芯片超人组织的日本商务考察活动 正在招募！12月出发，为期 6天，重点参加 SEMICON Japan 2025，并 实地走访日本当地知名半导体企业与高校，挖掘日本半导体产业芯机会！ 点击上图查看活动详情，或联系客服咨询：ICSuperman88。 作者简介： 汤之上隆先生为日本精密加工研究所所长，曾长期在日本制造业的生产第一线从事半导体研发工作，2000年获 得京都大学工学博士学位，之后一直从事和半导体行业有关的教学、研究、顾问及新闻工作者等工作，曾撰写 《日本"半导体"的失败》 、 《"电机、半导体"溃败的教训》 、 《失去的制造业：日本制造业的败北》 等著 作。 0 1 Rapidus不仅涉足前道工艺 还进军后道工艺 国际半导体封装及后道工艺技术会议"ICEP-IAAC2025"于2025年4月在日本长野县举办，据报 道，Rapidus在该会议的主旨演讲中进行发言： "半导体代工厂Rapidus正在加速开发最先进的封装技术。为 了 在高速成长的生成式人工智能 （AI） 市场中，赢得GAFAM （ Google ， Apple ， Facebook 现已更名为Meta ， Amazon和 Microsof ...

Siemens' new Innovator3D IC solution suite delivers a fast, predictable path for planning and heterogeneous integration, substrate/interposer implementation, interface protocol analysis compliance and data management of designs and design data IP. Built on an AI-infused user experience offering extensive multithreading and multicore capabilities to achieve optimal capacity and performance on 5+ million pin designs, the new Innovator3D IC solution suite is comprised of the Innovator3D IC Integrator, a consol ...

势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 添加文末微信，加 先进封装 群 "宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 三维集成电路（3D IC）已为后摩路径中的产品设计提供了极大的灵活、便利与复用性，越来越多 的AI算力与高端数模混合集成正在运用堆叠芯片架构来获得下一代产品。堆叠芯片与先进封装技术 对产品的性能、功能、成本、迭代方式均至关重要。 然而，三维堆叠芯片（2.5D/3D/3.5D）包含多个堆叠芯片（Stacked Die），这些Die通过中介层 上特殊过孔（via）或互连凸块（bump）来实现所需的连接。然而，根据工艺规则独立验证这些独 立Die和基板的物理集成与之互连精度，并不能确保整个2.5D/3D封装系统得到最终的正确，设计 者们需要针对多种堆叠方式进行自动化的验证，包括版图原理图一致性与设计规则。 3Sheng Stratify™（EDA）工具为堆叠芯片设计中的Die与Die之间、Die与中介层互连接口提供快 速、准确的组装级验证。 对于来自多个工艺节点的Die设计的互连进行操作，从物理规则与设计版 图层 ...

来源： 硅芯科技官微 硅芯科技自研3Sheng Integration Platform，实现三维堆叠芯片的系统级规划、物理实现与分 析、可测性与可靠性设计等，集成"系统-测试-综合-仿真-验证"五引擎合一，具有统一数据底 座，支持三维异构集成系统的敏捷开发与可定制化的协同设计优化，并在多个功能和性能上具有 独创性。 直面需求 3月在HiPi联盟大会，已听到 多位业内顶级设计专家发声Chiplet和3D IC对设计和EDA挑战。 近年来国内设计三维异构集成芯片的困扰似乎集中于设计出的堆叠结构，却在仿真和验证以后 仍然发现诸多问题！于是 "缺乏架构设计，急需设计协同和优化，设计要素全线左移" 已经成 为了业界对三维芯片堆叠设计的共识！ 要做一个设计，初心始于SoC的迭代，如果没有架构设计，严格说是能融合支持IP划分、工艺 选择、版图探索、前仿真、互连检查与优化、基于电源和热的物理实现、跨Die物理签核的多 点协同设计的架构设计和早期分析工具，那这样的设计通常会南辕北辙。 在近期硅芯科技的行业分享讲座上，创始人赵毅博士 基于业界3D IC设计遇到的问题 做了又 一轮的总结。其中提到：顶层架构对于应用场景、有效探索 ...

Financial Data and Key Metrics Changes - Cadence reported a 23% year-over-year revenue growth, achieving total revenue of $1.242 billion for Q1 2025 [6][19] - Non-GAAP EPS increased by 34%, reaching $1.57, while GAAP EPS was $1.00 [6][19] - Non-GAAP operating margin was 42%, with GAAP operating margin at 29.1% [17][19] - Cash balance at the end of the quarter was $2.778 billion, with $2.5 billion in outstanding debt [19] Business Line Data and Key Metrics Changes - The IP business grew by 40% year-over-year, driven by strong market opportunities in AI and chiplet-based architectures [11] - Core EDA revenue increased by 16% year-over-year, with significant demand from AI and HPC customers [12][14] - The system design and analysis business saw over 50% year-over-year revenue growth, benefiting from AI-driven optimization solutions [15] Market Data and Key Metrics Changes - The China business experienced a year-over-year growth acceleration to 13% in Q1, up from 10% in the previous quarter [23] - The company remains prudent in its outlook for China, assuming flat revenue for the year despite positive trends [26][27] Company Strategy and Development Direction - Cadence is focusing on expanding its AI portfolio and enhancing its end-to-end solutions to meet the growing demand in the semiconductor industry [8][16] - The company is actively pursuing partnerships, including a collaboration with NVIDIA to develop AI solutions [8][11] - Cadence is also expanding its design IP portfolio through acquisitions, including the pending acquisition of Arms Artisan Foundation IP business [12][68] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the resilience of the business model, citing strong customer demand and ongoing investments in R&D [7][21] - The company raised its financial outlook for 2025, projecting revenue between $5.15 billion and $5.23 billion [20][21] - Management noted that the macroeconomic environment remains uncertain, but customer behavior has not shifted significantly [7][34] Other Important Information - Cadence was recognized as one of the "100 Best Companies to Work For," ranking 11th [16] - The company repurchased $350 million worth of shares in Q1, reducing the share count [19] Q&A Session Summary Question: Growth in China Business - Management acknowledged the strong performance in China but remains cautious, maintaining a flat revenue assumption for the year [26][27] Question: Tariff Exposure - Management confirmed that software and services are not subject to tariffs, and the diversified supply chain mitigates risks from tariffs on hardware [32][34] Question: Hardware Demand and Capacity - Demand for hardware continues to exceed supply, but the company has a resilient supply chain to manage production [52] Question: Technical Enhancements and Investments - Key areas of focus include AI integration, 3D IC technology, and enhancing hardware capabilities [60][62] Question: IP Acquisition Strategy - Management emphasized the importance of expanding the IP portfolio to meet customer demand and adapt to the evolving foundry landscape [68][112] Question: Data Center Digital Twins - The acquisition of Future Facilities is expected to enhance capabilities in data center design and optimization, presenting significant market opportunities [120][121]

Cadence Design Systems (CDNS) Q1 2025 Earnings Call April 28, 2025 05:00 PM ET Company Participants Richard Gu - Vice President, Investor RelationsAnirudh Devgan - President and CEOJohn Wall - Senior VP & CFOHarlan Sur - Executive Director - Equity ResearchVivek Arya - Managing DirectorGianmarco Conti - Director - Technology Equity ResearchJay Vleeschhouwer - Managing DirectorJoshua Tilton - DirectorSiti Panigrahi - Managing DirectorRuben Roy - Managing Director - Equity Research Conference Call Participant ...

多种薄膜新工艺设备实现批量出货，关键材料持续突破。 公司拓展了芯片沟槽填充用Flowable CVD设 备，多台通过客户验证；基于新平台、新反应腔的PECVD Stack（ONO叠层）、ACHM等先进工艺设备 实现了大批量出货，通过客户验证；ALD SiCO、SiN、AlN等工艺设备实现大批量出货。目前公司推出 的PECVD、ALD、SACVD、HDPCVD及Flowable CVD薄膜设备可以支撑全部介质薄膜材料的约100多 种工艺应用。 点击招商研究小程序查看PDF报告原文 拓荆科技发布2024年报，24Q4利润快速释放，在手订单同比高增长。公司多种薄膜新工艺设备实现批 量出货，3D IC领域混合键合设备获得重复订单。 24Q4利润快速释放，在手订单同比高增长。 1）2024全年： 公司收入41亿元，同比+51.7%；归母净利 润6.88亿元，同比+3.86%；扣非净利润3.56亿元，同比+14.1%；截至2024年底，公司在手订单约94亿 元，同比+46.3%； 2）24Q4： 公司收入18.26亿元，同比+82%/环比+81%；毛利率39.3%，同 比-12.8pcts/环比持平，同比承压主要系新品或 ...

Investment Rating - The report maintains an "Accumulate" investment rating for the company [1][3]. Core Insights - The company has experienced significant growth in its order backlog, with a year-on-year increase of 46.3%, amounting to approximately 9.4 billion yuan by the end of 2024 [7]. - The company reported a rapid profit release in Q4 2024, with revenue reaching 1.826 billion yuan, representing an 82% year-on-year increase [7]. - The company has successfully launched multiple new film process equipment, achieving bulk shipments and receiving repeat orders in the 3D IC field [7]. - The projected revenue for the company is expected to grow significantly, with estimates of 5.411 billion yuan in 2025, 6.862 billion yuan in 2026, and 8.513 billion yuan in 2027 [2][7]. Financial Data and Valuation - Total revenue for 2023 is reported at 2.705 billion yuan, with a year-on-year growth of 59% [2][10]. - The net profit attributable to the parent company for 2024 is projected at 688 million yuan, reflecting a 4% increase compared to the previous year [2][10]. - The company's PE ratio is expected to decrease from 67.9 in 2023 to 25.7 by 2027, indicating improving valuation metrics over time [11]. Performance Metrics - The company's gross margin for Q4 2024 was reported at 39.3%, with a year-on-year decrease of 12.8 percentage points [7]. - The return on equity (ROE) for 2023 was 13.0%, with projections indicating an increase to 21.4% by 2027 [3][10]. - The company's total assets are expected to grow from 9.969 billion yuan in 2023 to 23.470 billion yuan by 2027 [9].

人工智能从海量数据中挖掘模式的能力正在从根本上改变芯片的使用方式、设计方式以及封装和制 造方式。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自 semiengineering ，谢谢。 复杂性、不确定性和大量的变动因素将在未来几年对半导体行业构成挑战。 这些转变在大型数据中心内部使用的高性能AI架构中尤为明显，在这些架构中，芯片被部署用于 处理、移动和存储海量数据。但随着用于设计和验证这些多芯片系统的EDA工具和流程的不断发 展，它们也开始影响其他类型的芯片。几十年来，传统的"孤岛"模式提升了半导体设计的效率和可 预测性，如今正在瓦解，促使整个行业开始重新思考设计团队的组织方式、设计团队如何与组织内 外的其他团队互动，以及如何利用AI来改进AI芯片的设计。 新思科技首席产品管理官 Ravi Subramanian 表示："人工智能将重塑 EDA。它将彻底定义计算领 域的可能性，并触及芯片设计、验证和制造的方方面面。过去只涉及电气性能的单一领域，如今则 涵盖热性能、机械应力等等。需要同时分析的领域数量之多，正在推动一种全新的芯片设计方 式。" 其他人也同意这一观点。Cadence验证软件产品管理高 ...