Core Viewpoint - The report outlines the verification opinion of China International Capital Corporation regarding the listing and circulation of pre-IPO shares of Hangzhou Guangli Microelectronics Co., Ltd, confirming compliance with relevant regulations and the fulfillment of shareholder commitments [1][19]. Group 1: IPO and Share Capital Changes - The company completed its initial public offering (IPO) of 50 million shares, approved by the China Securities Regulatory Commission, and listed on the Shenzhen Stock Exchange on August 5, 2022, resulting in a total share capital of 200 million shares [1]. - After the IPO, the total share capital is 200,281,088 shares, with 160,104,687 shares subject to trading restrictions, accounting for 80.05% of the total, and 39,895,313 shares being freely tradable [1]. Group 2: Shareholder Commitments for Share Lock-up - Four shareholders applied for the lifting of share lock-up, including Hangzhou Guangli Equity Investment Co., Ltd., and commitments were made to not transfer or manage shares for 36 months post-listing [2][3]. - If the closing price falls below the IPO price at the end of the six-month period post-listing, the lock-up period will automatically extend for an additional six months [3][4]. Group 3: Share Reduction Commitments - Shareholders committed to a gradual reduction of shares post-lock-up, with a maximum of 25% of their holdings allowed to be sold in the first year after the lock-up period [5][6]. - Any reduction in share price below the IPO price within two years post-lock-up will result in adjustments to the reduction price and quantity [7][8]. Group 4: Measures for Stabilizing Share Price - The company will implement measures to stabilize share prices if the stock price falls below the latest audited net asset value for 20 consecutive trading days within three years of listing [9][10]. - The stabilization measures include share buybacks and potential increases in holdings by controlling shareholders, subject to regulatory compliance [11][12]. Group 5: Compliance and Verification - The verification by the sponsor institution confirms that the lifting of share restrictions complies with relevant regulations and that the disclosures made by the company are accurate and complete [19].

Core Viewpoint - The announcement details the share structure and lock-up commitments of Hangzhou Guangli Microelectronics Co., Ltd. following its initial public offering (IPO) and the subsequent lifting of restrictions on certain shares [1][2][19]. Group 1: IPO and Share Structure - The company completed its IPO by issuing 50 million shares, resulting in a total share capital of 200,000,000 shares, with 80.05% being restricted shares [1]. - After the IPO, the total share capital increased to 200,281,088 shares, with restricted shares accounting for 46.27% and unrestricted shares for 53.73% [2]. Group 2: Lock-up Commitments - Four shareholders applied for the lifting of share restrictions, including Hangzhou Guangli Equity Investment Co., Ltd. and Zheng Yongjun, who committed to not transferring their shares for 36 months post-IPO [2][3]. - If the closing price falls below the IPO price at the end of the six-month period post-IPO, the lock-up period will automatically extend for an additional six months [3][4]. Group 3: Shareholder Commitments - Shareholders have committed to adhere to regulations regarding share reduction, limiting any sales to 25% of their holdings in the first year after the lock-up period [6][7]. - The company will implement measures to stabilize the stock price if the stock price falls below the net asset value for 20 consecutive trading days [9][10]. Group 4: Changes in Share Structure Post-Release - Following the lifting of restrictions, the number of restricted shares decreased significantly, with the total number of restricted shares now at 25,776,753, representing 12.87% of the total share capital [18]. - The total number of unrestricted shares increased to 174,504,335, representing 87.13% of the total share capital [18]. Group 5: Verification by Sponsor Institution - The sponsor institution, China International Capital Corporation, confirmed that the lifting of share restrictions complies with relevant regulations and that the disclosures made by the company are accurate and complete [19].

天眼查商业履历信息显示，杭州广立微电子股份有限公司，成立于2003年，位于杭州市，是一家以从事 软件和信息技术服务业为主的企业。企业注册资本20028.1088万人民币，实缴资本20028.1088万人民 币。公司法定代表人为郑勇军。 通过天眼查大数据分析，杭州广立微电子股份有限公司共对外投资了16家企业，参与招投标项目46次， 知识产权方面有商标信息91条，专利信息229条，此外企业还拥有行政许可56个。 资金流向方面，今日主力资金净流出5856.41万元，占比成交额8.58%。其中，超大单净流出917.83万 元、占成交额1.35%，大单净流出4938.58万元、占成交额7.24%，中单净流出流出2267.18万元、占成交 额3.32%，小单净流入8123.59万元、占成交额11.91%。 广立微最新一期业绩显示，截至2025一季报，公司营业总收入6648.49万元、同比增长51.43%，归属净 利润1371.50万元，同比增长40.11%，扣非净利润2187.00万元，同比增长13.95%，流动比率17.980、速 动比率16.078、资产负债率5.80%。 来源：金融界 金融界消息 截至2025年7月 ...

（文章来源：证券日报） 证券日报网讯 7月31日晚间，广立微发布公告称，本次解除限售股份为杭州广立微电子股份有限公司 （以下简称"公司"或"广立微"）首次公开发行前已发行的部分股份。本次解除限售股东户数共计4户， 解除限售股份数量为75，922，003股，占公司总股本37.91%（占剔除回购专户股份数后总股本 38.53%）。本次解除限售股份上市流通日期为2025年8月5日（星期二）。 ...

2024年1至12月份，广立微的营业收入构成为：集成电路行业占比100.0%。 （文章来源：每日经济新闻） 广立微（SZ 301095，收盘价：63.01元）7月31日晚间发布公告称，公司限售股份约7592.2万股将于2025 年8月5日解禁并上市流通，占公司总股本比例为37.91%。 ...

证券代码：301095 证券简称：广立微 公告编号：2025-038 杭州广立微电子股份有限公司 关于首次公开发行前已发行股份上市流通的提示性公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记 载、误导性陈述或重大遗漏。 重要内容提示： 1、本次解除限售股份为杭州广立微电子股份有限公司（以下简称"公司" 或"广立微"）首次公开发行前已发行的部分股份。 2、本次解除限售股东户数共计 4 户，解除限售股份数量为 75,922,003 股， 占公司总股本 37.91%（占剔除回购专户股份数后总股本 38.53%）。 2、本次解除限售股份上市流通日期为 2025 年 8 月 5 日（星期二）。 一、首次公开发行股份及上市后股本变动概况 （一）首次公开发行股份情况 （二）郑勇军先生关于股份锁定承诺如下： 截至本公告披露日，公司总股本为 200,281,088 股，其中：有限售条件股份 为 92,666,932 股，占公司总股本 46.27%，无限售条件流通股 107,614,156 股，占 公司总股本 53.73%。 二、申请解除股份限售股东履行承诺情况 本次申请解除股份限售的股东共 4 名，为 ...

中国国际金融股份有限公司 关于杭州广立微电子股份有限公司 首次公开发行前已发行股份上市流通的核查意见 中国国际金融股份有限公司（以下简称"中金公司"或"保荐机构"）作为杭州广 立微电子股份有限公司（以下简称"广立微"、"公司"）持续督导的保荐机构，根据《证 券发行上市保荐业务管理办法》《深圳证券交易所创业板股票上市规则》和《深圳证券 交易所上市公司自律监管指引第 2 号——创业板上市公司规范运作》等有关法律法规和 规范性文件的要求，对杭州广立微电子股份有限公司首次公开发行前已发行股份上市流 通事宜进行了核查，发表核查意见如下： 一、首次公开发行股份及上市后股本变动概况 （一）首次公开发行股份情况 2024 年 11 月 29 日，公司 2023 年限制性股票激励计划首次授予部分第一个归属期 归属股份在中国证券登记结算有限责任公司深圳分公司完成归属登记，总股本由 200,000,000 股增加至 200,281,088 股。 截至本核查意见出具日，公司总股本为 200,281,088 股，其中：有限售条件股份为 92,666,932 股，占公司总股本 46.27%，无限售条件流通股 107,614,156 股， ...

证券之星消息，7月30日软件开发板块较上一交易日下跌1.65%，国投智能领跌。当日上证指数报收于 3615.72，上涨0.17%。深证成指报收于11203.03，下跌0.77%。软件开发板块个股涨跌见下表： | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | | --- | --- | --- | --- | --- | --- | --- | | 688095 | 福听软件 | 78.69 | 2.86% | 4.70万 | | 3.71亿 | | 688171 | 纬德信息 | 37.97 | 2.84% | 1.87万 | 6887.43万 | | | 300253 | 卫宁健康 | 10.79 | 2.76% | 152.96万 | | 16.37亿 | | 600455 | 博通股份 | 28.55 | 1.89% | 2.72万 | 7838.46万 | | | 688168 | 安博通 | 77.38 | 1.71% | 1.88万 | | 1.46亿 | | 688615 | 合合信息 | 183.64 | 1.47% | 2.39万 | | 4.35亿 | ...

Group 1 - As of July 29, the financing balance in the Shenzhen market reached 961.25 billion yuan, setting a new historical record, surpassing the previous high of 957.55 billion yuan on March 20 of this year [2] - Since June 23, the market has been on an upward trend, with the Shenzhen Composite Index surpassing 11,200 points [2] - The Shenzhen market has seen continuous net inflows of financing funds for six consecutive weeks, with a total net inflow amounting to 76.72 billion yuan, and weekly net inflows exceeding 10 billion yuan in the last four weeks [2] Group 2 - On July 29, five stocks in the Shenzhen market received net financing inflows exceeding 100 million yuan, including Xinyi Technology, CATL, Gree Electric Appliances, Zhifei Biological Products, and Guangli Microelectronics [2] - Xinyi Technology topped the list with a single-day net financing inflow of 1.14 billion yuan, marking a historical high for the stock [2] - As of July 29, the latest financing balance for Xinyi Technology was 7.78 billion yuan, reflecting a growth of 17.18% compared to the previous day [2]

以"自主创新.应用落地.生态共建"为主题的"第五届中国集成电路设计创新大会暨IC应用生态展(ICDIA创 芯展)"近日在苏州盛大举行并圆满落幕。此次展会围绕AI大算力与数据处理、光子集成电路、超异构计 算RISC-V生态、5G射频/6G半导体、AloT与边缘计算、智能汽车与自动驾驶，分享前沿技术突破与应 用场景，推动创新成果转化与产业链协同，促进芯片、应用方案与整机研发深度合作。 作为国内领先的集成电路EDA软件与晶圆级电性测试设备供应商，广立微（301095）携全线创新产品 及解决方案重磅参展，成为展会焦点。其中广立微的YAD、SemiMind等最新研发成果吸引了来自产业 链上下游的专家、学者及企业代表的广泛关注。 除了YAD这一明星产品，广立微旗下的SemiMind半导体大模型平台，是一个"知识库+智能体"驱动的AI 研发基座。它接入了DeepSeek-R1等大模型，并深度协同，构建了一个开放、灵活、可扩展的智能研发 生态系统。区别于目前通用型大语言模型平台，广立微SemiMind不仅能提供私有化知识库搭建，还可 以结合自身业务理解，落地多个半导体专业智能体，包括设计智能体–DesignRule形成及检查 ...