沪硅产业12月12日大宗交易平台出现一笔成交，成交量420.00万股，成交金额8719.20万元，大宗交易成 交价为20.76元，相对今日收盘价折价1.52%。该笔交易的买方营业部为机构专用，卖方营业部为万和证 券股份有限公司上海分公司。 进一步统计，近3个月内该股累计发生13笔大宗交易，合计成交金额为6.32亿元。 | 成交量（万 | 成交金额（万 | 成交价格 | 相对当日收盘折溢价 | 买方营 | 卖方营业部 | | --- | --- | --- | --- | --- | --- | | 股） | 元） | （元） | （%） | 业部 | | | 420.00 | 8719.20 | 20.76 | -1.52 | 机构专 | 万和证券股份有限公司上 | | | | | | 用 | 海分公司 | （文章来源：证券时报网） 证券时报·数据宝统计显示，沪硅产业今日收盘价为21.08元，下跌1.22%，日换手率为2.31%，成交额为 13.32亿元，全天主力资金净流出3.00亿元，近5日该股累计下跌2.77%，近5日资金合计净流出4.36亿 元。 两融数据显示，该股最新融资余额为14.63亿元，近5日增 ...

Company Overview - Hubei Dinglong Holdings Co., Ltd. is a leading platform company in the field of core innovative materials, focusing on two main business segments: semiconductor materials and general printing consumables [2][3]. - The company emphasizes semiconductor innovation materials, covering CMP process materials, photoresists, and advanced packaging materials, establishing itself as a domestic leader in these areas [2][3]. Polishing Liquid Business - The company has achieved significant breakthroughs in polishing liquid technology, including a comprehensive product layout covering dielectric, metal, and polysilicon layers, with several high-barrier products already developed [3][4]. - R&D investment for the first three quarters of 2025 reached CNY 389 million, primarily directed towards semiconductor segments, ensuring robust funding for technological innovation [4][10]. - The polishing liquid products have gained recognition from major domestic wafer manufacturers, with successful orders for combined polishing and cleaning liquid solutions [4][5]. Advanced Photoresist Technology - The company has over 20 years of experience in the import substitution of key materials, establishing a strong technical barrier in high-end photoresist production [5][6]. - It has developed nearly 30 types of high-end photoresists, achieving industry-leading technical specifications and ensuring a stable supply of core raw materials through independent development [6][7]. OLED Display Materials - The core products for OLED display materials, such as yellow polyimide slurry (YPI) and photosensitive polyimide slurry (PSPI), have achieved stable supply and established a leading position in the domestic market [8][9]. - The PSPI product line has a production capacity of 1,000 tons per year, with ongoing development of new high-end display materials [8][9]. Future Product Expansion - The company plans to leverage its seven core technology platforms and four synchronization mechanisms to ensure smooth transitions from R&D to mass production in new product areas [9][10]. - Cumulative R&D investment over the past three years exceeds CNY 1.1 billion, maintaining a ratio of approximately 14% of revenue, which supports new technology development [10].

（文章来源：每日经济新闻） 每经AI快讯，南大光电（300346.SZ）12月12日在投资者互动平台表示，公司是全球主要的MO源制造 商之一，在MO源的合成制备、纯化技术、分析检测、封装容器等方面已全面达到国际先进水平，产品 纯度大于等于6N，可以实现MO源全系列配套供应及定制化产品服务。 ...

方邦股份在互动平台表示，公司可剥铜已陆续通过部分代表性载板厂商和相关头部终端客户的批量验 证，持续获得小批量量产订单。订单起量取决于相关客户内部项目排产节奏，可剥铜技术壁垒高，且直 接承载芯片，客户对国产可剥铜的导入稳字当头、非常谨慎。 ...

先进封装设备板块：AI芯片技术迭代推动先进封装需求，进而拉动相关设备增长。中信建投指出， 2025年下半年2.5D/3D先进封装技术有望取得突破，带动封装设备需求放量。中微公司已在先进封装领 域全面布局，发布CCP刻蚀及TSV深硅通孔设备，将进一步放大先进封装设备的采购需求。 风险提示：本文提及的行业信息与企业动态仅作梳理，不构成任何投资建议；企业经营及市场波动存在 不确定性，请注意相关风险。 存储芯片供需缺口扩大，设备需求同步激增：瑞银预计，DRAM供应短缺将持续至2027年第一季度， DDR内存需求增长20.7%远超供应增速；NAND闪存短缺态势将延续至2026年第三季度。存储技术向3D 化演进推动设备需求升级，3D NAND堆叠层数向千层迈进使刻蚀设备用量显著上升，ALD与CVD协同 工艺成为主流，直接利好中微公司、拓荆科技等设备企业。 受积极影响的板块： 半导体材料板块：设备与材料存在强协同关系，设备产能扩张直接带动上游材料需求。中信建投2025年 12月9日研报指出，设备国产化率提升将同步加速靶材、高纯工艺系统等"卡脖子"材料的替代进程。 半导体零部件板块：设备核心零部件国产化是政策重点扶持方向，具 ...

Group 1 - Tianyue Advanced (02631) has seen a stock price increase of over 7%, currently trading at 59.55 HKD with a transaction volume of 1.88 billion HKD [1] - The company is a leader in the silicon carbide (SiC) semiconductor materials industry and has achieved technological breakthroughs in the full series of 12-inch SiC substrates, marking the entry of the SiC substrate industry into the 12-inch era [1] - According to Wenkang Securities, SiC, as a third-generation wide bandgap semiconductor, is penetrating four major industries: renewable energy, AI, communication, and AR, becoming a key support for technological upgrades and efficiency revolutions [1] Group 2 - The demand explosion is driving rapid industry expansion, with expectations of a balanced supply-demand situation for SiC substrates by 2027, and potential supply tightness [1] - By 2030, the global demand for substrates is projected to reach 16.76 million pieces, with an estimated production capacity shortfall of about 12 million pieces compared to the supply in 2025 [1] - The three core growth points identified are AI intermediary layers, electric vehicles, and AR glasses, with projected demand shares by 2030 of 37%, 26%, and 23% respectively [1] - If SiC can be industrialized in the "substrate layer," "intermediate layer," and "heat sink" for advanced packaging thermal materials in AI chips, the global demand for SiC substrates could reach approximately 30 million pieces by 2030 [1]

Core Viewpoint - Jiangsu Zhongke Kehua New Materials Co., Ltd. has recently received acceptance for its IPO on the Sci-Tech Innovation Board, aiming to raise 598 million yuan for the development of semiconductor packaging materials [1][2]. Fundraising and Project Allocation - The company plans to raise 598 million yuan, with 420 million yuan allocated for the industrialization project of mid-to-high-end epoxy encapsulation materials and 98 million yuan for the construction of a research center for these materials, which will add a design capacity of 22,500 tons [2][3]. Company Background - Established in October 2011, Zhongke Kehua has a registered capital of 66 million yuan and is recognized as a national-level specialized and innovative "little giant" enterprise [3][4]. - The controlling shareholder is Beijing Kehua, founded in 1984, which holds 64.57% of Zhongke Kehua's shares, with significant backing from the Chinese Academy of Sciences [4]. Market Position and Competition - Epoxy encapsulation materials are critical for over 90% of chip packaging, with the domestic semiconductor packaging materials market being predominantly controlled by foreign companies, with a domestic market penetration rate of about 30% [6][7]. - Zhongke Kehua ranks second in the domestic market, competing with companies like Hengsu Huawai and Huahai Chengke [10]. Product Development and Innovation - The company has developed a range of epoxy encapsulation materials, with high-end products already passing assessments from downstream packaging manufacturers and entering mass production [9]. - The KHG900G-A product, developed for fan-out wafer-level packaging, has been recognized for its advanced performance, filling a domestic gap [13]. Financial Performance - From 2022 to mid-2025, Zhongke Kehua's revenue has shown a steady increase, with figures of 200 million yuan, 250 million yuan, 331 million yuan, and 159 million yuan respectively, alongside a rising gross profit margin [14]. - The company has built a 70,000 square meter facility with eight production lines for epoxy encapsulation materials, achieving a production capacity of 12,000 tons [14][15].

（来源：SMM小金属） （来源：SMM小金属） | | 无水5N氯化鎵 | 3250 | 3450 | 3350 | 0.0 | 元/千克 | | --- | --- | --- | --- | --- | --- | --- | | | 无水5N氯化锅 | 3150 | 3320 | 3250 | 0.0 | 元/千克 | | | 4N氯化钠 | 2000 | 2300 | 2150 | 0.0 | 元/千克 | | | 5N氯化钠 | 44000 | 46000 | 45000 | 0.0 | 元/千克 | | | 4N氯化钾 | 2000 | 2500 | 2250 | 0.0 | 元/千克 | | | 5N氢化钾 | 40000 | 45000 | 42500 | 0.0 | 元/千克 | | | 5N氧化玩 | 5100 | 5200 | 5150 | 0.0 | 元/千克 | | | 6N氧化抗 | 5300 | 5400 | 5350 | 0.0 | 元/千克 | | | 铁绪啼粉末Fe3GeTe2 | 220 | ୧୧୦ | 600 | 0.0 | 元/克 | | | 5N高纯铜 | 120 ...

南财智讯12月11日电，立昂微公告，公司股票于2025年12月9日、12月10日、12月11日连续3个交易日内 收盘价格涨幅偏离值累计超过20%，属于股票交易异常波动情形。经公司自查，目前生产经营正常，近 期经营情况及内外部环境未发生重大变化，主营业务未发生变化。公司未发现可能对公司股价产生重大 影响的媒体报道或市场传闻，除已披露信息外，不存在其他应披露而未披露的重大信息。公司董事、监 事、高级管理人员、控股股东及其一致行动人在本次股票交易异常波动期间不存在买卖公司股票的情 况。董事会确认，不存在应披露而未披露的事项，前期披露的信息无需要更正或补充之处。2025年前三 季度归属于上市公司股东的净利润为-10,796.05万元，扣除非经常性损益后的净利润为-14,105.80万元， 存在业绩亏损风险。2025年12月11日公司股票以涨停价收盘，当日换手率为11.72%，换手率较高，提 醒投资者注意交易风险。 ...

立昂微公告称，公司股票于2025年12月9 - 11日连续3个交易日内收盘价格涨幅偏离值累计超20%，属异 常波动。经自查，公司生产经营、内外部环境、主营业务均未变化，无重大未披露信息，董监高及控股 股东在此期间无买卖公司股票情况。2025年前三季度归母净利润为 - 10796.05万元，扣非净利润 - 14105.80万元，12月11日股票以涨停价收盘，换手率11.72%，公司提示业绩亏损与交易风险。 ...