Core Viewpoint - Samsung has officially confirmed the development of a tri-fold smartphone, aiming for a launch by the end of this year, with a strong emphasis on the integration of AI in its strategy [2][4]. Group 1: Product Development - Samsung plans to release a tri-fold smartphone, with the name yet to be finalized, focusing on product usability [4]. - The recently announced Galaxy Z Fold 7 and Z Flip 7 feature a thinner design, with the Fold 7 measuring 8.9mm when folded and 4.2mm when unfolded [5]. - The Fold 7 uses a custom Snapdragon 8 Elite chip, while the Flip 7 is powered by Samsung's Exynos 2500 chip, raising concerns about the latter's performance [8]. Group 2: AI Integration - Samsung aims to embed AI functionalities into its existing 400 million Galaxy devices by the end of the year, enhancing the smartphone's role as an AI partner [8][9]. - The company intends to expand Galaxy AI features across its product range, contingent on hardware capabilities [9]. Group 3: Future Projects - Samsung is collaborating with Google on a new XR headset project named Moohan, set to launch within the year [9]. - The development of Samsung's smart glasses is still in the early stages, with considerations for user experience and partnerships [11].

Group 1 - Xiaomi's public relations manager Wang Hua denied rumors about the termination of the partnership with Leica, stating that previous claims about the Xiaomi 14 being the last collaboration were also false [1][6] - In May, there were reports of issues in the collaboration, particularly regarding the absence of the "LEICA" watermark in the camera after system upgrades, which Xiaomi explained was due to compliance with Leica's updated visual standards [4][6] - The strategic partnership between Xiaomi and Leica was announced on May 23, 2022, with the first jointly developed series, the Xiaomi 12S, launched on July 4, 2022 [6][8] Group 2 - Insider information suggested that each phone's licensing fee with Leica could reach $3-5, indicating that reducing these fees could lower production costs and enhance pricing advantages, particularly affecting Xiaomi's Redmi and POCO series [6] - The upcoming Snapdragon 8 Elite 2 chip, expected to be released in September, is based on TSMC's third-generation 3nm N3P process and features a second-generation self-developed Oryon CPU architecture [7]

GenieBlue团队 投稿 量子位 | 公众号 QbitAI 在AI迈入多模态时代的当下， "让大模型上手机" 成为产业落地的焦点。 现有MLLM在手机端部署时常面临两大难题： vivo AI研究院联合港中文以及上交团队 为了攻克这些难题， 从训练数据和模型结构两方面，系统性地分析了如何在MLLM训练中维持纯语言 能力，并基于此提出了GenieBlue——专为移动端手机NPU设计的高效MLLM结构方案。目前已被ICCV 2025接收。 主要贡献和技术亮点 1、现有端侧LLM在支持多模态功能后，纯语言任务准确率下降超10%。GenieBlue通过冻结原始LLM参数，并引入复制的Transformer层和 轻量化的LoRA模块，在多模态训练的过程中保留原始的语言能力。 2、通过大规模微调，GenieBlue达到与主流MLLM相媲美的多模态能力，并完全保留原始纯语言性能。 3、避开当前NPU不支持的MoE架构，采用不共享基座的推理策略。在搭载高通骁龙8 Elite（第四代）芯片的手机上实现流畅运行。 技术背景 1、当前的端侧MLLM无法取得令人满意的纯语言能力 在MATH（客观难题）、AlignBench和MT- ...

Core Viewpoint - Google is accelerating its upgrade of the Tensor G6 chip to TSMC's 2nm process, aiming to keep pace with competitors in the semiconductor industry [2][3]. Group 1: Chip Development Timeline - The first Tensor chip, launched in 2021 with the Pixel 6, was manufactured using Samsung's 5nm process, and the Tensor G2 followed suit the next year [2]. - The Tensor G3 was the first to utilize a 4nm process, while the current Tensor G4 is also based on this technology [2]. - Google plans to transition the Tensor G5 to TSMC's 3nm process later this year, marking a significant shift in its manufacturing strategy [2]. Group 2: Future Plans for Tensor G6 - According to reports, Google intends to use TSMC's 2nm process for the Tensor G6 in the Pixel 11 series, which is set to launch in 2026 [3]. - This move could position Google ahead of competitors, as the next Snapdragon 8 Elite chipset may still be using a 3nm process at that time [3]. - There are indications that Qualcomm may produce a 3nm version of its upcoming flagship products, while Samsung is expected to manufacture a 2nm version specifically for Galaxy devices [3]. Group 3: Features and Enhancements - Limited information is available about the Tensor G6, but a report suggests it may include AI-enhanced features [4]. - Leaks from Google's gChips division indicate that the Pixel 11 series could feature video editing tools powered by "Video Generation ML" [4]. - Additionally, there are rumors that the Tensor G6 will focus on health-related functionalities, such as monitoring breathing, sleep apnea, and gait analysis [4].

Group 1 - Samsung Electronics' Device Solutions (DS) division plans to mass-produce the next-generation LPDDR6 memory using the sixth-generation "1c DRAM" process in the second half of this year [1][3] - The 1c DRAM technology offers higher transistor density and better energy efficiency compared to previous generations, with cold yield rates reaching 50% and hot yield rates between 60%-70% [3][4] - Samsung aims to supply LPDDR6 memory to major tech companies like Qualcomm, enhancing its presence in the smartphone, laptop, and AI server markets [4] Group 2 - China’s Changxin Memory Technologies (CXMT) has completed the development phase of LPDDR5X memory and is working to close the technology gap with Samsung, potentially achieving mass production by 2026 [3] - Samsung is accelerating its LPDDR6 memory technology development in response to CXMT's advancements [3][4] - The upcoming Qualcomm Snapdragon 8 Elite Gen2 chip will be the first to support LPDDR6 memory, set to be unveiled at the Snapdragon Summit on September 23 [3] Group 3 - Samsung is also deploying 1c DRAM technology in high-end storage products like HBM4, aiming to create a comprehensive memory solution for AI applications [4] - The company has established an expansion plan for 1c DRAM, with production line construction in its Hwaseong factory expected to be completed by the end of this year [4] - Samsung is concurrently developing 1c DRAM for both DDR and LPDDR applications, breaking traditional development sequences to accelerate commercialization [4]

6月3日，据Wccftech最新报道，台积电2nm制程应用于存储产品的良率已突破90%。分析师指出，由于 台积电正争取与英伟达、苹果、高通、超微和博通等美国主要科技公司的订单，该工厂产能利用率有望 在短期内达到饱和。 该媒体称，苹果仍是台积电亚利桑那工厂的最大客户，并将率先获得该厂生产的芯片。目前台积电正在 美国生产N4芯片，该制程对应5纳米和4纳米芯片。据悉，英伟达的人工智能芯片正在该工厂进行制程 验证，这些芯片预计将于今年年底投产。 业内人士认为，由于美国制造成本上升以及亚利桑那工厂需求旺盛，该厂芯片价格可能上涨高达30%。 Cloud Express的Nobunaga Chai透露，该厂目前月产12英寸晶圆1.5万片，即将扩产至2.4万片，达到工厂 峰值产能。 同时，台积电2nm芯片制程也取得重大突破。据Wccftech，该公司的2nm制程良率已突破90%，不过目 前的高良率适用于存储产品。良率指单个硅晶圆中合格芯片的占比——良率越高，芯片制造商需要承担 的次品生产成本就越低。2nm制程晶圆的订购成本约为3万美元。 根据预计，台积电2nm明年的流片量将达到过去5nm量产次年流片量的4倍。流片指芯片设计的 ...

以下文章来源于AGI接口 ，作者丸都山 "三月底，一场突如其来的交通事故把这一切都击碎了。我们受到了狂风暴雨般的质疑、批评和指 责，我和同事们一样，一下子都懵了……" AGI接口 . AI卷起的财富风暴。 一周前，雷军在小米集团内部演讲中，针对近期小米陷入的舆论危机，发表了一番痛心疾首的陈 词。 出品 | 虎嗅科技组 作者 | 丸都山 编辑 | 苗正卿 头图 | 视觉中国 不过，此时神情低落的雷军，或许在心底暗藏着旁人难以察觉的底气。 因为就在同一时刻，位于北京亦庄的小米黑灯工厂里，呈现一片忙碌景象：全新的小米15S Pro智 能手机，在一个个机械臂精准运作下完成组装、测试，随后被迅速打包装车，朝着全国的小米之 家和各大电商的物流中心疾驰而去。 而这些手机的屏幕盖板之下，嵌刻着雷军当下及未来的底气——首款自研旗舰手机SoC芯片"玄戒 O1"。 5月22日晚间，在小米召开"15周年战略新品发布会"上，这款芯片正式发布。 随着华为海思的有意蛰伏，中国手机行业已经很久没有出现关于"自研SoC"的消息，此次玄戒O1 的出现，毫无意外地在各社交平台上点燃了自研芯片的话题，风头直接盖住了当晚亮相的小米Yu 7。 在如此高 ...

数据来源： Counterpoint 《 2024 年 Q4 全球智能手机 SoC 营收与预测追踪报告》 根据 Counterpoint Research《2024年Q4全球智能手机SoC营收与预测追踪报告》 显示，得益于消 费者对高端机型的强劲偏好，2024年安卓高端智能手机系统级芯片（SoC）营收同比增长34%。出 货量增长和平均售价（ASP）提升共同推动增长。 全球安卓高端SoC各品牌收入份额 分析师观点 Note 1: 数据代表安卓高端市场出货量，不包括 Apple 。 Note 2: 高端智能手机 SoC 是指 Qualcomm 骁龙 800 系列， Media Tek 天玑 9000 系列，海思麒麟 9000 系列和 Google Tensor 系 列。 整体趋势与不确定性 2024年高端智能手机SoC营收同比增长34%，这得益于市场对高端机型需求攀升及更强AI性能 平台的升级迭代 Qualcomm以6%的年增长率保持市场主导地位。虽然该厂商在Samsung Galaxy S24系列中被 Exynos芯片挤占份额，但2025年将因Galaxy S25系列全系搭载骁龙8 Elite芯片实现回升。 S ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文来自 counterpointresearch ，谢谢。 根据Counterpoint Research发布的《2024年第四季度全球智能手机SoC收入及预测追踪报告》 ，受消费者对高端智能手机的强烈偏好推动，2024年高端安卓智能手机SoC收入同比增长34% 。 出货量增长和平均售价上涨也推动了收入增长。 在评论高通和联发科的增长时，Counterpoint Research 分析师Shivani Parashar表示："到 2025 年，高通将在高端安卓 SoC 市场保持主导地位，这得益于其与三星在Galaxy S25 系列上的独家 合作，以及除谷歌 Pixel 之外所有安卓 OEM 厂商的设计胜利。高通在骁龙 8 Elite 中引入了定 制的 Oryon 内核，这些内核擅长处理对延迟要求严格的任务并分配 AI 工作负载。高通凭借其 AI 堆栈和整个生态系统的合作伙伴关系处于领先地位，通过优化的模型和软件/API，为在设备 上部署 AI 提供简化的体验。" Parashar补充道："与此同时，联发科已成为高端 SoC 市场的有力竞争者。它与 vivo、O ...

【国泰海通电子】高通NPU+3DDRAM专家交流takeaways 1、高通合作验证节奏：今年一季度正式立项，完成了国内供应商验证，预计6月底回片后进行合封、测试、良率 和功能评估，明年2-3月送样手机厂商，9-10月推出手机市场； 2、应用层面升级：高通骁龙8 Elite旗舰机标配LPDDR5x，带宽85GB/s，升级3DDRAM后可超过 1T。 目前配合验证的产品带宽在256GB/s， 【国泰海通电子】高通NPU+3DDRAM专家交流takeaways 1、高通合作验证节奏：今年一季度正式立项，完成了国内供应商验证，预计6月底回片后进行合封、测试、良率 和功能评估，明年2-3月送样手机厂商，9-10月推出手机市场； 2、应用层面升级：高通骁龙8 Elite旗舰机标配LPDDR5x，带宽85GB/s，升级3DDRAM后可超过 1T。 目前配合验证的产品带宽在256GB/s，速率提升三倍，成本合计上升约60美元，适用计算摄影AI等高端机型； 3、WoW方案优势：相比华邦CUBE，WoW采用hybrid bonding，没有微凸点，堆叠高度更薄，内存带宽和功耗方面 具备优势；且在4层以上堆叠情况下良率优于CUB ...