Core Viewpoint - ASMPT (00522.HK) will hold a board meeting on April 21, 2026, to consider and approve the publication of the unaudited consolidated performance announcement for the three months ending March 31, 2026 [1] Group 1 - The board meeting is scheduled for April 21, 2026 [1] - The purpose of the meeting is to consider and approve the performance announcement [1] - The unaudited consolidated performance announcement will be published on April 22, 2026 [1]

ASMPT LIMITED （於開曼群島註冊成立之有限公司） （股份代號：0522） 董事會召開日期 ASMPT Limited（「本公司」）謹此宣布，本公司董事會會議將於二零二六年四 月二十一日（星期二）舉行，藉以（其中包括）考慮及批准刊發本公司及其附 屬公司截至二零二六年三月三十一日止三個月的未經審計綜合業績公告。上述 公告將於二零二六年四月二十二日上午公布。 香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負 責，對其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全 部或任何部份內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 香港，二零二六年四月一日 於本公告日期，本公司董事會成員包括獨立非執行董事：樂錦壯先生（主席）、 張仰學先生、蕭潔雲女士及許明明女士；非執行董事： Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生；執行 董事： 黃梓 达先生及 Guenter Walter Lauber 先生。 （本公告之中英文版本如有任何歧義，概以英文版本為準。） 承董事會命 ASMPT Limited 公司秘書 ...

Investment Rating - The industry investment rating is maintained as "Positive" [5] Core Insights - The importance of advanced packaging equipment is increasing, and wafer manufacturing equipment is continuously upgrading. Key players are deepening their layout in advanced packaging equipment, which is expected to see significant market growth [3][8] - Domestic companies are enhancing their innovation capabilities in wafer manufacturing equipment, responding to the upgrade demands in etching and thin film deposition [8] Summary by Sections Investment Recommendations and Targets - Key investment targets include: - 北方华创 (Northern Huachuang) - Buy - 中微公司 (Zhongwei Company) - Buy - 盛美上海 (Shengmei Shanghai) - Buy - 拓荆科技 (Tuojing Technology) - Buy - 华海清科 (Huahai Qingke) - Not Rated - 百傲化学 (Bai'ao Chemical) - Not Rated - 芯源微 (Xinyuan Micro) - Buy - ASMPT - Not Rated - 精测电子 (Jingce Electronics) - Buy [3][9] Industry Developments - At the SEMICON China 2026 event, leading semiconductor equipment manufacturers showcased advancements in advanced packaging equipment, with notable product launches such as: - 北方华创's 12-inch Qomola HPD30 hybrid bonding equipment - 拓荆科技's 3D IC series products focusing on advanced logic chip applications - ASMPT's new bare wafer processing system ALSI LASER1206 [8] - Domestic companies are making significant strides in wafer manufacturing equipment, with innovations such as: - 北方华创's new generation 12-inch NMC612H ICP etching equipment - 中微公司的 new generation ICP etching equipment solutions for advanced storage chips [8]

Group 1 - FIL Limited reduced its stake in ASMPT (00522) by 237,900 shares at an average price of HKD 109.2749 per share, totaling approximately HKD 25.9965 million [1] - After the reduction, FIL Limited's remaining shareholding is approximately 41,775,000 shares, representing a stake of 9.99% [1]

Group 1 - FIL Limited reduced its stake in ASMPT (00522) by 237,900 shares at an average price of HKD 109.2749 per share, totaling approximately HKD 25.9965 million [2] - After the reduction, FIL Limited's remaining shareholding is approximately 41,775,500 shares, representing a stake of 9.99% [2] - The transaction involved other related parties, including Pandanus Associates Inc. and Pandanus Partners L.P. [2]

Group 1 - FIL Limited reduced its stake in ASMPT (00522) by 237,900 shares at an average price of HKD 109.2749 per share, totaling approximately HKD 25.9965 million [1] - After the reduction, FIL Limited's remaining shareholding is approximately 41,775,000 shares, representing a stake of 9.99% [1] - The transaction involves other related parties, including Pandanus Associates Inc. and Pandanus Partners L.P. [1]

Group 1 - ASMPT announced the issuance of 56,700 shares on March 17, 2026, as part of the employee share award plan adopted on March 24, 2020 [1]

第 1 頁 共 6 頁 v 1.3.0 FF305 FF305 翌日披露報表 (股份發行人 ── 已發行股份或庫存股份變動、股份購回及/或在場内出售庫存股份) 表格類別： 股票 狀態： 新提交 公司名稱： ASMPT Limited 呈交日期： 2026年3月17日 如上市發行人的已發行股份或庫存股份出現變動而須根據《香港聯合交易所有限公司（「香港聯交所」）證券上市規則》(「《主板上市規則》」)第13.25A條 / 《香港聯合交易所有限公司GEM證券 上市規則》(「《GEM上市規則》」)第17.27A條作出披露，必須填妥第一章節 。 | 第一章節 | | | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | | 於香港聯交所上市 | 是 | | | | 證券代號 (如上市) | 00522 | 說明 | | | | | | | | | A. 已發行股份或庫存股份變動 | | | | | | | | | | | | | | 已發行股份（不包括庫存 ...

Company and Industry Summary Company Overview - The company is involved in the TCB (Thermo-Compression Bonding) equipment market, focusing on advanced packaging technologies for semiconductors, particularly in the HBM (High Bandwidth Memory) sector. Key Points Market Potential and Growth - The total addressable market (TAM) for TCB has been revised upwards from $1 billion to $1.6 billion by 2028, driven by the surge in AI demand, with a projected compound annual growth rate (CAGR) of approximately 30% from 2025 to 2028 [2][9][15]. HBM Business Developments - The company has shipped HBM4 12-layer TCB equipment and is currently sampling 16-layer solutions. If JEDEC relaxes stacking height restrictions, TCB technology could extend to 20 layers, delaying the introduction of hybrid bonding (HB) [2][13][15]. - In Q4 2025, the company secured significant orders for logic chips, including 34 Chip-to-Substrate TCB orders from leading foundries, indicating strong demand in the logic chip sector [4][5]. Demand Structure - The demand for HBM memory interconnects significantly exceeds that for logic chips, with a ratio of 72 to 1. Within logic applications, Chip-to-Substrate demand is currently much higher than the nascent Chip-to-Wafer segment [2][6]. Strategic Focus - The company plans to divest its NEXX (wet process) and SMT (Surface Mount Technology) businesses to concentrate resources on high-growth, high-margin advanced packaging sectors, including TCB, photonics, and high-end die bonding [2][18]. Regional Performance - Revenue from Japan and Korea increased to 9%, primarily driven by advanced packaging, especially TCB, with significant contributions from the HBM market in Korea [7][8]. Future Outlook - The company maintains a market share target of 35% to 40% in the TCB market, with expectations of continued growth in the coming years, although specific guidance for 2026 was not provided [9][10]. Supply Chain and Production Capacity - Current production capacity for TCB equipment is stable, with no immediate price increases anticipated. The company is monitoring supply chain impacts from geopolitical events but has not faced significant disruptions [12]. Technology and Innovation - The company is actively exploring hybrid bonding solutions while continuing to advance TCB technology. The development of 20-layer HBM products will depend on market demand and potential regulatory changes [16][17]. Financial Considerations - The NEXX business generated approximately $100 million in revenue in 2025, but specific transaction details regarding its sale have not been disclosed [21]. Customer Engagement - The company is engaging with major HBM customers in Korea, including the second-largest memory manufacturer, to explore opportunities beyond traditional supply chains [3][19]. Conclusion - The company is well-positioned in the advanced packaging market, particularly in TCB technology, with strong growth prospects driven by AI and HBM demand. Strategic divestitures and a focus on core competencies are expected to enhance its market position moving forward.

Summary of ASMPT Conference Call Industry and Company Overview - The conference call focuses on the advanced packaging industry, specifically the TCB (Thermal Compression Bonding) technology and its applications in the semiconductor sector, particularly in HBM (High Bandwidth Memory) and logic chips [2][3][4]. Key Points and Arguments TCB Demand and Market Growth - TCB demand is expected to surge, with HBM packaging usage surpassing logic chips, driving the storage sector to become a core growth engine from 2026 to 2027 [2]. - The market size forecast for TCB has been raised from $1 billion to $1.6 billion by 2028, driven by strong trends in the AI market [3]. - The company aims to capture a market share of 35%-40% in the TCB market by 2028, translating to approximately $640 million in revenue [2][9]. Technological Advancements - TCB technology has adapted to both MR-MUF (Mass Reflow Molded Underfill) and NCF (Non-Conductive Film) processes, with a shift towards TCB combined with MUF as HBM technology evolves [2][4]. - The JEDEC's plan to relax height restrictions for HBM will significantly extend the lifecycle of TCB technology, delaying the introduction of Hybrid Bonding until the HBM5 stage (20 layers or more) [2][6]. Competitive Landscape - The main competitors in the TCB market are two South Korean companies, indicating a concentrated competitive environment [8]. - The company has secured exclusive large orders from leading foundries, including being the first supplier for HBM4 12-layer stacking orders [3][4]. Strategic Focus and Business Segmentation - The decision to divest the Nexx business is part of a strategic focus on high-growth, high-margin advanced packaging areas, particularly in back-end processes [9]. - The company is also involved in other high-growth segments, such as Amicra equipment in the CPO (Co-Packaged Optics) field and Photonics for optical transceivers, which are benefiting from AI data center demands [9][13]. Future Outlook and Market Dynamics - The demand for TCB devices in the memory sector is expected to remain strong through 2026-2027, with logic chip demand anticipated to catch up as advanced packaging technologies like Chip-on-Wafer gain traction [7][14]. - The company is exploring potential mergers and acquisitions to further enhance its focus on back-end, high-growth, and high-margin strategies [13]. Financial Projections and Market Assumptions - The TCB market size projection is based on conservative assumptions, including a 75-micron chip gap standard by JEDEC, with potential for expansion if standards are relaxed further [10]. - The company is assessing the possibility of providing market size guidance for other advanced packaging businesses to enhance investor transparency [11]. Additional Important Insights - The company has made significant progress in securing orders from major HBM manufacturers, indicating strong market acceptance of its TCB technology [4][5]. - The transition from Mass Reflow technology to TCB is seen as a necessary evolution due to the limitations of the former in higher layer counts [6]. - The company is optimistic about 2026, expecting it to be a better year than 2025, driven by advancements in TCB and strong demand from China [16].