股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 | 截至月份: | 2024年4月30日 | 狀態: | 新提交 | | --- | --- | --- | --- | | 致：香港交易及結算所有限公司 | | | | | 公司名稱: | 華虹半導體有限公司（於香港註冊成立的有限公司） | | | | 呈交日期: | 2024年5月7日 | | | | I. 法定/註冊股本變動 不適用 | | | | 第 2 頁 共 6 頁 v 1.0.2 III. 已發行股份變動詳情 (A). 股份期權（根據發行人的股份期權計劃） FF301 第 1 頁 共 6 頁 v 1.0.2 FF301 II. 已發行股份變動 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | 於香港聯交所上市 (註1) | 是 | | --- | --- | --- | --- | --- | --- | | 證券代號 | 01347 | 說明 | | | | | 上月底結存 | | 1,309,022,427 | | | | | 增加 / 減少 (-) | | 16,334 | | | | | 本月底結 ...

2023 年度集体业绩说明会的公告 | A 股代码：688347 | 股简称：华虹公司 A | 公告编号：2024-016 | | --- | --- | --- | | 港股代码：01347 | 港股简称：华虹半导体 | | 华虹半导体有限公司关于参加上海国有控股上市公司 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 华虹半导体有限公司（以下简称"公司"）已于 2024 年 3 月 29 日披露公司 2023 年度报告，为进一步加强公司与投资者的沟通交流，让广大投资者能深入了解公 司经营情况、未来发展战略等，公司将参加由上海市国资委、上海证券交易所共 同举办的上海国有控股上市公司 2023 年度集体业绩说明会，就投资者关心的问题 进行互动交流。 一、 说明会类型 本次投资者说明会以"上证路演中心视频直播和网络互动"形式召开，公司 将针对 2023 年度经营情况及未来发展战略等情况与投资者进行互动交流和沟通， 在信息披露允许的范围内解答投资者普遍关注的问题。 二、 说明会召开的时间、地点 （一）会议主题： ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） 董事會會議日期通知 華虹半導體有限公司（「本公司」）特此通知，本公司謹訂於二零二四年五月九日 （星期四）上午十時舉行董事會會議，以商討下列事項： 承董事會命 華虹半導體有限公司 董事長兼執行董事 張素心先生 中國上海，二零二四年四月二十五日 1 1. 考慮及批准刊發本公司及其附屬公司就二零二四年一月一日至三月三十一日 止三個月期間的第一季度未經審核財務業績；及 2. 商議任何其他事項。 於本公告日期，本公司董事分別為： 執行董事 張素心 （董事長） 唐均君 （總裁） 非執行董事 葉峻 孫國棟 周利民 熊承艷 獨立非執行董事 張祖同 王桂壎太平紳士 封松林 2 ...

| 股代码：688347 | 股简称：华虹公司 A | 公告编号：2024-015 | | --- | --- | --- | | | 港股简称：华虹半导体 | | | A 港股代码：01347 | | | 华虹半导体有限公司 关于召开 2024 年第一季度业绩说明会的预告公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 说明会将于 2024 年 5 月 9 日（星期四）下午 17:00-18:00 通过网络/电话会议 方式举行。 三、 投资者参加方式 重要事项提示： 一、说明会类型 华虹半导体有限公司（以下简称"公司"）将于 2024 年 5 月 9 日 交易时段后 披露公司 2024 年 第 一 季度业绩，相关内容请详见上海证券交易所网站 （http://www.sse.com.cn/）及香港交易所网站（https://www.hkex.com.hk/）。 为方便广大投资者更全面深入了解公司经营业绩的具体情况，公司拟于 2024 年 5 月 9 日举行"2024 年第一季度业绩说明会"。 二、 说明会召开的时间、地 ...

此乃要件 请即处理 阁下对本通函任何方面或应采取的行动如有任何疑问，应咨询股票经纪或其他注册证券商、银行经 理、律师、专业会计师或其他专业顾问。 阁下如已售出或转让名下所有华虹半导体有限公司的股份，应立即将本通函连同随附的代表委任表 格转交予买主或承让人、或经手买卖或转让的银行、股票经纪或其他代理人，以便转交买主或承让 人。 香港交易及结算所有限公司及香港联合交易所有限公司对本通函的内容概不负责，对其准确性或完 整性亦不发表任何声明，并明确表示，概不对因本通函全部或任何部分内容而产生或因倚赖该等内 容而引致的任何损失承担任何责任。 HUA HONG SEMICONDUCTOR LIMITED 华虹半导体有限公司 （于香港注册成立的有限公司） （股份代号 ：01347） （上海证券交易所股票代码 ：688347） (1) 建议宣派末期股息 ； (2) 建议重选退任董事 ； (3) 建议授出购回股份及发行股份的一般授权 ； 及 (4) 股东周年大会通告 华虹半导体有限公司谨订于二零二四年五月九日下午二时三十分在香港九龙么地道64号九龙香格里 拉大酒店举行股东周年大会，大会通告载于本通函第18至22页。随函亦附奉股 ...

| A 股代码：688347 | A 股简称：华虹公司 | 公告编号：2024-014 | | --- | --- | --- | | 港股代码：01347 | 港股简称：华虹半导体 | | 华虹半导体有限公司 关于召开 2024 年股东周年大会的通知 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、 召开会议的基本情况 （一） 股东大会类型和届次 2024 年股东周年大会 召开日期时间：2024 年 5 月 9 日 14 点 30 分 召开地点：香港九龙么地道 64 号九龙香格里拉大酒店 （五） 网络投票的系统、起止日期和投票时间。 网络投票系统：上海证券交易所股东大会网络投票系统 网络投票起止时间：自 2024 年 5 月 9 日 至 2024 年 5 月 9 日 采用上海证券交易所网络投票系统，通过交易系统投票平台的投票时间为股 二、 会议审议事项 本次股东大会审议议案及投票股东类型 | 序号 | 议案名称 | 投票股东类型 | | --- | --- | --- | | | | 股股东 A | | ...

Financial Performance - Revenue for 2023 reached US$2,475.5 million, representing a 36% increase compared to the previous year[16] - The company reported an earnings per share (EPS) of US$0.34, up from US$0.25 in 2022, indicating a 36% growth[16] - The consolidated statement of cash flows showed a net cash inflow of US$1,630.8 million, reflecting a 24% increase from the previous year[16] - In 2023, Hua Hong Semiconductor reported revenue of US$2,286.1 million, a decrease of 7.7% compared to 2022[19] - The overall gross profit margin decreased by 12.8 percentage points to 21.3% compared to the previous year[19] - Profit for the year attributable to owners of the parent decreased by 37.8% to US$280.0 million, resulting in a net profit margin of 5.5% compared to 16.4% in 2022[138] - Gross profit decreased by 42.3% to US$487.1 million, primarily due to decreased average selling prices and increased depreciation costs[130] - Other income and gains increased by 103.4% to US$144.4 million, mainly driven by increased government subsidies and interest income[131] Market Expansion and Strategy - The company plans to expand its market presence through strategic partnerships and investments in new technologies[16] - The company aims to enhance production capacity by 20% in the next fiscal year to meet growing demand[16] - A new product line is expected to launch in Q3 2024, targeting the automotive semiconductor market[16] - The company is exploring potential acquisitions to strengthen its position in the semiconductor industry[16] - Future guidance estimates revenue growth of 25% for the next fiscal year, supported by strong market demand[16] - The company is focused on penetrating emerging markets such as communication, new energy, IoT, and automotive electronics[19] - The company emphasizes a dual-pronged strategy of "Specialty IC + Power Discrete" to navigate market challenges[19] Research and Development - Research and development expenses increased by 30% year-over-year, highlighting a commitment to innovation[16] - Looking ahead to 2024, the company plans to advance research and development of new technologies and optimize existing platforms[21] - The company continues to focus on R&D in differentiated technologies, particularly in eNVM and power management ICs, to meet market demand[120] Corporate Governance - The Company has a nine-member Board comprising two Executive Directors, four Non-Executive Directors, and three Independent Non-Executive Directors[51] - The Company complied with the Corporate Governance Code during the year ended 31 December 2023[48] - The Company has adopted the Model Code for Securities Transactions by Directors, with all Directors confirming compliance throughout the year[49] - The Board is responsible for the overall management of the Company, delegating day-to-day management to the Chairman and management team[50] - The Company has established corporate governance procedures that comply with the principles in the Corporate Governance Code[46] - The Company has continually monitored and updated its corporate governance practices in response to regulatory changes[47] - The Company has implemented mechanisms for independent views and input to the Board, ensuring effective governance[61] Board Composition and Diversity - Ms. Chengyan Xiong was appointed as a Non-executive Director effective from 28 March 2024, bringing nearly 20 years of experience in finance and accounting[31] - The term for each Non-Executive Director is three years, subject to re-nomination and re-election[52] - The Board has achieved measurable objectives for diversity, with a focus on cultural and educational background, professional experience, and skills[82] - The Nomination Committee is actively seeking to improve gender diversity on the Board after the resignation of a director in September 2023[82] - The Company is committed to maintaining a balance of diverse perspectives on the Board to support its growth[83] Risk Management - The Company has implemented a robust risk management system, including a three-line model for risk management and internal monitoring[104] - The internal auditing department reported no material deficiencies in the Company's risk management and internal monitoring system for the year ended December 31, 2023[105] Shareholder Communication and Financial Management - The Company has adopted a shareholders' communication policy to ensure equal and timely access to information for shareholders[88] - The Company paid US$0.75 million for audit services and US$0.01 million for non-audit related services during the year ended December 31, 2023[76] - The Company maintains a policy to monitor liquidity requirements regularly to ensure sufficient cash reserves and funding lines[157] - The company has no significant exposure to credit risk as it trades only with recognized and creditworthy parties[155] Investments and Capital Projects - The Hua Hong Manufacturing Project, launched in June 2023, involves an investment of US$6.7 billion for a new 12-inch specialty technology production line with a monthly capacity of 83,000 wafers[20] - The Company plans to utilize the proceeds for various projects, including RMB12.5 billion for the Hua Hong Manufacturing (Wuxi) Project, with RMB11.72 billion unutilized as of the reporting period[188] - A joint venture was established on 18 January 2023, with an investment of US$880.38 million for the Wuxi Phase II project (HH Fab9) to manufacture integrated circuits and 12-inch wafers[189] Share Options and Dividends - The company recommended a final dividend of HK$0.165 per share, totaling approximately US$36,234,000 for the year ended December 31, 2023[162] - The share option scheme allows for a total of 21,144,481 shares to be issued, representing approximately 1.23% of the total shares in issue[173] - The company granted 30,250,000 share options at an exercise price of HK$6.912, representing 1.76% of the issued shares as of December 31, 2023[174] - A total of 34,500,000 share options were granted at an exercise price of HK$15.056, representing 2.01% of the issued shares as of December 31, 2023[176] Sales and Revenue Breakdown - Revenue from semiconductor wafers accounted for 95.4% of total revenue, amounting to US$2,181.6 million, down 8.2% year-on-year[112] - Revenue from systems and fabless companies was US$2,109.5 million, representing 92.3% of total revenue, a decline of 7.0% year-on-year[113] - Revenue from the European market grew by 17.5% year-on-year, reaching US$134.8 million, while North America and Other Asia saw declines of 31.2% and 29.2%, respectively[114] - Power discrete revenue increased by 16.5% year-on-year to US$902.3 million, driven by demand in the new energy vehicle and industrial sectors[115]

股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 截至月份: 2024年3月31日 狀態: 新提交 致：香港交易及結算所有限公司 公司名稱: 華虹半導體有限公司（於香港註冊成立的有限公司） 呈交日期: 2024年4月8日 I. 法定/註冊股本變動 不適用 FF301 第 1 頁 共 6 頁 v 1.0.2 FF301 II. 已發行股份變動 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | 於香港聯交所上市 (註1) | 是 | | --- | --- | --- | --- | --- | --- | | 證券代號 | 01347 | 說明 | | | | | 上月底結存 | | 1,308,863,694 | | | | | 增加 / 減少 (-) | | 158,733 | | | | | 本月底結存 | | 1,309,022,427 | | | | | 2. 股份分類 | 普通股 | 股份類別 | A | 於香港聯交所上市 (註1) | 否 | | --- | --- | --- | --- | --- | --- | | 證券代號 | 688347 | 說 ...

Financial Performance - In 2023, Hua Hong Semiconductor reported a revenue of RMB 16.232 billion, a decrease of 3.30% compared to 2022[17]. - The overall gross margin fell to 27.10%, down by 8.76 percentage points from the previous year[17]. - The company's revenue for 2023 was CNY 16.23 billion, a decrease of 3.30% compared to CNY 16.79 billion in 2022[29]. - Net profit attributable to shareholders for 2023 was CNY 1.94 billion, down 35.64% from CNY 3.01 billion in 2022[29]. - The net cash flow from operating activities was CNY 5.10 billion, a decrease of 7.59% compared to CNY 5.52 billion in 2022[29]. - The company achieved a main business revenue of RMB 16.095 billion in the reporting period, a year-on-year decrease of 3.43%[48]. - The wafer foundry business revenue was RMB 15.360 billion, down 3.99% year-on-year[48]. - The company reported a significant increase in revenue, achieving a total of $1.2 billion for the fiscal year, representing a 15% year-over-year growth[141]. - The company reported a significant increase in revenue, achieving a total of $1.5 billion for the fiscal year, representing a 20% year-over-year growth[146]. Dividend Distribution - The company plans to distribute a cash dividend of HKD 0.165 per share (including tax) to all shareholders, translating to approximately RMB 0.150 per share based on the exchange rate[6]. - The board of directors has approved the profit distribution plan, which is subject to shareholder approval at the annual general meeting[6]. - The cash dividend amount for the year is ¥257,142,007.25, representing 13.28% of the net profit attributable to ordinary shareholders[174]. Research and Development - The company's R&D expenditure as a percentage of revenue rose to 9.11% in 2023, an increase of 1.48 percentage points from 7.63% in 2022[30]. - The company achieved a total R&D investment of approximately ¥1.48 billion in 2023, representing a 15.42% increase from the previous year[66]. - Research and development expenses increased by 35.47% to RMB 1.46 billion, reflecting a focus on innovation[90]. - The company applied for over 672 patents in the year, with a total of 4,427 authorized patents[47]. - The company has a total of 8,926 patents, with 659 new patent applications filed during the reporting period[65]. - The company is focusing on technology innovation and patent layout in key industry areas to strengthen its core competitiveness[71]. Market Strategy and Growth - Hua Hong Semiconductor's strategic focus includes penetrating emerging markets such as communication, new energy, IoT, and automotive electronics[16]. - The company aims to enhance its core competitiveness by focusing on innovative technology and optimizing existing platforms in 2024[19]. - The company is expanding its "8-inch + 12-inch" production platform, enhancing its capabilities in specialty IC and power discrete processes[44]. - The company is committed to high-quality development and aims to contribute to the sustainable growth of the global integrated circuit industry[18]. - The company plans to continue expanding its market presence and investing in new technologies[32]. - The company is expanding its market presence in Southeast Asia, targeting a 25% market share by 2025[141]. - The company is expanding its market presence in Europe, targeting a 10% market share by the end of 2024[146]. Operational Efficiency - The company emphasizes a dual-engine strategy of "specialty IC + Power Discrete" to drive growth[16]. - The launch of the 12-inch production line is expected to significantly support the integrated circuit industry chain in the Yangtze River Delta region[18]. - The company plans to enhance its supply chain efficiency, targeting a 15% reduction in operational costs over the next year[146]. - Operational efficiency improved, with a reduction in production costs by 8% due to new automation technologies[141]. Risks and Challenges - The company faces various risks in its operations, including market competition and supply chain challenges, which could impact future performance[8]. - The company emphasizes the importance of addressing potential risks related to the semiconductor industry, including capacity oversupply and geopolitical factors[8]. - The semiconductor industry is experiencing a slowdown in overall demand, which may lead to risks of revenue decline if the company cannot adapt quickly to market changes[77]. - The company faces risks related to supply chain disruptions due to reliance on specific raw materials and key components, particularly from suppliers in geopolitically unstable regions[77]. - The company’s main business gross margin may fluctuate due to potential decreases in product prices or increases in unit costs amid industry downturns and rising raw material prices[78]. Governance and Management - The company has a diverse board with a mix of executive and non-executive directors, including independent directors[138]. - The company’s governance structure includes a mix of executive and independent directors to ensure balanced decision-making[138]. - The company is committed to maintaining a diverse and experienced leadership team, with several members having served since 2012[139]. - The company’s board is set to be re-elected at the upcoming shareholder meeting in 2024, ensuring continuity in governance[138]. Environmental and Social Responsibility - The company invested 111.96 million yuan in environmental protection during the reporting period[189]. - The company received a bronze medal from EcoVadis for its corporate social responsibility assessment, covering labor, environmental management, business ethics, and sustainable procurement[188]. - The company has established a robust internal control system, with no significant deficiencies reported in 2023[182]. - The company has completed environmental impact assessments for all key pollutant discharge projects and obtained necessary environmental protection permits[195]. - The company has not faced any administrative penalties due to environmental issues during the reporting period[200]. - All operational plants have passed ISO 14001 environmental management system certification[199].

华虹半导体有限公司 | A 股代码：688347 | A 股简称：华虹公司 | 公告编号：2024-011 | | --- | --- | --- | | 港股代码：01347 | 港股简称：华虹半导体 | | 关于委任独立非执行董事、委任非执行董事、独立非 执行董事辞任及调整董事会专门委员会成员的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 华虹半导体有限公司（以下简称"本公司"或"公司"）董事会谨此宣布，以下 变动自二零二四年三月二十八日起生效： 封松林先生（以下简称"封先生"）获委任为本公司董事会独立非执行董事、 董事会审核委员会成员、董事会提名委员会成员及董事会薪酬委员会成员。熊承 艳女士（以下简称"熊女士"）获委任为本公司董事会非执行董事及董事会审核委 员会成员。叶龙蜚先生（以下简称"叶先生"）希望退休并将更多时间投入家庭和 其他个人事务而辞任本公司独立非执行董事职务及董事会专门委员会相应职务。 叶峻先生获调任为本公司董事会薪酬委员会成员，不再担任公司董事会审核委员 会成员。现将有关情况公告如下： 一、 ...