证券代码：301348 证券简称：蓝箭电子 公告编号：2024-042 佛山市蓝箭电子股份有限公司 关于参加广东辖区 2024 年投资者 网上集体接待日活动的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 为进一步加强与投资者的互动交流，佛山市蓝箭电子股份有限公司（以下 简称"公司"）将参加由广东证监局、广东上市公司协会联合举办的"坚定信 心 携手共进 助力上市公司提升投资价值——2024 广东辖区上市公司投资者关 系管理月活动投资者集体接待日"，现将相关事项公告如下： 本次活动将采用网络远程的方式举行，投资者可登录"全景路演"网站 （http://rs.p5w.net）参与本次互动交流，活动时间为 2024 年 9 月 12 日（周 四）15:30-16:30。届时公司高管将在线就 2024 年半年度业绩、公司治理、发展 战略、经营状况等投资者关心的问题，与投资者进行沟通与交流，欢迎广大投资 者踊跃参与！ 特此公告！ 佛山市蓝箭电子股份有限公司董事会 2024 年 9 月 9 日 ...

金元证券股份有限公司 关于佛山市蓝箭电子股份有限公司 2024 年半年度持续督导跟踪报告 一、保荐工作概述 | 项目 | 工作内容 | | --- | --- | | 1、公司信息披露审阅情况 | | | （1）是否及时审阅公司信息披露文件 | 是 | | （2）未及时审阅公司信息披露文件的次数 | 无 | | 2、督导公司建立健全并有效执行规章制度的情 | | | 况 | | | （1）是否督导公司建立健全规章制度（包括但 | | | 不限于防止关联方占用公司资源的制度、募集 | 是 | | 资金管理制度、内控制度、内部审计制度、关 | | | 联交易制度） | | | （2）公司是否有效执行相关规章制度 | 是 | | 3、募集资金监督情况 | | | （1）查询公司募集资金专户次数 | 每月一次 | | （2）公司募集资金项目进展是否与信息披露文 | 是 | | 件一致 | | | 4、公司治理督导情况 | | | （1）列席公司股东大会次数 | 无 | | （2）列席公司董事会次数 | 1次 | | （3）列席公司监事会次数 | 无 | | 5、现场检查情况 | | | （1）现场检查次数 | 0次 ...

Group 1: Company Overview - Blue Arrow Electronics Co., Ltd. is engaged in semiconductor packaging and testing, providing discrete devices and integrated circuit products for the semiconductor industry and downstream sectors [2]. - The company's products are primarily used in consumer electronics, power supply, industrial control, smart home, security, telecommunications, and automotive electronics [2]. Group 2: Market Trends and Growth Drivers - The automotive electronics sector is benefiting from the popularity of new energy vehicles, leading to sustained market demand [2]. - The company is focusing on research and development in high current, high voltage applications, and has established core technologies in power device packaging [3]. Group 3: Future Development and R&D - The company plans to increase R&D investment and expand its product line, aligning with trends towards miniaturization and integration in semiconductor packaging and testing [3]. - A new R&D center is being established to enhance testing capabilities and expand the team, fostering a comprehensive semiconductor packaging and testing system [3]. Group 4: Cost Control and Efficiency - The company has implemented digital management and automation across all production lines, utilizing robotic packaging technology and AI management to enhance efficiency [3]. - Measures to improve internal efficiency and reduce material costs have led to an increase in gross margin in Q2 compared to Q1 [3]. Group 5: Industry Outlook - The semiconductor industry is expected to see a recovery in market demand, with potential price increases in the latter half of the year [3]. - However, general consumer demand may remain subdued, posing challenges for ongoing industry growth [3].

| 非经营性资金占用 | 资金占用 | 占用方与上 市公司的关 | 上市公司核 | 24年期初 占用资金 | 24年半年度占用 累计发生金额 | 24年半年度占 用资金的利息 | 24年半年 度偿还累 | 24年1-6月 期末占用资 | 占用形 | 占用性质 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | 方名称 | | 算的会计 | | | | 计发生金 | 金余额 | 成原因 | | | | | 联关系 | 科目 | 余额 | （不含利息） | （如有） | 额 | | | | | 控股股东、实际控制人及 | | | | | | | | | | | | 其附属企业 | | | | | | | | | | | | 小计 | | | | | | | | | | | | 前控股股东、实际控制人 | | | | | | | | | | | | 及其附属企业 | | | | | | | | | | | | 小计 | | | | | | | | | | | | 其他关联方及附属企业 | | | | | | | | | ...

Financial Performance - The company reported a total revenue of RMB 500 million for the first half of 2024, representing a 15% increase compared to the same period last year[1]. - The company has provided a revenue guidance of RMB 1.2 billion for the full year 2024, indicating a projected growth of 10%[1]. - The company reported a significant increase in revenue, achieving a total of 500 million RMB for the first half of 2024, representing a 25% year-over-year growth[7]. - The company has provided a positive outlook for the second half of 2024, projecting a revenue growth of 20% based on current market trends and demand[7]. - The company's operating revenue for the reporting period was ¥323,010,996.79, a decrease of 13.36% compared to the same period last year[12]. - The company’s revenue for self-owned brands was ¥159,016,876.91, a decrease of 23.91% year-over-year, with a gross margin of 9.81%, down 12.43% from the previous year[48]. - The revenue from packaging and testing services was ¥159,545,603.48, a slight increase of 0.22% year-over-year, but the gross margin decreased by 20.99% to -1.42%[48]. - The total revenue from sales of goods and services received was 344,547,067.30 CNY, a decrease from 432,322,464.63 CNY in the previous year[117]. User Growth and Market Expansion - User data indicates a growth in active users, reaching 1.2 million, which is a 20% increase year-over-year[1]. - User data indicates a growing customer base, with an increase of 15% in active users compared to the previous year, reaching 1.2 million active users[7]. - The company is expanding its market presence in Southeast Asia, targeting a 25% market share by the end of 2025[1]. - The company is expanding its market presence in Southeast Asia, targeting a 10% market share in the region by 2025[7]. - The company is actively developing potential customers in various regions to diversify its customer base and reduce regional sales concentration risks[74]. Product Development and Innovation - New product launches include a next-generation semiconductor device expected to enhance performance by 30% over previous models[1]. - New product development includes the launch of a GaN power semiconductor line, expected to contribute an additional 100 million RMB in revenue by the end of 2024[6]. - The introduction of a new low dropout regulator (LDO) is expected to enhance product performance and attract new customers, with an estimated market entry in Q3 2024[6]. - The company plans to invest 50 million RMB in research and development for advanced packaging technologies over the next two years[6]. - The company has initiated new product development in advanced packaging technology and GaN fast charging, aiming to enhance product competitiveness and support future revenue growth[50]. Financial Position and Cash Flow - The net profit attributable to shareholders was -¥7,837,166.85, representing a decline of 119.37% year-over-year[12]. - The net cash flow from operating activities was ¥27,407,014.10, a significant drop of 74.94% compared to the same period last year[12]. - The total assets at the end of the reporting period were ¥1,945,815,698.49, an increase of 1.49% from the end of the previous year[12]. - The net assets attributable to shareholders decreased by 4.07% to ¥1,503,753,534.75 compared to the previous year[12]. - The company reported a decrease in retained earnings to CNY 249,290,899.12 from CNY 313,128,065.97, a decline of about 20.4%[113]. - The company has ongoing investments in construction projects, with construction in progress amounting to CNY 73,458,378.35, significantly up from CNY 16,283,698.03[112]. Research and Development - Research and development expenses increased by 12%, reflecting the company's commitment to innovation and technology advancement[1]. - R&D expenses amounted to ¥13,821,600, accounting for 4.28% of total revenue, with 149 R&D personnel, representing 10.08% of total employees[50]. - The company has established a semiconductor device engineering technology research and development center, recognized as a provincial-level enterprise technology center in Guangdong[24]. - The company has developed advanced packaging technologies, including a frame-less packaging technique and a 370μm DFN1×1 packaging size, reaching chip-level surface mount packaging standards[20]. - The company is actively collaborating with universities and research institutions on key technology projects, enhancing its innovation capabilities[44]. Strategic Acquisitions and Partnerships - A strategic acquisition of a local tech firm was completed, which is anticipated to contribute an additional RMB 100 million in revenue annually[1]. - A strategic acquisition of a local semiconductor firm is anticipated to enhance the company's R&D capabilities and product offerings, with an expected completion date in Q4 2024[7]. - The company has established long-term stable partnerships with clients across various regions, including South China, East China, Northwest, and Southwest[24]. - The company has established partnerships with universities and research institutes, including Sun Yat-sen University and the Ministry of Industry and Information Technology's Fifth Electronic Research Institute, to enhance R&D efficiency and capabilities[34]. Risk Management - The company has identified potential risks related to market volatility and has outlined mitigation strategies in its risk management section[1]. - The company has a concentrated revenue risk in the South China region, which is critical for its business operations[74]. - The semiconductor packaging and testing industry is highly influenced by the cyclical nature of the semiconductor industry, which poses operational risks[78]. - The company will strengthen market research and feasibility studies for new technologies and products to mitigate R&D failure risks[77]. Corporate Governance and Compliance - The board has decided not to distribute cash dividends for this fiscal year, focusing on reinvestment into growth initiatives[1]. - The company has not experienced any major litigation or arbitration matters during the reporting period[90]. - The company has not engaged in any major related party transactions during the reporting period[91]. - The company does not belong to the key pollutant discharge units announced by the environmental protection department and has not received any administrative penalties for environmental issues during the reporting period[85]. - The company actively participates in social welfare activities and maintains good public relations with various levels of government, promoting sustainable development[88]. Shareholder Information - The total number of shares before the change was 200,000,000, with 76.29% being restricted shares[99]. - The total number of shares after the change remains 200,000,000, with no overall change in total shares[99]. - The total number of common shareholders at the end of the reporting period is 26,251[102]. - The largest shareholder, Wang Chengming, holds 15.83% of the shares, totaling 31,669,430 shares[102]. - The company has not undergone any changes in its controlling shareholder during the reporting period[107].

证券代码：301348 证券简称：蓝箭电子 公告编号：2024-038 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 根据《上市公司监管指引第 2 号——上市公司募集资金管理和使用的监管要求》《深 圳证券交易所上市公司自律监管指引第 2 号——创业板上市公司规范运作》等相关规定， 佛山市蓝箭电子股份有限公司（以下简称"公司"）将截至 2024 年 6 月 30 日募集资金存 放与使用情况报告如下： 一、募集资金基本情况 （一）募集资金金额及到位情况 经中国证券监督管理委员会《关于同意佛山市蓝箭电子股份有限公司首次公开发行股 票注册的批复》（证监许可〔2023〕1048 号）同意注册，并经深圳证券交易所同意，公司 首次公开发行人民币普通股（A 股）5,000.00 万股，每股面值人民币 1.00 元，每股发行价 人民币 18.08 元，募集资金总额为人民币 904,000,000.00 元，扣除与发行有关的费用人民 币119,994,381.95 元（不含增值税）后，公司实际募集资金净额为人民币784,005,618.05 元。该募集资金截至 2023 年 8 ...

证券代码：301348 证券简称：蓝箭电子 公告编号：2024-037 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 佛山市蓝箭电子股份有限公司（以下简称"公司"）根据《深圳证券交易所创业板股 票上市规则》《深圳证券交易所上市公司自律监管指引第 2 号——创业板上市公司规范运 作》《企业会计准则》及公司相关会计政策等相关规定，计提信用减值损失及资产减值损 失，本次计提减值事项无需提交公司董事会和股东大会审议。现将具体情况公告如下： （二）本次计提资产减值准备的范围和金额 本公司对 2024 年半年度应收票据、应收账款、其他应收款及存货等存在可能发生减值 迹象的资产进行全面清查和减值测试后，计提资产减值准备共计人民币 11,287,541.50 元，具体情况如下： | 项目 | 本期发生额（元） | | --- | --- | | 应收票据坏账损失 | 3,657,694.70 | | 应收账款坏账损失 | -3,127,446.40 | | 其他应收款坏账损失 | -147,977.98 | | 存货跌价损失 | 10,905,271.18 | | 合计 | ...

证券代码：301348 证券简称：蓝箭电子 公告编号：2024-041 佛山市蓝箭电子股份有限公司 关于第五届监事会第二次会议决议公告 本公司及监事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、 误导性陈述或重大遗漏。 一、监事会会议召开情况 佛山市蓝箭电子股份有限公司（以下简称"公司"）第五届监事会第二次会议 的通知已于 2024 年 8 月 16 日向全体监事发出，会议于 2024 年 8 月 26 日在公司 会议室召开。应出席本次会议的监事 3 人，实际出席并参与表决的监事 3 人，会议 由监事会主席李永新主持，本次会议的召集、召开符合《中华人民共和国公司法》 《公司章程》和相关法律、法规的有关规定。 二、监事会会议审议情况 1、审议通过了《关于公司 2024 年半年度报告全文及摘要的议案》 经审议，监事会认为，董事会编制的《公司 2024 年半年度报告》及《公司 2024 年半年度报告摘要》的程序符合法律法规和中国证监会的相关规定，报告内容真实、 准确、完整地反映了公司的实际情况，没有虚假记载、误导性陈述或者重大遗漏。 具体内容详见公司同日披露于巨潮资讯网（http://www.cnin ...

证券代码：301348 证券简称：蓝箭电子 公告编号：2024-040 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 一、董事会会议召开情况 佛山市蓝箭电子股份有限公司（以下简称"公司"）第五届董事会第二次会 议通知于 2024年 8月 16日以通讯及邮件方式发出，会议于 2024年 8月 26日在公 司会议室以现场结合通讯表决方式召开。会议由董事长张顺主持，应出席本次 会议的董事 9人，实际出席董事 9人（其中任振川以通讯表决方式出席会议）。 公司监事及高级管理人员列席了本次会议。 具体内容详见公司同日披露于巨潮资讯网（http://www.cninfo.com.cn）的 《关于 2024 年半年度募集资金存放与使用情况的专项报告》。 本议案已经董事会审计委员会审议通过。 本次会议的召集、召开和表决程序符合《中华人民共和国公司法》等法律法 规和《公司章程》的规定。 1、审议并通过了《关于公司 2024 年半年度报告全文及摘要的议案》 具体内容详见公司同日披露于巨潮资讯网（http://www.cninfo.com.cn）的 《2024 年半年度报告》及《2 ...

证券代码：301348 证券简称：蓝箭电子 公告编号：2024-036 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 佛山市蓝箭电子股份有限公司（以下简称"公司"）2023 年年度权益分派 方案已获 2024 年 6 月 25 日召开的 2023 年年度股东大会审议通过，现将权益分 派事宜公告如下： 一、股东大会审议通过的权益分派方案情况 1、经 2023 年年度股东大会审议通过《关于 2023 年度利润分配预案的议 案》，公司拟以截止 2023 年 12 月 31 日公司总股本 200,000,000 股为基数，向 全体股东每 10 股派发现金红利 2.8 元（含税），共计派发现金红利总额为人民 币 56,000,000 元（含税），本次不进行资本公积金转增股本。在本次利润分配 预案披露日至实施前，若公司总股本发生变动，将按照分配总额不变的原则相 应调整分配。 二、本次实施的权益分派方案 本公司 2023 年年度权益分派方案为：以公司现有总股本 200,000,000 股为 基数，向全体股东每 10 股派 2.800000 元人民币现金（含税；扣税后，通过 ...