公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ：内容来自半导体行业观察综合 。 据韩媒报道，三星电子的移动应用处理器（AP）采购成本正在上升。这是因为今年发布的智能手机 主要使用高通等高价外置AP。 因此，此前因性能问题而推迟搭载于主流机型的三星自主研发的移动AP"Exynos"的作用正变得越来 越重要。关键在于，负责设计和生产Exynos的三星电子设备解决方案（DS）部门是否会在明年发布 的"Galaxy S26"中搭载下一代AP。 据三星电子19日发布的半年报显示，今年上半年三星电子设备体验(DX)部门的移动AP采购额与去年 同期的6.0275万亿韩元相比增长了29.2%，达到了7.7899万亿韩元。同期，移动AP在DX部门原材料 采购总额中所占比例也从17.1%增长到了19.9%。移动AP是充当智能手机大脑的半导体，是决定性能 的关键部件。 这似乎是由于三星电子在今年早些时候发布的高端智能手机"Galaxy S25"系列中全线搭载了高通的移 动AP——骁龙8 Elite，导致成本增加。上个月发布的Galaxy Z Fold 7也采用了高通的AP。骁龙从本 质上来说比Exynos要贵。 具体来说， ...

今年夏天，气温连连破纪录，全国多地气象局连续发布高温橙色、红色预警。在这种极端气候下，我们 不光要防止自身中暑，也要关注身边电子设备的运行状况，尤其是手机。手机的内部结构虽然精密，但 抗高温能力远不如人们想象。 新一代智能手机发热问题，实质上是性能跃升与热设计受限之间的结构性矛盾。如今的旗舰 SoC，如骁 龙 8 Elite、天玑 9400 及苹果 A18 Pro，已普遍采用 3nm/4nm 先进制程，虽然带来了显著的性能提升， 但功耗密度同步上升，导致芯片单位面积产生的热量增加。与此同时，配备高刷新率屏幕、5G 网络以 及大尺寸影像传感器的手机，对系统整体功耗提出了更高要求，而受限于机身结构与被动散热能力，热 量更难有效释放，从而加剧了整机的发热现象。 然而，当前智能手机的工业设计趋势持续向轻薄化推进，机身厚度普遍被控制在 8mm 以内，留给散热 系统的空间日益有限。为适配紧凑结构，传统的 VC 均热板、石墨烯散热层等被迫缩减体积，甚至有部 分机型为了维持纤薄外观，采用了导热效率较低的复合材料，导致高性能硬件所产生的热量难以及时有 效释放，最终传导至外壳，使用户感受到明显的发热现象。 面对这一挑战，厂商也在 ...

Core Viewpoint - Google is accelerating its upgrade of the Tensor G6 chip to TSMC's 2nm process, aiming to keep pace with competitors in the semiconductor industry [2][3]. Group 1: Chip Development Timeline - The first Tensor chip, launched in 2021 with the Pixel 6, was manufactured using Samsung's 5nm process, and the Tensor G2 followed suit the next year [2]. - The Tensor G3 was the first to utilize a 4nm process, while the current Tensor G4 is also based on this technology [2]. - Google plans to transition the Tensor G5 to TSMC's 3nm process later this year, marking a significant shift in its manufacturing strategy [2]. Group 2: Future Plans for Tensor G6 - According to reports, Google intends to use TSMC's 2nm process for the Tensor G6 in the Pixel 11 series, which is set to launch in 2026 [3]. - This move could position Google ahead of competitors, as the next Snapdragon 8 Elite chipset may still be using a 3nm process at that time [3]. - There are indications that Qualcomm may produce a 3nm version of its upcoming flagship products, while Samsung is expected to manufacture a 2nm version specifically for Galaxy devices [3]. Group 3: Features and Enhancements - Limited information is available about the Tensor G6, but a report suggests it may include AI-enhanced features [4]. - Leaks from Google's gChips division indicate that the Pixel 11 series could feature video editing tools powered by "Video Generation ML" [4]. - Additionally, there are rumors that the Tensor G6 will focus on health-related functionalities, such as monitoring breathing, sleep apnea, and gait analysis [4].

Core Viewpoint - The article discusses the recent launch of Xiaomi's self-developed SoC chip "玄戒O1" and its implications for the company's future in the competitive smartphone market, particularly in the context of self-research and development in the industry [6][9][40]. Summary by Sections 1. Background and Context - Xiaomi faced a public relations crisis following a traffic accident, prompting CEO Lei Jun to address the internal team about the situation [3][4]. - Concurrently, Xiaomi's factory was busy assembling the new Xiaomi 15S Pro smartphone, which features the newly developed SoC chip "玄戒O1" [5][6]. 2. The Launch of 玄戒O1 - The chip was officially launched during Xiaomi's 15th-anniversary strategic product launch event on May 22 [6]. - The introduction of 玄戒O1 has reignited discussions about self-developed chips in the Chinese smartphone industry, especially in light of Huawei's recent silence on the matter [8]. 3. Technical Features of 玄戒O1 - 玄戒O1 is built on a second-generation 3nm process and features a ten-core CPU architecture with a unique "four-cluster" design [16][20]. - The chip's design aims to enhance energy efficiency, with performance metrics reportedly close to that of competitors like Apple's A18 Pro [22][24]. - Xiaomi's team undertook significant risks by redesigning the chip's internal cells, which is uncommon in the industry due to potential compatibility issues [27][29]. 4. Strategic Implications - Xiaomi plans to adopt a "dual-chip strategy" by using both 玄戒O1 and Qualcomm's chips in future devices, acknowledging that 玄戒O1 may not yet be ready to fully replace Qualcomm's offerings [32][33]. - The positioning of 玄戒O1 will initially focus on the "S series" smartphones and IoT devices, such as the newly launched Xiaomi Pad 7 Ultra [35][37]. 5. Industry Context and Future Outlook - The article highlights a consensus in the industry that self-developed chips are becoming a core competitive advantage for smartphone brands [39]. - The current surge in smartphone sales in China, driven by government subsidies, may lead to a demand vacuum in the future, making the differentiation provided by 玄戒O1 crucial for Xiaomi's competitiveness [41].

Core Viewpoint - The global high-end Android smartphone SoC revenue is projected to grow by 34% year-on-year in 2024, driven by strong consumer demand for high-end smartphones and the introduction of more powerful AI platforms [2][5]. Group 1: Market Trends - The high-end Android smartphone SoC segment is expected to account for 52% of total Android smartphone SoC revenue in 2024, indicating a significant market share [6]. - Qualcomm remains the market leader with a year-on-year growth rate of 6%, despite losing some market share to Samsung's Exynos in the Galaxy S24 series [5][6]. - MediaTek's high-end smartphone SoC revenue nearly doubled, attributed to the strong performance of the Dimensity 9300 series and the launch of Dimensity 9400 [5][7]. Group 2: Company Performances - Samsung's high-end smartphone revenue quadrupled in 2024, driven by strong sales of the Galaxy S24, but is expected to decline in 2025 due to the Galaxy S25 series not winning design awards [8]. - HiSilicon has made a strong return in the Chinese high-end market, achieving a revenue share of 12% in 2024, and is expected to maintain its position as the third-largest brand in the Android high-end market by revenue in 2025 [5][8]. - Qualcomm's exclusive partnership with Samsung for the Galaxy S25 series is expected to help it maintain its leading position in the high-end Android SoC market by 2025 [7]. Group 3: Competitive Landscape - The competition in the high-end SoC market is intensifying with the return of HiSilicon and the rise of MediaTek, which has established strategic partnerships with OEMs like vivo and OPPO [6][7]. - Qualcomm's Snapdragon 8 Elite introduces customized Oryon cores, enhancing its position in AI workload management and overall performance [7]. - MediaTek must focus on global flagship brands and developer partnerships to sustain its growth in the high-end SoC market [7].