计划在本减持计划公告 发布之日起 15 个交易日后的 3 个月内（即 2025 年 6 月 11 日至 2025 年 9 月 8 日），以集中竞价或大宗交易方式减持持有的公司股份不超过 37,939,922 股 （即不超过公司股份总数的 2.5%）。 一、股东基本情况 （一）股东名称：国家集成电路产业投资基金股份有限公司。 （二）股东持股情况：截至本公告披露日，首期基金持有公司股份 133,156,578 股，占公司总股本的 8.77%，均为无限售条件流通股。 二、本次减持 ...