Core Viewpoint - The semiconductor industry chain is experiencing a significant upward trend, with multiple stocks reaching their daily limit up [1] Group 1: Industry Performance - The semiconductor industry chain has shown continuous growth, particularly in sectors such as photolithography machines and advanced packaging [1] - Several stocks, including Huawi Design, Kaiweite, San Chao New Materials, and others, have hit the daily limit up, indicating strong market interest [1] Group 2: Stock Movements - More than ten stocks have reached their daily limit up, showcasing robust performance in the semiconductor sector [1] - Companies like Blue Arrow Electronics, Kelong Co., Naike Equipment, and Longxin Technology have all seen their stock prices increase by over 10% [1]

Group 1 - The advanced packaging sector continues to rise, with multiple stocks hitting the daily limit, including Tongxingda (002845), Kangda New Materials (002669), Landi Group (603726), Kuaike Intelligent (603203), and Bomin Electronics (603936) [1]

Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications and high-performance computing [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a remarkable rate of 20.9% over the next five years, becoming a key driver for overall market growth [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is projected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is expected to increase rapidly due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets, along with the continuous application of advanced packaging technology, is expected to sustain healthy growth in the coming years [15]. - The integration of AI applications in various sectors, including automotive and consumer electronics, is driving the demand for advanced packaging solutions [30]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei are highlighted as key players benefiting from the local supply chain advantages in the advanced packaging sector [5]. - Significant investments in packaging projects are underway, with total planned investments amounting to approximately $100 billion [29]. - The ongoing demand for advanced packaging solutions is expected to lead to sustained revenue growth for companies involved in this sector [30].

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 珍惜有限 创造无限 1.1 半导体产业在全球经济中发挥关键作用，计算和存储、汽车、无线通信是主要增量 图表1：全球半导体产业链的倒金字塔结构 年产值 娱乐、软件、网络、电商、传媒、大数据等数字经济产业, 几十万亿美元 电子系统 万亿美元 千亿美元 材料(1%) 500亿美元+ 封装(5%) EDA 190亿美元+ n *括号内百分数表示2024年YoY 资料来源：ESD Al l iance，SEM ， Yol e，TrendForce，Wind，弗若斯特沙利文，江 苏半导体行业协会，五矿证券研究所 图表2:全球半导体市场规模周期性波动上升(亿美元) 2021-2030 - 10000 2021-2030 CAGR 7% 8000 智诗西献 -5% 育线电 960 消费电子 -10% 工业电力 1310 ~10% 6000 1470 上 -20% 12 370 4000 线遇信 200 25% 6 1720 2000 3610 -25% 计算和存储 2240 0 2025E 2030E 1990年 199 ...

Core Viewpoint - The company plans to raise funds through a private placement of shares to enhance its core competitiveness and support the development of semiconductor equipment, with a total fundraising target of up to 313,203.05 million RMB [1][2]. Fundraising Plan - The company intends to issue no more than 188,648,115 shares, raising funds primarily for a "semiconductor equipment R&D project" and to supplement working capital [1][2]. - The total investment for the semiconductor equipment R&D project is estimated at 383,958.72 million RMB, with 219,243.05 million RMB expected to come from the raised funds [12]. Background and Purpose of Fundraising - The integrated circuit industry is a strategic and foundational sector for national security and economic development, with significant growth potential driven by domestic and international market demands [2][3]. - National policies strongly support the development of the integrated circuit industry, recognizing it as a key area for enhancing national strategic technological capabilities [3][4]. Market Trends and Opportunities - The semiconductor equipment market is expected to grow significantly, with global semiconductor sales projected to reach 626 billion USD in 2024, a year-on-year increase of 18% [4][11]. - The demand for semiconductor equipment is driven by advancements in AI, automotive electronics, and 5G technologies, which are expanding the market for chips and related equipment [4][11]. Company’s Competitive Position - The company has established a strong technical foundation in integrated circuit testing equipment, with over 50% of its workforce dedicated to R&D [9]. - The company has developed core technologies in testing machines and AOI equipment, positioning itself to meet the growing demand for domestic semiconductor equipment [9][10]. Investment Project Details - The semiconductor equipment R&D project aims to develop testing machines and AOI equipment, enhancing the company's product line and meeting diverse market needs [8][10]. - The project is supported by favorable national policies and the company's existing technical capabilities, ensuring its feasibility and alignment with industry trends [9][10]. Financial Impact - The fundraising will improve the company's financial structure, reduce debt risk, and support ongoing business expansion and R&D efforts [12][13]. - While there may be short-term dilution of earnings per share due to increased share capital, the long-term benefits from the investment projects are expected to enhance overall profitability [14].

Core Viewpoint - Century Internet is positioning itself as a platform company that aims to facilitate the transition into the world of Artificial General Intelligence (AGI) through innovative infrastructure and collaborative intelligence [1][4] Group 1: Strategic Vision - The founder of Century Internet, Chen Sheng, emphasizes the importance of creating a platform that serves as a gateway to the AI world, likening it to the magical 9th platform in Harry Potter [1] - The company aims to evolve from merely being a service provider to becoming an integral part of the collaborative intelligence ecosystem, participating actively in the development of new AI paradigms [2][4] Group 2: Technological Innovations - The company is focusing on upgrading its cloud computing platform to incorporate a comprehensive software virtualization that aligns with the emerging cloud-native technologies [3] - Chen Sheng highlights the need for advanced packaging of AI infrastructure, which is essential for delivering integrated hardware and software solutions to clients [3] Group 3: Infrastructure Development - Century Internet is committed to engineering innovation, with each infrastructure project being treated as a product that undergoes continuous iteration to achieve high quality and performance [4] - The company aims to create a seamless connection between clients and data centers, utilizing advanced protocols like RDMA to enhance performance [4] Group 4: Collaborative Intelligence Roadmap - The company has outlined a roadmap for developing a new generation of collective intelligence, starting with the private deployment of open-source large models and progressing towards decentralized networks [5] - The goal is to achieve significant milestones in collective intelligence through collaboration and shared success among stakeholders [5]

Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a CAGR of 20.9% over the next five years, becoming a key driver for market expansion [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is expected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is rapidly increasing due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets and the ongoing application of advanced packaging technology are expected to sustain healthy growth in the coming years [15]. - AI applications are driving long-term growth in semiconductor revenues, with the AI-related semiconductor market projected to grow at a CAGR of 28.9% from 2024 to 2033 [27]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei Company are recommended for investment due to their breakthroughs in niche areas of the domestic equipment market [5]. - Major packaging projects are underway or planned, with total investments amounting to approximately $100 billion [29].

Group 1 - The brain-computer interface sector experienced a decline of 3.34%, ranking among the top losers in the concept sector as of the market close on June 20 [1][2] - Within the brain-computer interface sector, major companies such as Hanwei Technology, Nanjing Panda, and Aipeng Medical saw significant declines, while only two stocks, Haige Communication and ST Huatuo, recorded gains of 1.46% and 1.05% respectively [1][2] - The sector faced a net outflow of 546 million yuan from main funds, with 23 stocks experiencing net outflows, and seven stocks seeing outflows exceeding 30 million yuan [2] Group 2 - Hanwei Technology led the outflow with a net withdrawal of 133 million yuan, followed by Innovative Medical and Tom Cat with outflows of 129 million yuan and 116 million yuan respectively [2][3] - The stocks with the highest net inflows included ST Huatuo, Haige Communication, and Lepu Medical, with inflows of 58.93 million yuan, 35.06 million yuan, and 23.44 million yuan respectively [2][3] - The trading volume for Hanwei Technology was 12.95%, indicating a high turnover rate despite the decline of 6.59% in its stock price [2][3]

Group 1: Institutional Trading Insights - On the institutional trading leaderboard, 28 stocks were listed, with 16 experiencing net buying and 13 facing net selling [1] - The top three stocks with the highest institutional buying were: Limin Co., Ltd. (75.16 million), Saiseng Pharmaceutical (71.78 million), and Haike Xinyuan (37.08 million) [1] Group 2: Stock Performance and Market Trends - Limin Co., Ltd. saw a decrease of 9.98% with a net buying amount of 105 million [2] - Saiseng Pharmaceutical experienced a significant increase of 19.97% with a net buying amount of 57.49 million [2] - Haike Xinyuan had a notable rise of 20.00% with a net buying amount of 37.09 million [2] Group 3: Industry Developments - Saiseng Pharmaceutical's subsidiary, Junyuan Pharmaceutical, produces ursodeoxycholic acid tablets, indicating a focus on relevant production capabilities [3] - The solid-state battery sector is advancing, with companies like Kexin and Taiblue New Energy developing new materials and products for battery applications [3] - The Ministry of Industry and Information Technology is expected to conduct a mid-term review of solid-state battery projects by the end of 2025, with key developments anticipated between 2025 and 2026 [3] Group 4: Market Opportunities in Advanced Packaging - The advanced packaging market is projected to grow from 30.4 billion in 2020 to approximately 47.5 billion by 2026, increasing its market share from 45% to 50% [5]

Market Performance - The PET copper foil sector saw a daily increase of 2.09%, while the combustible ice sector experienced a decline of 4.14% [1] - The advanced packaging concept gained 0.79%, ranking 8th among concept sectors, with 67 stocks rising [3] Capital Flow - The advanced packaging sector attracted a net inflow of 275 million yuan, with 54 stocks receiving net inflows, and 10 stocks exceeding 50 million yuan in net inflow [1] - Strongly performing stocks in the advanced packaging sector included Strong New Materials with a net inflow of 461 million yuan, followed by Sanjia Technology and Guangli Technology with net inflows of 157 million yuan and 127 million yuan, respectively [1][2] Stock Performance - Notable stocks that hit the daily limit included Guangli Technology, Strong New Materials, and Zhengye Technology, all achieving a 20% increase [3] - Stocks with significant gains included Jingwei Huikai, Yanggu Huatai, and Sanjia Technology, which rose by 10.84%, 9.11%, and 7.33%, respectively [3] Capital Inflow Ratios - Leading stocks in capital inflow ratios included Saiwu Technology, Zhengye Technology, and Strong New Materials, with net inflow rates of 58.71%, 33.90%, and 27.48% respectively [2]