Core Points - The company plans to distribute a cash dividend of 0.0651 CNY per share (including tax) to its shareholders [1][2] - The record date for the A-share dividend is set for June 12, 2025, with the ex-dividend date and payment date both on June 13, 2025 [1][2] - The total share capital of the company is 415,332,567 shares, with a total cash dividend payout of 26,969,562.05 CNY (including tax) [1][2] Dividend Distribution Plan - The company will not issue bonus shares or increase capital through reserves this year [2] - The cash dividend distribution will remain unchanged even if the total share capital changes between the announcement date and the record date [2] - The calculation for the ex-dividend reference price is based on the formula provided, with no change in circulating shares, resulting in a circulating share change ratio of 0 [2] Taxation on Dividends - Individual shareholders holding shares for over one year will not be subject to personal income tax on dividend income [4][5] - For shares held for less than one year, the company will not withhold personal income tax at the time of distribution, but will calculate the tax owed when the shares are sold [4][5] - Qualified Foreign Institutional Investors (QFII) will have a 10% withholding tax applied to their dividends, resulting in a net cash dividend of 0.05859 CNY per share [5][6] Contact Information - For inquiries regarding the dividend distribution, shareholders can contact the company's board secretary office at 0510-85618058-8101 [6]

Core Points - The company announced a cash dividend of CNY 0.058 per share, totaling CNY 76,996,705.08, based on a total share capital of 1,327,529,398 shares [1][2] - The dividend distribution plan was approved at the annual shareholders' meeting on May 23, 2025 [1] - The cash dividend will be distributed to shareholders registered with the China Securities Depository and Clearing Corporation Limited, Shanghai Branch, after the market closes on the registration date [1] Dividend Distribution Details - The cash dividend will be distributed as follows: - For individual shareholders holding shares for more than one year, the dividend is exempt from personal income tax, resulting in a net cash dividend of CNY 0.058 per share [3] - For shares held for one year or less, the company will not withhold personal income tax at the time of distribution; tax will be calculated and withheld upon the transfer of shares [3] - For Qualified Foreign Institutional Investors (QFIIs), a 10% corporate income tax will be withheld, resulting in a net cash dividend of CNY 0.0522 per share [4] - For investors holding shares through the Shanghai-Hong Kong Stock Connect, the same 10% tax applies, leading to a net cash dividend of CNY 0.0522 per share [5] - Other corporate shareholders are responsible for their own tax declarations, with a gross cash dividend of CNY 0.058 per share [5] Contact Information - For inquiries regarding the dividend distribution, shareholders can contact the Board Office at 0510-85893998 or via email at crmic_hq_ir_zy@crmicro.com [5]

如果您希望可以时常见面，欢迎标星收藏哦~ 10万亿，投向半导体 芯片巨头，市值大跌 黄仁勋：HBM是个技术奇迹 Jim Keller：RISC-V一定会胜出 全球市值最高的10家芯片公司 推荐阅读 关 注 我 们 设 为 星 标 扫码立即关注 in 公众号ID: MooreNEWS Ø 来源：内容来自SEMI，谢谢 。 据乌鲁木齐晚报消息，6月4日，乌鲁木齐甘泉堡经济技术开发区（工业区）与南京储芯电子科技 有限公司、福建大卓控股有限公司正式签署协议，标志着总投资2.65亿元的第四代金刚石半导体项 目正式落户。 据悉，此次落地的第四代金刚石半导体项目，主要生产金刚石热沉片和培育钻石，前者作为高导热 性能的散热材料，在电子、光电领域尤其是高端GPU散热方面具有广泛应用前景。该项目计划于 2025年9月正式开工建设，并力争在2026年5月实现竣工投产。 相关负责人表示，金刚石作为第四代半导体材料，具有超宽禁带、高热导率等特性，被称为"终极 半导体材料"，此次项目投产后，将填补国内相关领域的部分空白。 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半 ...

意大利官员：拆分意法半导体并非一个可选项。 ...

智通财经6月4日电，在米兰上市的意法半导体股票恢复交易，涨幅为7.58%。 ...

在米兰证券交易所上市的 意法半导体股票在上涨7.67%后触发 停牌。 ...

Group 1 - Changfei Advanced Semiconductor (Wuhan) Co., Ltd. has officially launched the first batch of silicon carbide wafers at its Wuhan base, which is the largest silicon carbide semiconductor base in China, contributing 30% of the domestic silicon carbide wafer production capacity [1] - Silicon carbide is a semiconductor material that can operate stably under high voltage and high temperature, making it increasingly popular in the electric vehicle industry as charging voltages and vehicle range continue to increase [1] - The Wuhan base is expected to produce 360,000 six-inch silicon carbide wafers annually, supplying the "heart" for 1.44 million electric vehicles each year, potentially breaking international monopolies and filling the gap in high-end silicon carbide device manufacturing in Hubei Province [1] Group 2 - The base has already established extensive collaborations with leading global automotive companies, with a silicon carbide chip set to undergo vehicle testing next month, and nearly 10 models currently in validation, with mass production and delivery expected in the coming months [2] - As the first hundred-billion-level semiconductor project in Hubei Donghu Science City, the Changfei Advanced Wuhan base began construction in September 2023 and achieved production readiness in just 18 months, attracting over 20 supporting enterprises across the entire third-generation semiconductor supply chain [2] - Wuhan has identified compound semiconductors as one of its six major future industry directions, planning to introduce and cultivate 100 upstream and downstream enterprises within three years, aiming to transform Wuhan Optics Valley into a "world lighthouse" in the field of compound semiconductors [2]

Core Viewpoint - Co-packaged optics (CPO) technology is emerging as a promising solution to enhance bandwidth and energy efficiency in data centers, particularly for applications involving generative AI and large language models. However, manufacturing challenges remain, particularly in fiber-to-photonics integrated circuit (PIC) alignment, thermal management, and optical testing strategies [1][20]. Group 1: CPO Technology and Benefits - CPO enables network switches to route signals at speeds of terabits per second while significantly improving bandwidth and reducing power consumption required for AI model training [1][20]. - The technology achieves a bandwidth density of 1 Tbps/mm, optimizing rack space in increasingly crowded data centers [1][6]. - CPO can reduce power consumption associated with high-speed data transmission from approximately 15 pJ/bit to around 5 pJ/bit, with expectations to drop below 1 pJ/bit [6][7]. Group 2: Manufacturing Challenges - Key challenges in CPO manufacturing include achieving precise alignment between fiber and PIC, which is critical for effective optical signal coupling [8]. - The most common passive alignment method is the V-groove technique, which connects the fiber directly to the PIC to minimize loss [8][9]. - Efficient coupling between standard single-mode fibers and silicon waveguides is complicated due to significant differences in size and refractive index, leading to potential light loss [8][9]. Group 3: Thermal Management - CPO systems are sensitive to temperature fluctuations caused by high-power devices like GPUs and ASICs, which can affect the performance of photonic devices [11][12]. - A temperature change of just 1°C can lead to approximately 0.1nm wavelength shift in most photonic systems, necessitating careful thermal management strategies [11][12]. - Advanced thermal interface materials and monitoring circuits are deployed to maintain PIC temperature within predefined ranges [11][13]. Group 4: Reliability Design - Ensuring reliability in CPO systems is crucial, especially with multi-chip integration, requiring known good die (KGD) testing and optical testing solutions [14][16]. - High reliability designs incorporate redundancy, such as backup lasers, to maintain operation in case of component failure [15][16]. - Integrated monitoring and self-correcting features are being developed to detect performance degradation and facilitate quick recovery [15][16]. Group 5: Integration Techniques - Both 2.5D and 3D packaging methods are utilized in CPO, with 2.5D placing electronic ICs and PICs side by side on a silicon interposer [17][18]. - 3D integration allows for optimal manufacturing processes for each chip type, enhancing performance while increasing complexity and cost [18][19]. - The integration of optical features with traditional CMOS processes is becoming more compatible, facilitating advancements in CPO technology [17][18].

台积电(TSM.N)CEO：我们从一开始就与美国商务部就关税问题保持沟通，我们对高关税会增加台积电 在美国的生产成本表示担忧。 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 eenewseurope 。 四十年前，一种可以在工程师的办公桌上进行逻辑编程的革命性设备问世了。 Xilinx 开发的现场可编程门阵列 (FPGA) 使工程师能够将包含自定义逻辑的比特流下载到桌面编 程器中立即运行，而无需等待数周才能从晶圆厂返回芯片。而且，如果出现错误或问题，也可以立 即对设备进行重新编程。 AMD（该公司于2022年收购了赛灵思）产品、软件和解决方案副总裁柯克·萨班（Kirk Saban）告 诉eeNews Europe："我从1999年开始从事FPGA编程，至今已涉足FPGA领域27年。它可能是鲜 为 人 知 的 半 导 体 类 型 之 一 。 人 们 知 道 什 么 是 CPU ， 随 着 人 工 智 能 的 发 展 ， 人 们 也 知 道 什 么 是 GPU，但对FPGA的了解却较少。" 第一颗芯片 XC2064 于 1985 年 6 月问世，但这当然是经过了多年的研发，以及当年早些时候的 设计和流片。它拥有 600 个门电路和 64 个可配置逻辑块，运行频率为 70MHz。但这是一个巨大 的进步，让这款芯片载入了半导体 ...