通富微电董事长兼京隆科技副董事长石磊；市委常委、苏州工业园区党工委书记沈觅，市政府秘书长徐本，市有关部门主要负责同志参加。 来源：苏报融媒记者朱琦/文 智能产线。苏报融媒记者 濮建明/摄 吴庆文在致辞时表示，近年来，苏州大力培育集成电路领域新质生产力，已集聚集成电路产业链重点企业超380家，形成了从设计、制造、封测到设备材 料的完整产业布局。通富微电是苏州并肩前行的好伙伴，此次投资建设京隆科技高阶半导体新项目，必将为苏州集成电路产业发展跃升注入新的强劲动 能。期待企业家朋友把更多先进技术、高端项目、优质资源带到苏州。苏州将坚持长期主义，一如既往提供细致周到服务，持续营造市场化、法治化、国 际化一流营商环境，陪伴企业成长，共享发展机遇、共创美好未来。 京隆科技（苏州）有限公司扎根苏州工业园区20余年，已发展成为国内最大的高阶芯片专业测试厂商，构建了全流程芯片封测服务体系。2025年，园区产 业基金联合全球封测龙头企业通富微电，完成京隆科技股权重组。此次投用的新工厂位于独墅湖科教创新区（东区），总投资40亿元，占地68亩，其搭载 的智能产线涵盖人工智能、车规级、工业级等高阶芯片测试领域。预计达产后，将进一步扩大企 ...

Industry Overview - The Chinese integrated circuit industry has seen a significant number of financing events, with over 1,000 events in both 2021 and 2022, indicating a peak period for investment [1] - In 2023, the number of financing events decreased, but the total financing amount increased to 1.15 trillion yuan, while in 2024, the number of events slightly declined, and the total financing amount halved to approximately 562.39 billion yuan [1] - By 2025, the number of financing events is expected to recover slightly to 938, with a total financing amount of approximately 911.05 billion yuan [1] Financing Events Summary - Major financing events in the Chinese integrated circuit industry for 2025 include various rounds of investment across different companies, with amounts often undisclosed [2][5][7] - Notable investments include 100 million yuan in Yanan Weiyan Technology and 1.43 billion yuan in Hongxing Zhixin, showcasing the active investment landscape [5][7] Financing Rounds Analysis - The most common financing round in the integrated circuit industry over the past five years has been the B round, with early-stage rounds like angel, Pre-A, and A rounds significantly outpacing later rounds [8] - Strategic investments have also been prevalent, indicating a strong interest in building long-term industry ecosystems [8] Regional Financing Distribution - Financing activities are heavily concentrated in eastern coastal provinces such as Guangdong, Jiangsu, and Zhejiang, with Jiangsu showing particularly high financing scales [9] - In contrast, provinces like Shandong and Henan have seen a significant decrease in financing events, while regions like Jilin and Tibet have almost no financing activity [9] Sector-Specific Financing Insights - The integrated circuit industry can be segmented into memory, logic chips, microprocessors, and analog chips, with memory leading with 374 financing events, significantly higher than logic chips (113 events), microprocessors (75 events), and analog chips (18 events) [13] - This reflects the strong demand for domestic alternatives in the memory sector and varying levels of investor interest across different segments [13] Representative Companies' Investment Activities - Key companies in the integrated circuit sector, such as Xinyuan Co., have made substantial investments in various startups to enhance their technological capabilities and strengthen their competitive edge [15][16][17][18] - For instance, Xinyuan Co. has invested 500 million yuan in Xinyuan Technology (Shanghai) and 100 million yuan in Xinyuan Microelectronics (Nanjing) [16] Mergers and Acquisitions - The competitive landscape among Chinese integrated circuit companies is characterized by numerous mergers and acquisitions, primarily focusing on horizontal integration to expand market share and achieve technological synergies [19][20] - Recent notable acquisitions include Huadian Co. acquiring 15% of Shengwei Ce Electronics and Xinyuan Co. acquiring 100% of Xinyuan Technology [20] Summary of Investment and M&A Trends - The investment activities in the Chinese integrated circuit industry are showing signs of recovery, with a notable increase in merger and acquisition events, indicating a dynamic market environment [22]

Core Viewpoint - Unisoc plans to acquire a controlling or full stake in Ruineng Semiconductor Technology Co., Ltd. through a combination of share issuance and cash payment, marking a significant move in its semiconductor industry strategy [1] Group 1: Acquisition Details - Unisoc's stock and convertible bonds will be suspended from trading starting December 30, with a detailed transaction plan expected within 10 trading days [1] - The acquisition is characterized as a related party transaction and does not constitute a major asset restructuring or change of control [1] - Ruineng Semiconductor, established in August 2015, is a leading player in the domestic power semiconductor sector, with a registered capital of 362 million yuan [2] Group 2: Business Model and Operations - Ruineng Semiconductor focuses on the R&D, production, and sales of power semiconductor discrete devices, including thyristors, power diodes, and silicon carbide diodes, serving high-growth sectors like consumer electronics and renewable energy [2][3] - The company has built an integrated operating system covering chip design, wafer manufacturing, and packaging, with a strong emphasis on chip design and wafer manufacturing [3] - Ruineng's sales strategy combines a primary focus on distribution with supplementary direct sales, establishing a global sales network to mitigate market coverage costs and payment risks [3] Group 3: Strategic Importance - The acquisition is a strategic move to fill Unisoc's business gap in the power semiconductor field, which is crucial for energy conversion and control in emerging industries like electric vehicles and renewable energy [5] - This move allows Unisoc to expand its semiconductor product line and enhance its full industry chain layout from design to production and sales [5] - The global sales channels and R&D capabilities of Ruineng will aid Unisoc in further market expansion and technological innovation [5] Group 4: Financial Performance - For the first three quarters of 2025, Unisoc reported revenues of 4.904 billion yuan, a year-on-year increase of 15.05%, and a net profit of 1.263 billion yuan, up 25.04% [4] - The third quarter alone saw revenues of 1.857 billion yuan, reflecting a 33.60% year-on-year growth, with net profit soaring by 109.55% to 571 million yuan [4] Group 5: Strategic Alignment - The acquisition aligns with Unisoc's recent strategic initiatives, including the establishment of a central research institute focused on AI chips and high-performance sensors [6] - This dual approach of integrating advanced technology research with mature industry consolidation positions Unisoc to capitalize on the semiconductor industry's technological upgrades and domestic substitution opportunities [6] - Analysts suggest that Unisoc's diverse product offerings and market expansion efforts are likely to drive rapid revenue and profit growth in the future [6]

"江苏军团"规模效益双优 "十四五"时期，有着"苏大强"之称的江苏，交出了分量十足的资本市场成绩单：全省新增上市公司257家，其中约九成为科技企业 或科技含量较高的企业；全省上市公司总数达到721家，累计完成首发融资2259.71亿元、再融资3852.79亿元，为企业技术迭 代、产能扩张提供了充足资金"弹药"。 江苏上市公司群体既担负着引领传统行业转型破局的任务，又承载着科技创新和产业创新深度融合的希望。展望"十五五"，当地 将继续鼓励上市公司不断做优做强，为"经济大省挑大梁"提供坚实支撑。 南京青奥中心双子塔 苏州东方之门建筑群 图虫创意/供图 "十四五"时期，江苏上市公司群体实现了从"量的积累"到"质的飞跃"，成为稳定区域经济大盘的重要力量。 截至2025年12月29日，全省境内上市公司家数达721家，数量占全国的1/8，形成了全国规模领先的上市公司集群；总市值攀升 至8.9万亿元，较"十三五"末增长46%，千亿市值龙头企业从7家增至11家，行业引领作用持续凸显。直接融资渠道持续畅通，"十 四五"时期累计完成首发融资2259.71亿元、再融资3852.79亿元，为企业技术迭代、产能扩张提供了充足资金"弹药 ...

Core Viewpoint - Tianshu Zhixin (09903.HK), a general-purpose GPU company, has launched its global public offering in Hong Kong, aiming to raise approximately HKD 34.79 billion for product development, marketing, and operational expenses [2][5]. Group 1: IPO Details - The company plans to issue approximately 25.43 million shares, with an offer price set at HKD 144.60 per share [2]. - The public offering period is from December 30, 2025, to January 5, 2026, with the final pricing and allocation results to be announced on January 7, 2026 [2]. - Trading on the Hong Kong Stock Exchange is expected to commence on January 8, 2026, under the stock code 9903, with an entry fee of approximately HKD 14,605.83 [2]. Group 2: Use of Proceeds - Approximately 80% of the raised funds will be allocated to research and development of products and solutions [2]. - About 10% will be used for sales and marketing efforts, while the remaining 10% will serve as working capital and for general corporate purposes [2]. Group 3: Investor Participation - The IPO has attracted several cornerstone investors, including ZTE Corporation, UBS Group, and others, with a total investment of approximately HKD 15.83 billion, accounting for 43.02% of the total shares offered [3][4]. - Cornerstone investors will collectively subscribe to 10.94 million shares, representing about 4.30% of the company's post-issue total share capital [3][4]. Group 4: Company Overview - Tianshu Zhixin specializes in general-purpose GPU products and AI computing solutions, including GPU chips and customized AI solutions [5]. - The company has shown significant growth, with GPU shipments increasing from 7,800 units in 2022 to 16,800 units in 2024 [5]. - Despite rapid revenue growth, the company has not yet achieved profitability, reporting losses of RMB 5.24 billion, RMB 7.91 billion, RMB 8.92 billion, and RMB 6.09 billion for the years 2022 to 2025 [5].

消费电子ETF紧密跟踪中证消费电子主题指数，中证消费电子主题指数选取50只业务涉及元器件生产、 整机品牌设计及生产等消费电子相关的上市公司证券作为指数样本，以反映消费电子主题上市公司证券 的整体表现。 截至2025年12月30日 09:38，中证消费电子主题指数(931494)上涨0.70%，成分股信维通信(300136)上涨 6.78%，环旭电子(601231)上涨5.29%，芯原股份(688521)上涨3.64%，中芯国际(688981)上涨3.09%，通 富微电(002156)上涨2.67%。消费电子ETF(561600)上涨0.41%，最新价报1.22元。 消息面上，据高工产业研究院(GGII)不完全统计，2025年我国锂电产业链全环节公开投资项目(含锂电 池及主要材料、固态电池、钠电池)超282个，总投资额超8200亿元，同比增长超74%。 国开证券指出，固态电池作为下一代电池技术的核心，其在消费电子领域的渗透率有望从2025年的1% 提升至2030年的12%，高能量密度、高安全性的特性使其成为推动智能穿戴、高端手机及具身智能机器 人等产品升级的关键动力。随着氧化物/聚合物混合路线的半固态电池率先实 ...

Group 1 - The core point of the article highlights the performance and market position of Tongfu Microelectronics, which saw a stock increase of 1.28% to 37.88 CNY per share, with a total market capitalization of 57.487 billion CNY [1] - Tongfu Microelectronics, established on February 4, 1994, and listed on August 16, 2007, specializes in integrated circuit packaging and testing, with 96.98% of its revenue coming from these services [1] - The company is located in Chongchuan Development Zone, Nantong City, Jiangsu Province, and has a minor revenue contribution of 3.02% from the sales of molds and materials [1] Group 2 - From the perspective of fund holdings, Tongfu Microelectronics is a significant investment for the Huatai-PineBridge Fund, which holds 87,700 shares, representing 0.49% of the fund's net value, ranking it as the tenth largest holding [2] - The Huatai-PineBridge CSI 500 Index (LOF) A fund, established on August 10, 2017, has a current scale of 251 million CNY and has achieved a year-to-date return of 30.14%, ranking 1738 out of 4195 in its category [2] - The fund manager, Wu Zhenxiang, has a tenure of 15 years and 332 days, with the fund's total assets amounting to 19.781 billion CNY, and the best return during his tenure being 202.04% [2]

"十四五"时期，江苏资本市场以服务实体经济为核心，多点突破实现跨越式发展，交出一份数据亮眼、 成色十足的硬核答卷。 记者从江苏证监局获悉，截至2025年12月29日，江苏上市公司家数达721家，数量占全国上市公司总量 的八分之一。五年来，江苏资本市场直接融资功能持续强化，累计实现首发融资2259.71亿元、再融资 3852.79亿元，融资规模位居全国第四，为实体经济发展注入强劲动能。截至目前，江苏现有上市公司 总市值达8.9万亿元，较"十三五"末增长46%。千亿市值上市公司由"十三五"末的7家增加到11家，资本 市场"江苏板块"的实力持续攀升。 硬科技成色逐步提升 产业根基愈发坚实 依托江苏雄厚的产业基础，江苏证监局全力推动上市公司结构优化升级，让"硬科技"成色在资本市场持 续彰显。 通富微电（002156）子股份有限公司(以下简称"通富微电")的成长轨迹同样印证了资本市场的赋能价 值。记者获悉，借助IPO、再融资等资本市场融资渠道，通富微电累计募集资金约107.56亿元，持续助 力产能建设与经营规模稳步扩大。截至2024年末，公司营收、净利润较2020年末均实现翻倍；客户布局 上，已覆盖国际巨头企业及各细分 ...

Core Viewpoint - The company, TianShu ZhiXin, is planning a global offering of 25.4318 million H-shares at a price of HKD 144.60 per share, aiming to raise approximately HKD 3.4786 billion for product development and market expansion in the AI and GPU sectors [1][4]. Group 1: Company Overview - TianShu ZhiXin provides general GPU products and AI computing solutions, including GPU chips, accelerator cards, and customized AI computing solutions [1]. - The company integrates hardware with proprietary software stacks to meet specific customer needs in training and inference scenarios [1][2]. Group 2: Market Context - The rise of AI, particularly large language models, has significantly increased the demand for computing power, making general GPU products essential for supporting complex AI applications [2]. - The company's hardware architecture seamlessly integrates various chips and cluster systems, enhancing scalability from single-node to large-scale deployments [2]. Group 3: Investment Details - The company has entered into cornerstone investment agreements, with cornerstone investors committing to purchase a total of 10.9403 million shares at the offering price [3]. - The estimated net proceeds from the global offering will be approximately HKD 3.4786 billion, with 80% allocated for research and development of products and solutions [4]. Group 4: Fund Allocation - Approximately 50% of the net proceeds will be used for the R&D and commercialization of general GPU chips and accelerator cards over the next five years [4]. - About 25% will be allocated to developing proprietary software stacks by expanding the R&D team, while 5% will focus on AI computing solutions [4]. - The remaining funds will support sales and marketing efforts, operational costs, and general corporate purposes [4].

Core Insights - Jiangsu's listed companies are pivotal for regional economic development and are leading in the integration of technological and industrial innovation, with a projected total of 722 companies by December 29, 2025, accounting for 1/8 of the national total and a market capitalization of 8.9 trillion yuan, a 46% increase from the end of the 13th Five-Year Plan [2] Group 1: Financial Performance - In the first half of 2025, Jiangsu's listed companies achieved a total revenue of 1.7 trillion yuan, a year-on-year increase of 1.2%, contributing over 1/4 to the provincial GDP [3] - The net profit reached 152.7 billion yuan, with a year-on-year growth of 3.7%, indicating that the average growth rates for revenue and net profit are above the national average [3] - 60% of companies expanded their revenue, with 40% exceeding 1 billion yuan in revenue, and 45 companies reporting revenue growth over 50% [3] Group 2: Technological Advancement - Jiangsu has focused on directing resources towards high-end manufacturing, artificial intelligence, and biomedicine, with 257 new listed companies in the last five years, 90% of which are technology-oriented [3][4] - The province leads the nation with 115 companies listed on the Sci-Tech Innovation Board and 56 on the Beijing Stock Exchange [3] Group 3: Mergers and Acquisitions - During the 14th Five-Year Plan, Jiangsu's capital market saw 1,057 disclosed mergers and acquisitions, with 573 completed, totaling 304.2 billion yuan, accounting for over 1/9 of the national total [5] - The province has established a robust ecosystem for mergers and acquisitions, enhancing the inclusivity and adaptability of regulations [5][6] - Notable acquisitions include Huahai Chengke's acquisition of 70% of Hengsu Huawai for 1.12 billion yuan, significantly boosting production capacity in the semiconductor sector [6] Group 4: Shareholder Returns - Jiangsu's listed companies distributed a total of 394.6 billion yuan in dividends during the 14th Five-Year Plan, a 45.4% increase from the previous period, with a payout ratio rising to 37.8% [7] - The total amount for share buybacks reached 52.3 billion yuan, 2.6 times that of the previous five years, with 70 companies approved for special loans for buybacks [7] Group 5: Regulatory Environment - Jiangsu's regulatory body has enhanced the precision and effectiveness of oversight, resulting in a more orderly market ecosystem, with 27 companies facing administrative penalties during the 14th Five-Year Plan [8] - The establishment of the "Ningfa Ting Ni" Securities Mediation Court has helped recover over 45 million yuan for 649 investors, showcasing a commitment to investor protection [8]