2023 年 5 月台北电脑展，英伟达创始人兼 CEO 黄仁勋在结束了自家产品发布和演讲后匆匆离席。再 次出现时，黄仁勋已经来到联发科展台，握住了多年老友、联发科 CEO 蔡力行的手。 借此，英伟达、联发科两大芯片设计巨头宣布联手， " 发达联盟 " 就此成型，面向风起云涌又前景无 限的智能汽车，打造开发全新汽车芯片。 两年后， " 发达联盟 " 在上海车展发力。 4 月 23 日，联发科发布了基于双方最顶尖技术打造的天玑 汽车旗舰座舱平台 C-X1 。 绝大多数消费者乃至汽车行业人士，并不清楚这枚旗舰级座舱芯片背后的产业故事，但它的的确确串联 起了智能汽车芯片的过去和未来。 顶峰再聚首 虽然英伟达与联发科如今打得火热，但时间倒退十余年，双方其实是在移动 SoC 上相互竞争的对手。 那时联发科作为第一批国产智能手机的核心供应商，其 "Turn-key" 方案大放异彩，在 " 中华酷联 " 的崛起中占得先机。而英伟达从显卡转战而来，为了推介自家手机芯片，黄仁勋曾为小米 3 发布会站 台，高喊 " 我也是米粉 " 。 2014 年，两家公司短暂相交的命运线慢慢错开，并在漫长的坚持与等待中，分别找到了自己新的成长 ...

Core Insights - Black Sesame Intelligence Technology Co., Ltd. showcased its innovations in assisted driving, cockpit integration, and safety computing at the 2025 Shanghai International Auto Show, highlighting advancements from foundational chip technology to industry ecosystem collaboration [1] Company Overview - Founded eight years ago, Black Sesame has developed core IPs in ISP and NPU, creating the Huashan series (assisted driving chips) and Wudang series (cross-domain integration chips), and has become the "first stock of AI chips for smart cars" listed on the Hong Kong Stock Exchange [2] - The company has achieved breakthroughs with products like A1000 (the first domestically produced automotive-grade high-performance chip) and C1236 (the world's first cross-domain integration chip), with the upcoming A2000 series designed for high-performance AI computing [2] Technological Innovations - The Huashan A2000 family of chips, built on a 7nm automotive-grade process, integrates 12 functional units, enabling multi-task parallel processing. The self-developed "Jiushou" NPU architecture supports Transformer hardware acceleration and mixed precision computing, achieving top industry energy efficiency [5] - The A2000 family includes A2000 Lite, A2000, and A2000 Pro, catering to various levels of assisted driving needs, with advanced perception capabilities that allow vehicles to understand complex scenarios like tunnels and extreme weather [7] Strategic Collaborations - Black Sesame announced a strategic partnership with Intel to develop the "Intel & Black Sesame Cockpit Integration Platform," combining both companies' core technologies to provide high-performance, cost-effective, and reliable cross-domain integration solutions for global automakers [10] - The collaboration aims to create a prototype solution that integrates the Wudang 1200 family chips as a safety base, Intel's flagship processors for cockpit experience, and Huashan A2000 chips for assisted driving computations, ensuring agile iteration of intelligent systems [10] Product Launches and Market Impact - The company, in collaboration with Dongfeng Motor and Junlian Zhixing, has initiated mass production of the first domestic single-chip central computing platform based on the Wudang C1296 chip, marking a significant step in cockpit integration and assisted driving technology [8] - The C1296 chip, also built on a 7nm process, integrates hardware resources for smart cockpit, assisted driving, and vehicle control, supporting real-time data communication across multiple domains, with plans for mass production by 2025 [8][9]

近日，2025年中国电动汽车百人会论坛在北京钓鱼台国宾馆举行，以"夯实电动化、推进智能化、实现高 质量发展"为主题，包括高层论坛、国际论坛、理事研讨会、全球政策圆桌会、12场主题论坛及研究成果发 布。围绕车路云一体化发展、AI汽车、智能汽车创新技术与产业、聚合型智能产业、市场与消费、商用车可 持续发展等核心议题，共同探讨新能源汽车产业的高质量发展的方向。 中兴通讯副总裁、汽车电子总经理古永承出席AI汽车论坛，与多位业内同行一起探讨"打造AI汽车软硬件协同 生态"这一话题，发表了主题为《打造AI汽车新质生产力，助力智能网联汽车跃迁 》的演讲。他表示，2025年新能 源汽车正式进入智能化下半场，人工智能作为关键变量，正在推动智能网联汽车向更高质量发展。 域融合是未来整车AI智能的关键路径 构建芯片+OS+AI的软硬协同新范式加大加强开放开源体系建设 域融合是智能网联汽车发展的必然选择。在车端，打通智驾域、座舱域、车控域的数据闭环，实现环境感知、 决策控制与交互体验的有机统一；在路端，通过V2X技术连接智能路侧设备，形成超视距全局感知能力；在云端， 构建算力平台，支撑OTA持续进化。这种"车-路-云"三位一体的融合 ...