近日，盛合晶微半导体有限公司(下称"盛合晶微")更新科创板上会申报稿。 据公开信息，上海证券交易所上市审核委员会将于2月24日对公司的首发上市事项进行审核。对于正处于重构阶段的全球封测产业而言，盛合晶微的上市 进程正受到资本市场愈发密切的关注。 业内普遍认为，先进封装供应商的核心壁垒，并不仅限于技术能力和产能规模，更体现在其能否通过严格的头部客户验证。全球主要芯片企业对新供应商 的认证需经历极为严苛的流程，周期较长，且往往对制造标准、产品稳定性和量产一致性提出更高要求。尤其是在部分客户供应链布局集中度较高的情况 下，进入供应链后能够保持合作延续的企业更具稀缺性。 盛合晶微在多个核心领域的持续通过验证，在一定程度上反映出其在交付能力、质量控制及工艺迭代方面的长期积累。 核心经营指标稳步向好 行业竞争力与成长性同步增强 在稳固客户基础的同时，公司主要经营指标亦保持稳步增长。 全球头部客户持续扩容 供应链壁垒进一步稳固 近年来，全球集成电路产业链持续调整，先进封装成为行业增长最快的板块之一。无论是智能终端、5G通信还是高算力人工智能芯片，市场对更高性 能、更低功耗的封装技术需求明显提升。 在此背景下，深耕先进封测多 ...

Core Viewpoint - The article emphasizes the evolving landscape of mature process semiconductor manufacturing, highlighting its increasing importance in the global market and the shift in focus from capacity supply to value and reliability in production, particularly in automotive applications [1][3]. Group 1: Market Dynamics - By 2025, China's mature process chip capacity is expected to account for approximately 28% of the global market, with projections to rise to 39% by 2027 [1]. - The demand for mature process chips is stable and substantial, leading to a wave of capacity expansion and concerns about structural oversupply [1]. Group 2: Automotive Industry Requirements - The automotive industry demands high reliability and consistency in chip production, which creates a significant barrier to entry for foundries due to stringent certification processes [3][4]. - Automotive chips must maintain performance across wider temperature ranges and complex conditions, necessitating higher standards for manufacturing consistency [3]. Group 3: Competitive Landscape - The core competitiveness in automotive foundry does not lie in single-point technologies but in comprehensive system capabilities, including long-term stable multi-process platforms and quality control systems [4][8]. - Companies like Jiata Semiconductor leverage nearly 30 years of experience in automotive electronics to establish a robust quality management system, differentiating themselves from traditional foundries [4]. Group 4: Systematic Approach to Manufacturing - Jiata Semiconductor focuses on building a "automotive foundry base" that emphasizes long-term stable supply and system capability rather than betting on specific process nodes [8][10]. - The company provides a complete manufacturing support system for automotive power systems, integrating various components across different process platforms [8][9]. Group 5: Advanced Packaging and Integration - The traditional linear division of labor in the semiconductor industry is being disrupted by advanced packaging needs, particularly with Chiplet architectures requiring deep collaboration between manufacturing and packaging [10]. - Jiata Semiconductor positions itself as a key player in the Chiplet ecosystem, offering a comprehensive technology library to meet diverse customer needs [10]. Group 6: Redefining the Role of Foundries - The role of foundries is evolving from mere manufacturing to becoming system-level enablers in the product innovation process, fostering long-term technical collaboration with clients [12][16]. - By engaging early in the design process, Jiata aims to clarify system architecture and reduce the risk of redundant competition, moving away from price wars [14][15]. Group 7: Strategic Vision - Jiata Semiconductor's strategy focuses on building differentiated capabilities through systematic collaboration rather than competing solely on price, aiming for sustainable value creation [18]. - The company emphasizes a long-term commitment to quality and customer service, positioning itself for competitive advantage in the evolving semiconductor landscape [18].

证券研究报告：电子 | 公司点评报告 股票投资评级 资料来源：聚源，中邮证券研究所 强劲增长 l 投资要点 三温、大平台超多工位测试分选机持续放量。根据 SEMI 数据， 2025 年全球半导体测试设备销售额预计激增 48.1%至 112 亿美元，封 装设备销售额增长 19.6%至 64 亿美元。2026、2027 年测试设备销售 额预计继续增长 12.0%和 7.1%，封装设备销售额预计增长 9.2%和 6.9%。驱动力来自器件架构复杂度提升、先进/异构封装加速渗透， 以及 AI 与 HBM 对性能的严苛要求。公司所在的半导体封装和测试设 备领域需求持续增长，三温测试分选机及大平台超多工位测试分选机 （针对于效率要求更高的大规模、复杂测试）等需求持续增长，公司 测试分选机产品销量实现较大提升，经财务部门初步测算，预计2025 年度实现归母净利润 1.6-2.1 亿元，同比增加 103.87%-167.58%；扣 非归母净利润 1.55-2.05 亿元，同比增加 128.83%-202.64%。 算力、汽车、先进封装等发展催涨分选机需求。Chiplet 架构在 AI 训练芯片、HPC 处理器中的广泛应用，使得 ...

证券研究报告：电子 | 公司点评报告 股票投资评级 资料来源：聚源，中邮证券研究所 公司基本情况 | 最新收盘价（元） | 277.08 | | --- | --- | | 总股本/流通股本（亿股）0.60 | / 0.42 | | 总市值/流通市值（亿元）166 | / 116 | | 52 周内最高/最低价 | 303.69 / 70.00 | | 资产负债率(%) | 17.7% | | 市盈率 | 205.24 | | 第一大股东 | 崔学峰 | 研究所 分析师:翟一梦 SAC 登记编号:S1340525040003 Email:zhaiyimeng@cnpsec.com 分析师:吴文吉 SAC 登记编号:S1340523050004 Email:wuwenji@cnpsec.com 金海通(603061) 强劲增长 l 投资要点 三温、大平台超多工位测试分选机持续放量。根据 SEMI 数据， 2025 年全球半导体测试设备销售额预计激增 48.1%至 112 亿美元，封 装设备销售额增长 19.6%至 64 亿美元。2026、2027 年测试设备销售 额预计继续增长 12.0%和 7.1%，封装设备 ...

Investment Rating - The report maintains a "Buy" rating for Jiangsu Changjiang Electronics Technology Co., Ltd. (长电科技), Haiguang Information Technology Co., Ltd. (海光信息), and Guanghe Technology Co., Ltd. (广合科技) [7][14] Core Insights - Jiangsu Changjiang Electronics Technology Co., Ltd. has made significant progress in the CPO product technology field, successfully delivering samples of its XDFOI process silicon photonic engine, which optimizes energy efficiency and bandwidth performance [12][13] - Intel showcased its EMIB glass substrate technology at the NEPCON Japan electronics exhibition, demonstrating the capability of glass substrates to support complex multi-chip configurations, offering advantages over traditional organic substrates [13] - The report highlights the increasing demand for PCBs driven by emerging technologies such as 5G, AI, and automotive electronics, with China becoming the largest PCB production base globally [28][29] Summary by Sections Company Performance and Forecast - Jiangsu Changjiang Electronics Technology Co., Ltd. is projected to have an EPS of 1.23 in 2026 with a PE ratio of 39.73 [7][14] - Haiguang Information Technology Co., Ltd. is expected to achieve an EPS of 1.58 in 2026 with a PE ratio of 174.68 [7][14] - Guanghe Technology Co., Ltd. is forecasted to have an EPS of 2.67 in 2026 with a PE ratio of 37.33 [7][14] Industry Dynamics - The electronic industry saw a 1.39% increase in the week of January 19-23, ranking 22nd among the primary industries [15][24] - The AI computing-related sub-sector experienced a significant increase, with the integrated circuit packaging and testing sector rising by 7.25% [18][20] - The PCB industry is expected to recover from a downturn, with revenue growth projected to stabilize in 2025 after a challenging period in 2023 [29][30] Market Trends - The report notes a trend of increasing orders in the data processing sector, with AI-related orders constituting over 73% of new contracts for companies like Chip Origin Technology [42][43] - The automotive industry faces challenges due to rising memory prices, which could significantly impact manufacturing costs and supply availability [46][47]

Group 1 - The company has assisted clients in designing Chromebook chips based on Chiplet architecture [1] - The chips utilize advanced System in Package (SiP) technology [1] - The design integrates high-performance SoC and multiple IPM memory components [1]

Core Insights - The company aims to achieve sales exceeding 500 billion yen by the fiscal year 2028, with an operating profit margin of over 20% and a return on equity (ROE) of over 9% [3][4][6] Group 1: Financial Goals - The company has set a target to achieve net sales exceeding 215 billion yen in its LSI business, with an operating profit margin of over 23% [7] - The goal for the power device business is to achieve net sales exceeding 175 billion yen, with an operating profit margin of over 14% [11] - The company aims for sales exceeding 110 billion yen in general equipment and other businesses, with an operating profit margin of over 22% by the fiscal year 2028 [16] Group 2: Strategic Focus Areas - The company plans to focus on power and analog semiconductors, particularly in the automotive sector, which is expected to account for 55% of total sales, approximately 275 billion yen [4] - There will be an increased investment in optical devices for sensing applications, aiming to cultivate this area as a next-generation growth pillar [4] - The company intends to enhance its competitive edge through proprietary technologies, including the development of Chiplet architecture and AI technologies [10] Group 3: Operational Improvements - To achieve the target of 100 billion yen in operating profit, the company will optimize its business portfolio, reduce manufacturing costs, and adjust pricing strategies [6] - The company is focusing on improving the production of SiC substrates and aims to transition to 8-inch wafers for better yield and quality [14] - The company plans to enhance the sales of high-value SiC power modules and expects to triple its customer base in Europe and the Americas by the fiscal year 2028 [13]

Market Overview - The main board led the gains with notable increases in stocks such as Yingqu Technology (+10.03%), Nengke Technology (+10.01%), and Guanshi Technology (+10.00%) [1] - The ChiNext board saw significant rises, particularly in Huijin Co., Ltd. (+20.00%) and Chuling Information (+20.00%) [1] - The Sci-Tech Innovation board also experienced strong performance, with Pinming Technology (+20.01%) and Yunzhuang Technology (+15.25%) leading the way [1] - Active sub-industries included SW Semiconductor Equipment (+3.41%) and SW Printed Circuit Boards (+3.16%) [1] Domestic News - Chongqing Konka Optoelectronics made significant progress in AR micro-display technology, developing an active driving blue Micro LED display with a resolution of 640×480 and a pixel density of 6773 PPI [1] - Zhaoxin announced more specifications for its KHS-50000 series server processors, which can integrate up to 96 high-performance computing cores and provide up to 384MB of L3 cache [1] - The Arctic Xiongxin QM935-G1 IVI Chiplet was successfully tested, designed for smart cockpit applications, featuring a GPU core with a computing power of 1.3T FLOPS [1] - He Yi Guangxian achieved a milestone with cumulative deliveries of over 500,000 large-size OLED panels, supported by a total investment of 6 billion yuan to create the largest single OLED module factory in China [1] Company Announcements - Yongding Co., Ltd. announced a cash dividend of 0.035 yuan per share, totaling approximately 51.17 million yuan based on a total share capital of 1,461,994,802 shares [3] - Qingyi Optoelectronics reported its cash dividend distribution based on a total share capital of 314,800,000 shares, with 313,076,581 shares eligible for distribution after excluding repurchased shares [3] - O-film Technology disclosed that its subsidiary received a government subsidy of 16.58 million yuan, representing 28.39% of the latest audited net profit attributable to shareholders [3] - Dash Smart signed a contract for a smart hospital project worth 113 million yuan with China State Construction Engineering Corporation [3] International News - South Korean startup HyperAcce plans to launch an AI chip using Samsung's 4nm process in 2026, which offers significant price advantages over NVIDIA GPUs while maintaining 90% memory bandwidth [1] - U.S. Commerce Secretary reiterated plans for a major trade agreement with Taiwan, promoting a "50-50" semiconductor production model between the U.S. and Taiwan [1] - Diraq, a quantum technology startup, demonstrated that silicon-based quantum chips produced in semiconductor factories can achieve over 99% fidelity, comparable to those made in laboratory settings [1] - HanChem, a South Korean high-end materials company, completed the development of five new mass production materials in the first half of the year and aims for annual sales of 100 billion won (approximately 5 billion yuan) by 2030 [1]

Core Viewpoint - Samsung and SK are engaged in a subtle psychological battle over the AI semiconductor company Rebellion, as both giants aim to secure a foothold in the next-generation AI chip market, making Rebellion's strategic direction highly significant [2]. Group 1: Investment and Valuation - Rebellion is currently undergoing a Series C funding round, with expected investments reaching up to $200 million (280 billion KRW) and a valuation of 1.55 trillion KRW. The company has attracted global investors, including Qatar Investment Authority, LionX Ventures, and Soros Fund Management, leading to a rapid increase in its valuation [2]. - Samsung Securities and Samsung Venture Investment are participating in this funding round, marking their first involvement in any financing round for Rebellion. The investment is reportedly funded indirectly through Samsung Electronics, although specific amounts have not been disclosed [2]. Group 2: Strategic Partnerships and Mergers - Rebellion has maintained a close business relationship with Samsung Electronics, integrating Samsung's HBM and other memory semiconductors into its products and utilizing Samsung's foundry for mass production. For its next-generation chip, Rebel Quad, Rebellion plans to communicate directly with Samsung Electronics [3]. - Rebellion is merging with SK Telecom's subsidiary, Sapion Semiconductor, which will make SK Group the largest shareholder. Sapion is an AI semiconductor company that was spun off from SK Telecom's internal R&D department [3]. Group 3: Technology and Product Development - Rebellion announced the launch of its next-generation AI semiconductor, REBEL-Quad, at the Hot Chips Symposium 2025. The chip utilizes Samsung's 4nm process technology, offers performance comparable to NVIDIA's Blackwell, and features HBM3E memory with a capacity of up to 144GB and a bandwidth of 4.8TB/s [7]. - The REBEL-Quad chip employs a chiplet architecture, making it the first product to implement high-speed chiplet-to-chiplet communication using the UCIe-Advanced standard, which enhances data transfer speed and reliability while reducing power consumption [7]. - Rebellion's proprietary memory processing technology enhances inference speed, enabling more stable and efficient model services in large-scale AI environments. The company also demonstrated the Qwen3 Model 235B MoE at the symposium, attracting significant attention from local AI experts [8]. Group 4: Competitive Landscape - There is a consensus that SK Hynix has a technological edge in HBM over Samsung, which could provide SK Group with an opportunity to promote its HBM technology. The choice of HBM supplier may significantly impact future chip production [5]. - Industry insiders suggest that the collaboration among major Korean companies like Samsung, SK, and KT to support Rebellion is drawing international attention, highlighting the competitive dynamics within the semiconductor ecosystem [5].

Group 1 - Cambricon's Q2 revenue increased by 4425% year-on-year to 1.769 billion yuan, with a record high net profit margin of 38.57%, indicating growth potential driven by the large-scale application of the Siyuan 590 chip in model training and other fields [1] - The penetration rate of liquid cooling technology is expected to rise from 5% to 35-50%, with cold plate technology dominating the market, as Chinese manufacturers leverage price advantages to expand secondary pipeline supply, driven by high-performance chip demand [1] - South Asia's CCL series has increased prices by 8%, with AI driving demand for high-speed copper-clad laminates, leading to overseas breakthroughs for companies like Shengyi Technology [1] Group 2 - Huachuang Securities highlights that the surge in AI computing power demand is accelerating the iteration of advanced packaging technology, with TSMC's CoWoS platform achieving ultra-high-density interconnection through 2.5D packaging, becoming a mainstream configuration for AI chips from companies like NVIDIA and AMD [2] - Huajin Securities focuses on the synergy between the storage industry chain and advanced packaging, noting that companies with dual capabilities are strengthening their market competitiveness in embedded storage and enterprise-level storage through main control chip design and wafer-level packaging technologies in the AI era [2] - Related products include the Sci-Tech Chip ETF Index (588920), Semiconductor ETF (159813), Big Data ETF (159739), Intelligent Connected Vehicle ETF (159872), and Robotics ETF (159278) [2]