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Summary of the Conference Call for Pengding Holdings Company Overview - **Company**: Pengding Holdings - **Industry**: PCB (Printed Circuit Board) manufacturing Key Financial Metrics - **Revenue**: 16.375 billion RMB in H1 2025, a year-on-year increase of 24.7% [2] - **Net Profit**: 1.233 billion RMB, a year-on-year increase of 57.22% [4] - **Gross Margin**: 19.07% [4] - **Net Margin**: 7.49% [4] - **Return on Equity**: 3.76% [2] - **Earnings per Share**: 0.53 RMB [2] - **Quarterly Revenue**: Q1 2025 revenue was 8.087 billion RMB (20.94% YoY), Q2 2025 revenue was 8.288 billion RMB (28.71% YoY) [4] Business Segment Performance - **Communication Boards**: Revenue of 10.268 billion RMB, 62.7% of total revenue, up 17.62% YoY [2][5] - **Consumer Electronics and Computer Boards**: Revenue of 5.174 billion RMB, 31% of total revenue, up 31% YoY [2][5] - **Automotive and Server Boards**: Revenue of 800 million RMB, 4% of total revenue, up 87% YoY [2][5] Operational Efficiency - **Accounts Receivable Turnover Days**: 53 days, down 18 days YoY [6] - **Inventory Turnover Days**: 47 days, down 9 days YoY [6] - **Accounts Payable Turnover Days**: 68 days, down 8 days YoY [6] Financial Health - **Cash Reserves**: 13 billion RMB [7] - **Bank Loans**: 4.2 billion RMB [7] - **Net Cash**: 8.7 billion RMB [7] - **Debt-to-Asset Ratio**: 29% [7] Strategic Initiatives and Future Outlook - **AI Server Development**: Collaborating with international firms to develop advanced products [8] - **Optical Module Development**: Targeting the 800G to 1T optical communication upgrade window and developing next-gen 3T solutions [8][3] - **Expansion Plans**: Investing 8 billion RMB in Huai'an Park to expand SLP high-end HDI and HLC production capacity [9] - **International Expansion**: Initiating production in Thailand with plans for a one-stop PCB service platform [9] Additional Insights - **Technological Focus**: Emphasizing AI technology applications in mobile phones, AR/VR devices, and satellite communications [8] - **Market Positioning**: Established as a core supplier for AI mobile phones and folding devices, with a focus on future technology research [4][8]

Core Viewpoint - Dahua Jixiang has raised the target price for Kingboard Laminates (01888) from HKD 9.58 to HKD 12.43, reflecting a positive outlook on its business and new material development, but has downgraded the rating to "Hold" as the current stock price already reflects short-term growth potential [1] Group 1: Financial Performance - Kingboard Laminates reported a net profit of CNY 933 million for the first half of the year, representing a year-on-year increase of 28%, which meets 33% of the company's full-year forecast [1] - The gross margin decreased by 1.3 percentage points due to the average selling price of laminates not fully covering the rising copper costs [1] Group 2: Revenue and Earnings Forecast - The revenue forecasts for 2025 to 2027 remain largely unchanged, but earnings estimates have been reduced by 16%, 14%, and 9% respectively, indicating weak growth in average selling prices for laminates [1] Group 3: Industry Trends and Developments - The management is optimistic about the development prospects of low-Dk fiberglass yarn and is accelerating capacity expansion in the second half of the year [1] - The company maintains a positive attitude towards the trends in the printed circuit board (PCB) industry and has incorporated product price increase factors into its forecasts [1]

Core Viewpoint - Daxin Jicheng (01888) target price raised from HKD 9.58 to HKD 12.43, reflecting positive business outlook and new material development, but rating downgraded to "Hold" as current stock price reflects short-term growth potential [1] Company Summary - Daxin Jicheng's net profit for the first half increased by 28% year-on-year to CNY 933 million, achieving 33% of the annual forecast [1] - Gross margin decreased by 1.3 percentage points due to the average selling price of laminates not fully covering the rise in copper costs [1] - Management is optimistic about the development prospects of low-Dk fiberglass yarn and is accelerating capacity expansion in the second half of the year [1] Industry Summary - The firm maintains a positive outlook on the printed circuit board (PCB) industry trends and has incorporated product price increase factors into its forecasts [1] - Revenue forecasts for 2025 to 2027 remain largely unchanged, but earnings estimates are reduced by 16%, 14%, and 9% respectively, indicating weaker average selling price growth for laminates [1]

Expansion Investment Overview - The company plans to invest a total of 5 billion RMB in the expansion of its Zhuhai Jinwan base, with an estimated payback period of approximately 7.5 years, including the construction period [1][2] - The investment will be implemented in phases, including the renovation of existing facilities and the construction of a new high-end HDI factory, expected to produce 800,000 square meters of high-end HDI by mid-2026 [1][2] Market Demand and Feasibility - The expansion is driven by the high demand for high-end PCBs, particularly in AI servers and high-speed network infrastructure, with a projected compound annual growth rate of 15.7% for multilayer boards with 18 layers or more from 2024 to 2029 [1][3] - The company has over 30 years of experience in PCB manufacturing and has established a solid technical foundation and customer base at the Zhuhai Jinwan base, ensuring the feasibility of the expansion project [2][3] Strategic Alignment - The investment aligns with national industrial policies and meets the long-term, high-standard demand for high-end PCBs in emerging fields, enhancing the company's competitive advantage in high-end products [3][4] - The project supports the company's strategy to focus on AI and expand its second growth curve, aiming to increase the proportion of high-end products in its portfolio [3][4] Financial Position - As of March 31, 2025, the company reported a revenue of 3.343 billion RMB, with a net cash flow compound growth rate of 21.34%, indicating a strong financial position to support the investment [5] - The funding will come from self-owned or self-raised funds, and the company plans to optimize its capital structure and financing costs to ensure sufficient funds for the project [5]

Core Viewpoint - Company plans to invest 5 billion yuan in the expansion project at Zhuhai Jinwan base, focusing on high-growth areas such as AI computing power, high-speed network communication, and automotive intelligence [1][3] Group 1: Investment and Project Details - The total investment for the expansion project is estimated at 5 billion yuan, with a post-tax investment payback period of approximately 7.5 years, including the construction period from 2025 to 2027 [1] - The expansion will be implemented in phases based on market demand and business progress [1] - The project aims to enhance production capacity for high-end PCBs, particularly in AI computing, high-speed networking, and automotive intelligence [1][3] Group 2: Market Trends and Demand - Recent technological breakthroughs in large models and generative AI have driven significant innovation in technology hardware, leading to a high demand for high-end PCBs [1] - Prismark forecasts a compound annual growth rate of 15.7% for multilayer boards with 18 layers or more and 6.4% for HDI from 2024 to 2029, driven by AI server and high-speed network infrastructure [1] - The high-end PCB market is expected to grow due to increasing requirements for advanced technology and higher product value, while competition in ordinary products is intensifying [1] Group 3: Strategic Alignment and Future Outlook - The expansion project aligns with national industrial policies and industry development trends, addressing the long-term and high-standard demand for high-end PCBs in emerging fields [3] - The company aims to enhance its technological innovation capabilities and increase the proportion of high-end products, focusing on AI to create a second growth curve [3] - The expansion is expected to improve the company's economic efficiency, expand operational scale, and strengthen its competitive advantage in high-end products [3]

Core Viewpoint - The company announced a 5 billion yuan expansion investment plan for the Zhuhai Jinwan base, focusing on enhancing production capacity for high-end HDI, HLC, and SLP products in AI computing, high-speed network communication, automotive intelligence, and AI edge applications [1] Group 1: Investment and Expansion - The investment plan includes technical upgrades to existing facilities, new AI server HDI production lines, and the construction of a new high-end HDI factory [1] - The expansion aims to integrate resources at the Zhuhai Jinwan base and strengthen the company's manufacturing capabilities for high-end products [1] - The construction period for the expansion is set from 2025 to 2027 [1] Group 2: Market Demand and Capacity - There is a projected rapid growth in demand for high-layer boards and high-end HDI thick boards in the AI server market, with current high-end capacity being relatively tight [1] - The company is expected to make significant progress in high-end product technology for core computing clients both domestically and internationally [1] - The existing production capacity at the Zhuhai Jinwan factory includes 1.2 million square meters of high-layer boards and 300,000 square meters of HDI/SLP boards [1] Group 3: Financial Outlook - The company maintains previous revenue forecasts for 2025-2027, with expectations of increased orders from North American clients due to the accelerated investment in AI PCB capacity [2] - The company is well-positioned in various downstream application fields, with ongoing product introductions in data communication and automotive sectors [2] - The upgrade of high-end computing capacity is anticipated to open up long-term performance and valuation growth opportunities for the company [2]

（编辑 袁冠琳） 证券日报网讯 沪电股份8月22日在互动平台回答投资者提问时表示，通信通讯设备、高速运算服务器、 人工智能、数据中心基础设施、汽车电子等是公司产品的核心应用领域，公司与国内外众多终端客户展 开多领域深度合作，公司经营团队会坚持做好自己的事情，把握行业发展趋势，保持战略定力，积极应 对外部环境带来的挑战，坚持以技术创新和产品升级为内核，加快推进新项目的建设，甄别并抓牢目标 产品市场涌现的新业务机会，紧抓人工智能、高速网络等对高端PCB的结构性需求，大力开展相关业 务，以实现更长远的发展目标，为投资者创造更多价值。 ...

证券日报网讯沪电股份（002463）8月22日在互动平台回答投资者提问时表示，公司PCB产品以通信通 讯设备、高速运算服务器、人工智能、数据中心基础设施、汽车电子为核心应用领域。公司紧抓其对高 端PCB的结构性需求，大力开展相关业务，以实现更长远的发展目标，为投资者创造更多价值。 ...

Investment Rating - The report maintains a "Recommended" rating for leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd. [4][5] Core Viewpoints - The PCB industry is experiencing rapid advancements in packaging and high-density interconnect technologies, with traditional HDI and substrate technologies evolving into mSAP processes to meet the demands of high-speed signal transmission and large-scale integration [1][2] - The demand for PCB is driven by AI applications, leading to significant expansions in production capacity among leading companies, with total investments exceeding 30 billion RMB [2][20] - The core materials for PCB, including copper foil, electronic cloth, and resin, are undergoing upgrades to meet the high-frequency and high-speed requirements of AI applications [2][20][26] Summary by Sections 1. CoWoP and mSAP as Core Technologies - CoWoP (Chip-on-Wafer-on-PCB) is emerging as a future packaging route, enhancing interconnect density and reducing costs by directly using large-size PCBs [1][11] - mSAP (Modified Semi-Additive Process) is becoming the core process for achieving sub-10 µm line capabilities, essential for high-performance applications [1][14] 2. PCB Capacity Expansion and Material Upgrades - Leading PCB manufacturers are actively expanding production capacity, with significant investments announced by companies like Huadian Co., Ltd. and Shenghong Technology [2][20] - The upgrade of core materials includes the transition of copper foil from HVLP1 to HVLP5, electronic cloth to third-generation low-dielectric cloth, and resin to hydrocarbon and PTFE types [2][20][28] 3. Tight Supply of Core Equipment and Acceleration of Domestic Substitution - The supply of core PCB equipment, including drilling, plating, and etching imaging, is tight, with domestic manufacturers accelerating their layouts in advanced process equipment [2][49] - Companies like Dazhu CNC and Ding Tai High-Tech are focusing on high-layer boards and HDI equipment to meet the increasing demands of the industry [2][49] 4. Investment Recommendations - The report suggests focusing on leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd., as well as material companies with core technologies like Honghe Technology and Zhongcai Technology [3][4] - Equipment manufacturers involved in domestic substitution, such as Dazhu CNC and Xinqi Microelectronics, are also highlighted as potential investment opportunities [3][4]