Core Viewpoint - The company Shenkangjia A has decided to terminate its acquisition of 78% of Hongjing Microelectronics, which reflects ongoing challenges in its semiconductor business expansion efforts [1][2][3] Group 1: Acquisition and Restructuring - Shenkangjia A announced the termination of its plan to acquire Hongjing Microelectronics after nearly six months of restructuring efforts [2] - The acquisition was intended to enhance Shenkangjia A's semiconductor business and create synergies with its packaging and testing (封测) and PCB businesses [2][3] - The failure of this acquisition also signifies a setback for Hongjing Microelectronics in its attempt to go public through a backdoor listing [3] Group 2: Financial Performance - In 2024, Shenkangjia A's semiconductor and storage chip business generated revenue of 170 million yuan, a significant decline of 94.99% year-on-year, accounting for only 1.53% of total revenue [1][7] - The company has reported continuous net losses for 14 consecutive years, with a net loss of 3.296 billion yuan in 2024 [4][6] - In the first quarter of 2025, Shenkangjia A achieved revenue of 2.544 billion yuan, a year-on-year increase of 3.32%, but still reported a net loss of 94.81 million yuan [4] Group 3: Semiconductor Business Development - Shenkangjia A has been developing its semiconductor business since 2018, but it has not yet achieved the expected results after nearly eight years [1][6] - The company has made investments in Micro LED technology and has seen some progress in Mini LED product sales, but the semiconductor business remains in the early stages of industrialization [7][8] - The semiconductor business's revenue has fluctuated significantly, with 2023 revenue dropping to 3.397 billion yuan, a decrease of 67.37% year-on-year [7]

Group 1 - The core point of the article is that Xingsen Technology plans to acquire a 24% stake in Guangzhou Xinke Semiconductor for 320 million yuan, which will enhance its control over the subsidiary [1] - Guangzhou Xinke, originally a subsidiary of Xingsen Technology, focuses on CSP packaging and was established in January 2020 with a registered capital of 1 billion yuan, where Xingsen contributed 410 million yuan, holding a 41% stake [1][2] - The exit of the major fund from Guangzhou Xinke is seen as the final exercise of its exit rights, following a previous announcement regarding the cash buyback of shares [1][2] Group 2 - The establishment of Guangzhou Xinke was driven by Xingsen Technology's need to increase production capacity and enhance advanced process capabilities to meet the growing demands of international clients [2] - Despite the ambitious profit targets set for 2021, 2022, and 2023, Guangzhou Xinke reported a revenue of 319 million yuan and a net loss of 70.7 million yuan for 2024, indicating ongoing challenges in achieving profitability [2] - Xingsen Technology aims to enhance its management efficiency and decision-making by increasing its stake in Guangzhou Xinke to 90% directly and 9.92% indirectly, aligning with its overall strategic development plan [3]

Core Viewpoint - The leading company in display panel testing equipment, Jingce Electronics, is actively expanding its semiconductor business, evidenced by its recent acquisition of a 4.825% stake in Shanghai Jingce Semiconductor Technology Co., Ltd. from the National Integrated Circuit Industry Investment Fund [1][3] Group 1: Company Strategy and Developments - Jingce Electronics plans to enhance its semiconductor measurement business by acquiring additional shares in Shanghai Jingce, which focuses on semiconductor front-end measurement equipment [1][3] - The company has strategically shifted towards the semiconductor and new energy sectors, establishing a comprehensive layout in semiconductor testing [1][4] - As of April 2024, Jingce Electronics has secured semiconductor orders totaling approximately 16.68 billion yuan, indicating the significance of this sector to the company's overall performance [1][5] Group 2: Financial Performance - In 2024, Jingce Electronics reported a revenue of 25.65 billion yuan, a year-on-year increase of 5.59%, but faced a significant net profit decline of 165.02%, resulting in a loss of 97.6 million yuan [4] - The semiconductor sector showed remarkable growth, with revenues reaching 7.68 billion yuan in 2024, marking a 94.65% increase year-on-year [4][5] - The company’s R&D investment in the semiconductor field reached 3.58 billion yuan in 2024, reflecting a 32.76% increase, as it continues to focus on high-tech product development [4][5] Group 3: Market Position and Future Outlook - Jingce Electronics has successfully delivered and accepted products for advanced 7nm processes, with ongoing validation for even more advanced products [5] - The company is optimistic about the semiconductor industry's growth and its own position within it, planning to further optimize its business structure to focus on semiconductor advantages [5] - As of the first quarter of 2025, Jingce Electronics achieved a revenue of 6.89 billion yuan, a 64.92% increase year-on-year, and turned a profit with a net income of 37.6 million yuan [5]

Summary of Key Points from the Conference Call Company and Industry Overview - The conference call discusses **Maiwei Co., Ltd.** and its comprehensive layout in the **semiconductor industry**, focusing on both front-end and back-end equipment. Core Insights and Arguments - **Front-End Equipment**: - The company is primarily focused on advanced processes such as **etching** and **thin film deposition** [1] - In **2024**, the company plans to launch etching machines and thin film deposition equipment, with new orders exceeding **200 million** [1] - By **2025**, the company expects to transition from demo to mass production orders, with total new orders potentially reaching **800 million** [1] - Over the next three years, new orders for front-end equipment are projected to reach **7-8 billion** [1] - **Back-End Packaging Equipment**: - The focus includes **dicing, grinding, polishing, and bonding equipment** (temporary bonding, debonding, hybrid bonding, and thermal compression bonding) [2] - In **2024**, new orders for back-end packaging and display equipment are expected to exceed **800 million**, with **1.5 billion** anticipated in **2025** [2] - Approximately **50%** of these orders are related to traditional packaging products from **DISCO**, such as dicing and grinding equipment [2] - **25%** of the orders are associated with **CoWos** advanced packaging products, competing with companies like **BESI**, **EVG**, and **Shibaura** [2] - The remaining **25%** pertains to **miniled** and **microled** display-related products [2] - The target order scale for the back-end packaging sector is also projected to be **7-8 billion** [2] Market Valuation Estimates - The estimated market value based on projected orders is as follows: - For front-end semiconductor equipment: **7 billion** orders * **20%** net profit margin * **20x** valuation = **28 billion** market value [3] - For back-end packaging and display: **7 billion** orders * **15%** net profit margin * **15x** valuation = **16 billion** market value [3] - For the photovoltaic sector: **10 GW** overseas * **500 million/GW** * **10%** net profit margin * **10x** valuation = **5 billion** market value [3] - The total estimated market value is approximately **50 billion**, indicating potential for more than **double** the current valuation [3] Additional Important Insights - The company is strategically positioned to capture significant market share in both front-end and back-end semiconductor equipment, with a clear growth trajectory and substantial order backlog anticipated over the next few years [1][2][3]