Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the fastest-growing semiconductor stocks to buy.  As of December 5, the company is a consensus Buy and boasts an over 20% potential upside to the consensus 1-year median price target of $355. On the operations side, on November 25, 2025, TSMC filed a civil lawsuit in Taiwan’s Intellectual Property & Commercial Court against former senior vice president Wei-Jen Lo, who joined Intel in October, citing non-compete and confidentiality obl ...

来源：滚动播报 伯恩斯坦将台积电目标价从每股290美元上调至330美元。 ...

台积电（TSM）未来持续强劲增长的长期利好因素，是毋庸置疑的。 事实上，无论未来几年 英伟达（Nvidia）的 GPU 龙头地位是否会受到冲击（比如面临超威半导体（AMD）等替代供 应商的竞争，或是超大规模数据中心运营商自研芯片的挑战），所有行业头部企业最终都要依 赖台积电的尖端制程工艺。在这一领域，台积电的领先优势与竞争护城河正展现出前所未有的 稳固性。当人工智能相关概念股的估值溢价引发市场质疑时，像台积电这样兼具盈利变现能力 与行业不可替代性的标的，理应成为人工智能行情第二阶段的优选配置方向。 不过，台积电在当前股价高点是否值得买入，并不能仅凭这一强劲基本面就下定论。要解答这 个问题，还需确认三个关键点：其一，公司是否保有稳定的定价权；其二，是否手握充足订单 以支撑中期营收流；其三，智能手机、物联网等非人工智能领域的需求前景是否向好。经分 析，分析师认为台积电的运营状况依旧强劲，即便当前入场进行新投资，未来数年也有望获得 可观回报。 增 长 势 头 强 劲 ， 营 收 结 构 多 元 2025 年第三季度财报电话会议披露的营收结构显示，智能手机、物联网、汽车电子和消费电 子（DCE）等周期性需求贡献了总营 ...

Core Insights - Nvidia's investment in Synopsys and collaboration with EDA tool providers highlights a shift in the semiconductor industry towards system-level optimization rather than just process competition [3] - The trend indicates that advanced packaging and EDA tools are becoming critical for enhancing performance and controlling costs in semiconductor design [3][13] - The local semiconductor industry is encouraged to leverage this paradigm shift to create opportunities for growth and innovation [3][15] Group 1: EDA+ Concept - The EDA+ framework proposed by Silicon Chip Technology aims to reconstruct the design, simulation, and verification processes for advanced packaging [7] - EDA+ is not merely an addition to traditional EDA tools but represents a comprehensive redesign focused on 2.5D/3D integration [7][13] - The 3Sheng Integration Platform serves as the foundational technology for EDA+, facilitating a complete engineering loop from system architecture to manufacturing verification [12] Group 2: Industry Trends - The semiconductor industry's shift towards advanced packaging is driven by the need for enhanced computational power and the limitations of Moore's Law [13] - EDA's role is evolving to become a critical link between design and manufacturing, necessitating a unified environment for considering various design factors [13][14] - Major players like TSMC and Nvidia are establishing partnerships to secure competitive advantages through deep integration of EDA and manufacturing processes [15] Group 3: Implementation and Value - EDA+ has already been implemented in several 2.5D/3D projects, significantly reducing design convergence time from three months to approximately ten days [14] - The platform is also exploring the development of reusable chiplet models, which will enhance collaboration across different manufacturers and technology nodes [14] - EDA+ provides a framework for deep industry collaboration, allowing for the transfer of manufacturing knowledge to the design phase and vice versa [14] Group 4: Opportunities for Local Industry - The local semiconductor industry can adopt a strategy of vertical and horizontal collaboration to compete with international giants [15] - Vertical collaboration involves strengthening the connections between different stages of the supply chain using platforms like EDA+ [15] - Horizontal collaboration focuses on cooperation among local EDA firms to cover the complex advanced packaging design process, potentially leading to a unified approach in the Chiplet and 3DIC markets [15][18]

如果您希望可以时常见面，欢迎标星收藏哦~ 谷歌的 TPU 在被外部采用后，成为了人工智能领域的头条新闻；然而，这其中存在一个可能成为重大制约因素的方面。 在当今人工智能计算领域，人们对专用集成电路（ASIC）的兴趣空前高涨，这主要是因为人们普遍认为，在人工智能应用的下一阶段——推理阶 段，像谷歌的TPU这样的芯片将凭借更低的总体拥有成本和更优异的性能占据主导地位。随着谷歌第七代Ironwood TPU的推出，Meta和Anthropic 等公司纷纷表示有兴趣将ASIC集成到他们的工作负载中，TPU被外部采用的趋势也愈发明显。然而，如果谷歌想要进军基础设施市场，供应链的 限制将构成巨大的挑战。 据《中国时报》报道，谷歌的TPU芯片产量可能无法达到市场预期，主要原因是该公司难以从台积电等供应商处获得先进的封装材料，而这对于成 功量产至关重要。诸如CoWoS之类的技术是芯片制造商大幅提升芯片性能的一种途径。以TPUv7为例，谷歌采用了MCM（多芯片模块）设计，可 以将多个芯片集成到一个统一的封装中。 TPUv7 并非采用大型单芯片，而是将多个硅芯片集成在硅中介层上，并通过微凸点阵列连接各个芯片组。这最终实现了可扩展 ...

Core Viewpoint - The artificial intelligence (AI) buildouts are projected to reach new heights by 2026, prompting investors to consider stocks that may perform well in that year, leading to a potential Santa Claus rally at the end of 2025 [1] Group 1: Stock Picks for 2026 - Nvidia, Taiwan Semiconductor Manufacturing (TSMC), and Alphabet are identified as top stock picks for 2026, with early investment in these stocks expected to yield the best returns [2] Group 2: Nvidia - Nvidia has been a leading stock in the market for the past three years, primarily due to its industry-leading graphics processing units (GPUs) that power much of the current generative AI technology [4] - Despite competition from AMD and custom AI accelerators from Alphabet, Nvidia's CEO stated that the company is "sold out" of cloud GPUs, indicating continued demand and a strong position in the market [6] - The ongoing AI buildout supports Nvidia's strong stock outlook for 2026 [7] Group 3: Alphabet - Alphabet's tensor processing unit (TPU), developed in collaboration with Broadcom, may soon be sold directly to Meta Platforms, creating a new revenue stream for the company [8] - In Q3, Alphabet reported a 16% year-over-year revenue increase to $102 billion, with diluted earnings per share (EPS) rising 35% year-over-year, showcasing strong performance despite business maturity [10] - Alphabet's stock has performed well in the latter half of the year, with potential for further growth if it secures significant business wins with its TPUs [11] Group 4: Taiwan Semiconductor Manufacturing (TSMC) - TSMC is crucial in the AI race, as it fabricates chips for companies like Nvidia and Alphabet, making it a key player in the AI technology landscape [12] - TSMC's new 2-nanometer chips, which are entering production, promise to consume 25% to 30% less energy compared to the previous 3nm generation, addressing electricity capacity issues in AI buildouts [14] - As a neutral party in the chip manufacturing sector, TSMC stands to benefit from increased spending on AI infrastructure, making it a strong stock pick for 2026 [15]

以下文章来源于凤凰网财经 ，作者凤凰网财经 凤凰网财经 . 你好，我们是凤凰网财经，全球华人都在看的财经公众号，传播最有价值的财经报道，你值得关注！欢 迎访问：http://finance.ifeng.com/ 来源丨凤凰网财经 （ID： zhengulab ） "台积电董事长要来大陆了！" 这则消息，近日在中国半导体圈引发广泛关注。 此前有知情人士透露，台积电董事长魏哲家"有望于12月4日现身南京，出席台积电开放创新平台 （OIP）生态系统论坛，并计划密集拜访多家本土芯片设计公司"。 卢特尼克3日接受美国媒体采访时指出，台积电宣布将增加投资1000亿美元，总投资额达1605亿美 元。他说："当然，他们（台湾）也会训练美国劳工。最终目标是将供应链转移到美国，在美国生产 半导体及药品，训练美国人从事这些工作。让整个供应链都留在美国。这就是我们全部的目的。" 这家芯片巨头再次站上地缘政治的十字路口。 主动布局 2016年7月6日，一场大雨浸润南京城。 禄口机场的贵宾通道内，一位老者缓步走来，他正是有着 "台湾半导体教父" 之称的台积电创始人张 忠谋。 在与等候多时的接待方短暂寒暄后，一辆黑色高级轿车早已在雨中待命 ...

Core Insights - Taiwan Semiconductor Manufacturing Co. (TSMC) is experiencing overwhelming demand for its advanced packaging technologies, particularly Chip on Wafer on Substrate (CoWoS), driven by major companies like Nvidia, Google, Amazon, and MediaTek seeking capacity for next-generation AI chips [1][2]. Group 1: Demand and Capacity - TSMC's CoWoS lines are fully booked, with no spare capacity available despite aggressive expansion efforts, indicating a severe short supply [2]. - The company is investing heavily to close the capacity gap, as stated by TSMC's chairman during an earnings call [2]. Group 2: Outsourcing and Partnerships - Due to demand outpacing internal expansion, TSMC plans to outsource parts of its packaging workflow starting in 2026, accelerating collaborations with equipment and packaging partners to ensure timely delivery of advanced components [3][4]. - Suppliers are experiencing surging orders as TSMC shifts from a fully in-house model to a hybrid approach [4]. Group 3: Revenue Growth - TSMC reported a consolidated net revenue of approximately NT$367.47 billion for October 2025, marking a 16.9% increase year-over-year and an 11.0% increase from the previous quarter [7]. - From January to October, TSMC's revenue totaled NT$3.13 trillion, up 33.8% compared to the same period last year [7]. Group 4: Market Position and Performance - TSMC remains a key manufacturing partner for Nvidia's Blackwell AI platform, which continues to see strong global demand despite changes in U.S. export rules [8]. - The company's stock has surged 47.07% year-to-date, with strong rankings in Quality and Growth and Momentum relative to competitors [8].

UBS sets a price target of $330 for TSM, indicating an 11.97% potential increase.TSMC dominates with a 71% share in the foundry market, signaling strong future performance.The company benefits from the ongoing cloud and AI supercycle, enhancing its financial stability and investor attractiveness.Taiwan Semiconductor Manufacturing Company (NYSE:TSM) is a leading player in the semiconductor industry, known for its significant market share and advanced technology. UBS recently set a price target of $330 for TS ...

Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the best stocks you’ll wish you bought sooner. As of December 2, the semiconductor foundry giant TSMC is a consensus Buy with almost all the analysts covering it assigning a Buy or equivalent rating. It is not only the positive sentiment; analysts also expect the stock to rise by more than 21% from the current level, with a 1-year median price target of $355. Pixabay/Public Domain Corroborating the positive opinions, Bank of America ...