Core Viewpoint - Huahai Chengke reported a significant increase in revenue and net profit for the year 2024, indicating a positive trend in the semiconductor packaging materials market as it enters a recovery phase after a downturn that began in late 2022 [1][4]. Financial Performance - The company's operating revenue reached 332 million yuan, a year-on-year increase of 17.23% - The net profit attributable to shareholders was 40 million yuan, up 26.63% year-on-year - The net profit after deducting non-recurring items was 34 million yuan, reflecting a growth of 24.59% year-on-year [1] - Cash flow from operating activities decreased significantly to 2.9765 million yuan, down 90.58% year-on-year, primarily due to increased employee compensation and reduced government subsidies [1] Product Performance - Revenue from epoxy encapsulation materials was 316 million yuan, an increase of 18.81% year-on-year, with a gross margin of 25.16%, down 0.40 percentage points from the previous year - Adhesive revenue was 15 million yuan, growing by 8.44% year-on-year, but with a gross margin of 35.05%, down 7.02 percentage points from the previous year [2][3] Market Position and Competition - Huahai Chengke is a leading domestic semiconductor packaging materials manufacturer, increasing its market share in traditional packaging while making technological breakthroughs in advanced packaging [4] - In the traditional packaging sector, domestic manufacturers dominate the market for epoxy encapsulation materials, while foreign brands have largely retreated - In advanced packaging fields like QFN, BGA, and FOWLP, foreign brands maintain a monopoly, with domestic brands still in the early stages of sales or R&D [5] Product Development and Future Outlook - The company is focusing on high-value-added products, although some products still face margin pressure - Huahai Chengke has successfully developed high-end packaging materials for advanced packaging applications, currently undergoing customer validation, with mass production expected to take time [6][5] - The company is progressing on investment projects, including a high-density integrated circuit packaging project, with 63.83% of the planned investment completed [7]

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告之內容概不負責，對其 準確性或完整性亦不發表任何聲明，並明確表示，概不對因公告全部或任何部份內容而 產生或因倚賴該等內容而引致之任何損失承擔任何責任。 上海復旦微電子集團股份有限公司 Shanghai Fudan Microelectronics Group Company Limited* (在 中 華 人 民 共 和 國 註 冊 成 立 的 股 份 有 限 公 司 ) (股 份 編 號: 1385) 海外監管公告 本公告乃上海復旦微電子集團股份有限公司（「本公司」）根據香港聯合交易所有限公司 證券上市規則第 13.10B 條的規定刊發。 茲載列本公司於上海證券交易所網站刊發的《2024 年年度報告》，僅供參閱。 承董事會命 上海復旦微電子集團股份有限公司 主席 蔣國興 中國，上海，2025 年 3 月 25 日 於本公告日期，本公司之執行董事為蔣國興先生、施雷先生、俞軍先生及沈磊先生； 非 執行董事為莊啟飛先生、張睿女士、宋加勒先生及閆娜女士；獨立非執行董事為曹鍾勇 先生、蔡敏勇先生、王頻先生及鄒甫文女士。 *僅供識別 上海复旦微电子集团股份有限公司 ...