Investment and Operations - China Shenhua plans to increase capital by 6 billion yuan to the State Energy Group Financial Co., and intends to purchase related assets held by the State Energy Group and its wholly-owned subsidiary, Western Energy, for a transaction price of 133.598 billion yuan [1] - Fudan Microelectronics identifies FPGA as an ideal solution in low-orbit satellite communication and other fields [1] - Qingdao Port plans a total investment of 15.7 billion yuan to construct two terminal projects in Dongjiakou Port Area [1] - Heng Rui Medicine's SHR-2906 injection clinical trial has been approved, with no similar drugs approved for market domestically or internationally [1] - Health元's subsidiary NS-041 tablets have received approval for a new indication to conduct clinical trials, with no new generation targeted KCNQ2/3 drugs available in the market [1] - Jinggong Technology plans to invest 426 million yuan to build an intelligent manufacturing base, aiming to produce 45 sets of aerospace and low-altitude manned equipment and 6,000 sets of humanoid robot carbon fiber components annually [1] Contracts and Collaborations - Zhongyuan Neipei's subsidiary signed a strategic cooperation framework agreement with Ningbo Puzhi Company regarding humanoid robot-related business [2] - Dongfang Cable and its subsidiaries won bids totaling 3.125 billion yuan for deep-sea technology and other projects, accounting for 34.37% of 2024 revenue [2] - Jifeng Co., Ltd. has been designated for a passenger car seat assembly project, with a total lifecycle amount expected to be 9.8 billion yuan [2] Capital Operations - Guankang Technology is planning to acquire no less than 60% of Liao Jing Electronics' shares, with trading suspension starting from December 22 [2] - Shangfeng Cement's invested company, Yuexin Semiconductor, has received acceptance for its IPO on the ChiNext [2] - *ST Dongyi's restructuring plan has been approved by the court [2]

不止是CMP装备业务持续获得突破。在11月发布的调研纪要中，华海清科高层介绍，2025年第三季 度，公司新品类产品多点突破。其中，公司首台12英寸低温离子注入机iPUMA-LT顺利出机；12英寸晶 圆边缘修整装备Versatile-DT300实现批量出货；战略投资苏州博宏源，构建精密平面化装备一站式平 台；广州厂区正式启用，战略布局核心零部件业务领域等。 华海清科认为，当前国内AI技术在算法架构、算力密度等核心维度持续突破，带动先进封装与芯片堆 叠技术迎来深度发展机遇。公司CMP装备可与公司减薄装备、划切装备、边抛装备等产品形成协同效 应，为先进封装与芯片堆叠等领域提供切、磨、抛的成套解决方案，未来产品应用场景将持续拓宽，市 场增长空间进一步打开。同时，随着公司CMP装备保有量的不断攀升，公司"装备+服务"平台化战略协 同效应显著释放，关键耗材与维保服务业务量也将快速提升，为公司贡献持续稳定的利润增长点。 展望未来，华海清科表示，公司将继续坚持核心技术自主创新，持续加大研发投入力度，一方面聚焦先 进制程突破，围绕现有产品体系，针对更先进制程工艺及功能需求推进技术迭代与升级，不断提升产品 核心性能；另一方面结合 ...

一、停牌 1、东方智造：实控人将变更为广西国资委，股票复牌。 2、天创时尚：筹划控制权变更事项，股票停牌。 3、观想科技：筹划发行股份购买锦州辽晶电子科技并配套募集资金事项，股票停牌；后者专业从事半 导体集成电路、分立器件科研。 二、定增、并购 1、中国神华：拟定增收购控股股东国家能源集团旗下12家核心企业股权，业务覆盖煤炭、坑口煤电、 煤化工等多个领域，调整后最终整体交易对价为1335.98亿元。 2、博力威：拟定增募资不超过6.5亿元，用于全极耳大圆柱多场景轻型动力电池智能制造项目、AI驱动 的新能源电池可靠性分析与研发能力提升项目、补充流动资金项目。 三、对外投资、日常经营 4、创耀科技：拟参股旋极星源，后者专注卫星导航等领域。 5、四川九洲：拟设立全资子公司以现金方式购买四川九洲电器集团旗下的射频业务相关的资产、负 债、业务以及人员等，射频业务资产组的评估值为7.57亿元。 6、天齐锂业：泰利森第三期化学级锂精矿扩产项目己经建设完成并正式投料试车。 7、继峰股份：获得乘用车座椅总成项目定点，生命周期总金额预计为98亿元。 8、氯碱化工：拟对全资子公司增资8.93亿元用于"先进材料配套废盐综合利用项目" ...

12月19日，华海清科发布公告称，近日，公司CMP 装备累计出机超800台，涵盖公司Universal-H300、Universal-S300 等 多款主力机型和最新款机型，不仅全面覆盖逻辑、3D NAND存储、DRAM存储等主流产品线，更成功切入大硅片、第三 代半导体、CIS、MEMS、MicroLED 以及先进封装等领域头部客户供应链，已实现国内主流集成电路制造产线的全覆盖 和批量化应用，标志着公司技术先进性、产品成熟度、质量可靠性与市场适配性获得行业高度认可，彰显国产CMP装备 在核心应用领域的替代能力持续增强，公司产品市场认可度与行业影响力稳步提升，进一步夯实了公司在CMP 装备领域 的国产龙头地位。 同时，随着公司CMP装备保有量的不断攀升，公司"装备+服务"平台化战略协同效应显著释放，关键耗材与维保服务业 务量也将快速提升，为公司贡献持续稳定的利润增长点。 未来，华海清科将继续坚持核心技术自主创新，持续加大研发投入力度，一方面聚焦先进制程突破，围绕现有产品体 系，针对更先进制程工艺及功能需求推进技术迭代升级，不断提升产品核心性能；另一方面结合自身业务发展布局，密 切跟踪HBM、CoWos 等先进封 ...

证券日报网讯12月18日，华海清科在互动平台回答投资者提问时表示，公司的CMP装备、减薄装备、 划切装备、边抛装备等产品均作为HBM、CoWos等芯片堆叠与先进封装工艺的关键核心装备，目前已 在多家头部客户获得广泛应用。当前国内AI技术在算法架构、算力密度等核心维度持续突破，带动先 进封装与芯片堆叠技术迎来深层发展机遇，公司CMP装备、减薄装备、划切装备、边抛装备等产品应 用场景将持续拓宽，为公司实现持续高速增长注入强劲动能。未来，公司将结合自身业务发展情况，密 切跟踪半导体行业技术演进趋势，持续推进产品技术迭代与品类拓展，致力于为客户提供更先进、更多 元化的装备解决方案。 ...

核心新品产业化进展顺利。新签CMP装备订单中先进制程的订单已实现较大占比，部分先进制程CMP 装备在国内多家头部客户实现全部工艺验证，全新抛光系统架构CMP机台Universal-H300已经获得批量 重复订单。12英寸超精密晶圆减薄机Versatile–GP300晶圆减薄的极限厚度及TTV均已达到国际先进水 平，累计出机突破20台。华海清科已实现面向芯片制造的大束流离子注入机各型号的全覆盖，12英寸大 束流离子注入机批量交付国内多家集成电路制造头部企业。 盈利预测：公司深度绑定国内头部客户，核心产品产业化进展顺利，同时考虑到部分产品处于市场开拓 阶段且持续加码研发投入与生产能力建设，我们调整此前业绩预测（2025.7.3）。预计公司2025-2027年 营收分别为45.36/60.15/75.02亿元（前值为45.03/58.60/73.60亿元），归母净利润分别为12.01/16.01/20.13 亿元（前值为12.90/16.90/21.21亿元）。维持"强烈推荐"评级。 十五五规划半导体自主可控提速，先进制造全产业链或迎快速发展期，国产半导体设备与存储客户共同 研发，加速国产化率的提升，当前我们看国内 ...

Core Viewpoint - The continuous breakthroughs in AI technology and advancements in semiconductor equipment manufacturing present significant opportunities for domestic companies like Huahai Qingke, Shengmei Shanghai, and Tuojing Technology in the semiconductor industry [1] Company Performance - Huahai Qingke's revenue for the first half of 2025 reached 1.95 billion yuan, a year-on-year increase of 30.28%, while net profit attributable to shareholders grew by 16.82% to 505 million yuan [3][14] - The company's R&D investment totaled 246 million yuan, reflecting a 40.44% increase year-on-year, with R&D expenses accounting for 12.63% of revenue [12][14] Market Position and Strategy - The market share of domestic semiconductor equipment manufacturers has increased from 7% in 2020 to 19% in 2024, indicating a strong demand for self-sufficiency in the semiconductor industry [5] - Huahai Qingke has developed a platform strategy that integrates equipment and services, with key products including CMP, thinning, cutting, and ion implantation equipment [5] Product Development and Demand - The demand for thinning and cutting equipment is rising due to the promising outlook for advanced packaging and compound semiconductors [8] - The company has successfully launched several models of CMP equipment, with significant orders from leading domestic semiconductor firms [5][8] Capacity Expansion - The company is expanding its production capacity with the opening of a new facility in Beijing and a project in Kunshan aimed at increasing wafer regeneration capacity to 400,000 pieces per month [11][14] - The new facility will enhance the company's competitive edge in the domestic wafer regeneration service market [11] Future Plans - Huahai Qingke is planning to issue overseas listed shares (H-shares) to enhance its international strategy, attract global talent, and improve its capital structure [14]

Core Insights - The AI chip industry has seen a continuous increase in prosperity since 2025, with high investment levels in the semiconductor equipment sector [1] - Global semiconductor equipment company revenues are projected to grow by 12% year-on-year in 2025, with a 24% increase in Q2 2025 [1] - The demand for high-performance SoC testing machines and storage testing machines has significantly increased due to the complex requirements of AI chips [1] - The overseas semiconductor equipment market has experienced a 40% year-on-year growth driven by AI-related investments, particularly in testing and packaging equipment [1] - In contrast, the Chinese market saw a slight decline of 1% year-on-year in H1 2025, although the domestic semiconductor equipment localization rate increased by 6 percentage points to 21% [1] Company Performance - In H1 2025, several semiconductor equipment manufacturers showed varied performance, with nine front-end equipment companies achieving revenue growth [2] - Notable companies with the highest net profit growth include Weidou Nano (348.95%), Changchuan Technology (98.73%), Huafeng Measurement Control (74.04%), and Zhongke Fei Measurement (73.01%) [3] - Leading companies like Beifang Huachuang and Zhongwei Company reported net profit growth rates of 14.97% and 36.62%, respectively [3] - Huahai Qingke recorded a revenue of 1.95 billion yuan, a 30.28% increase, but its net profit growth was lower at 16.82%, indicating a decline in profitability [3] Product Development - Huahai Qingke's main product, CMP equipment, has seen continuous upgrades, with the Universal-H300 polishing system receiving bulk orders [4] - The company has achieved a high market share for its 12-inch and 8-inch CMP equipment among leading domestic clients [4] - The 12-inch ultra-precision wafer thinning machine, Versatile-GP300, has gained market recognition, leading to a significant increase in orders [4] - The company is expanding its wafer regeneration capacity with a project in Kunshan, aiming for a total capacity of 400,000 pieces per month [4]

Core Viewpoint - The company reported strong revenue growth in the first half of 2025, driven by advancements in the semiconductor equipment market and competitive advantages in its products [1][2]. Financial Performance - In H1 2025, the company achieved revenue of 1.95 billion yuan, a year-on-year increase of 30.28% - The net profit attributable to shareholders was 505 million yuan, up 16.82% year-on-year - The non-recurring net profit reached 460 million yuan, reflecting a year-on-year growth of 25.02% - In Q2 2025, revenue was 1.037 billion yuan, showing a year-on-year increase of 27.05% and a quarter-on-quarter increase of 13.65% [1][2]. Profitability Analysis - The gross margin for H1 2025 was 46.08%, a decrease of 0.21 percentage points year-on-year - The net profit margin was 25.92%, down 2.99 percentage points year-on-year - The decline in profitability was attributed to higher employee compensation and acquisition-related expenses, which outpaced revenue growth [2]. Product Development and Market Position - The company has seen a significant increase in new CMP orders, particularly in advanced packaging - The Universal-H300 CMP machine has received bulk orders and is being shipped at scale - The company has a strong market share in 12/8-inch CMP equipment among leading domestic clients [3]. - The Versatile-GP300 wafer thinning machine has seen a substantial increase in orders, and the Versatile-GM300 has achieved bulk shipments [3]. Capacity Expansion and Strategic Initiatives - The company has officially launched its Beijing facility, gradually releasing capacity for core equipment - The expansion project in Kunshan aims to increase wafer regeneration capacity to 400,000 pieces per month, with an initial phase of 200,000 pieces per month [4]. - The company is enhancing its product line and expanding its market reach through strategic capacity planning [4]. Future Outlook - The company maintains a "buy" rating, anticipating continued benefits from the expansion of advanced packaging in the semiconductor industry - Projected net profits for 2025, 2026, and 2027 are 1.347 billion yuan, 1.724 billion yuan, and 2.120 billion yuan, respectively, with corresponding EPS of 3.81 yuan, 4.88 yuan, and 6.00 yuan [4].

Core Insights - The strategic value of semiconductor equipment is highlighted, with electronic terminal products accounting for a significant portion of global output, driven by the explosion of industries like big data and AI, which rely on chip manufacturing supported by semiconductor equipment [2] - CMP (Chemical Mechanical Polishing) is identified as one of the five key technologies in integrated circuit manufacturing, essential for flattening wafer surfaces to facilitate subsequent processes like lithography [2] - Current challenges in CMP include achieving nanoscale wafer flattening, cleaning nanoscale contaminants, maintaining precision in rapid polishing, and ensuring efficient operation of the entire system [2] - The global flatness requirement for 12-inch wafers has increased to less than 5nm, with strict limits on the number of fine contaminants above 28nm [2] Opportunities - The demand for CMP in advanced packaging is expected to rise significantly, driven by the rapid development of technologies like TSV and 3D packaging [3] - The transition from multi-wafer polishing to single-wafer polishing in third-generation semiconductors is leading to a sustained increase in demand for CMP equipment [3] - Huahai Qingshi, a leading domestic semiconductor equipment supplier, has evolved from a CMP equipment provider to a platform enterprise covering various equipment and services, including thinning, cutting, wet processing, ion implantation, and edge polishing [3] - The company emphasizes that industry demand and technological iteration will continue to drive progress in the sector, with a commitment to innovation based on years of technical accumulation [3]