证券日报网讯1月12日，福斯特（603806）在互动平台回答投资者提问时表示，杭州福斯特应用材料股 份有限公司是公司的全称，PCB领域的业务是由公司的控股子公司杭州福斯特电子材料有限公司为主体 开展的，目前在PCB领域公司有感光干膜、柔性覆铜板、感光覆盖膜等产品。 ...

Group 1 - The company does not produce AI substrates but offers photosensitive dry film products used for AI carrier board graphic etching, with limited sales to downstream PCB clients [2] - The company confirmed that it has not yet achieved mass production of AI substrates and is still in the customer verification phase [2] - The company is involved in the AI application sector through its products, although the extent of involvement is currently minimal [2]

Group 1 - The core viewpoint of the article highlights the potential of perovskite technology in complex environments like space, and the company's involvement in this field through product offerings [2] - The company has developed products such as POE films for encapsulation and butyl adhesives for edge sealing, which are applicable in perovskite and other thin-film technologies [2]

每经AI快讯，有投资者在投资者互动平台提问：请问杭州福斯特应用材料有限公司是贵公司子公司 吗？目前在先进封装，PCB材料方面主要有哪些产品？ 福斯特（603806.SH）1月12日在投资者互动平台表示，杭州福斯特应用材料股份有限公司是公司的全 称，PCB领域的业务是由公司的控股子公司杭州福斯特电子材料有限公司为主体开展的，目前在PCB领 域公司有感光干膜，柔性覆铜板，感光覆盖膜等产品。 （文章来源：每日经济新闻） ...

Core Viewpoint - Foster (603806.SH) has announced its capability to provide POE films suitable for encapsulation of perovskite and other thin-film technologies, as well as butyl adhesives for edge sealing, indicating its application in client projects [1] Group 1 - The company offers products such as POE films and butyl adhesives [1] - These products are applicable in the encapsulation of perovskite and thin-film components [1] - The announcement highlights the company's engagement with clients in relevant applications [1]

Group 1 - The company Foster (603806.SH) has indicated that it offers products such as POE films suitable for packaging perovskite and other thin-film technologies, as well as butyl adhesives for edge sealing, which are being applied in client projects [1]

Group 1 - The core viewpoint of the article is that Foster (603806.SH) does not manufacture AI substrates but offers photosensitive dry film products used for graphic etching of AI carrier boards, with limited sales to downstream PCB clients [1] Group 2 - The company has clarified its product offerings in relation to AI technology, emphasizing its role in the supply chain rather than direct production of AI substrates [1] - The interaction indicates a focus on niche applications within the PCB industry, particularly in the context of AI-related products [1] - The mention of limited sales suggests a potential area for growth or further development in the company's product strategy [1]

格隆汇1月12日丨福斯特(603806.SH)在互动平台表示，公司不生产AI基板，公司有用于AI载板图形蚀刻 用的感光干膜产品，在下游PCB客户端有少量的销售。 ...

| 发行名称 | 2022年公开发行可转债"福22转债" | | --- | --- | | 募集资金到账时间 | 2022年11月28日 | | 临时补流募集资金金额（万元） | 不超过100,000万元 | | 补流期限 | 2025-3-20至2026-3-19 | 二、归还募集资金的相关情况 | 证券代码：603806 | 证券简称：福斯特 | | | 公告编号：2026-003 | | --- | --- | --- | --- | --- | | 转债代码：113661 | 转债简称：福 | 22 | 转债 | | 杭州福斯特应用材料股份有限公司 关于归还临时补充流动资金的募集资金的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 截至 2026 年 1 月 12 日，公司已累计归还临时补充流动资金的闲置募 集资金人民币 20,000 万元。 一、募集资金临时补充流动资金情况 杭州福斯特应用材料股份有限公司（以下简称"公司"）于2025年3月20日 召开第六届董事会第五次会议，审议通过了《关于归 ...

每经AI快讯，1月12日，福斯特公告称，2025年3月20日，公司同意将"福22转债"不超10亿元暂时闲置募 集资金用于补充流动资金，使用期限至2026年3月19日。2026年1月12日，公司提前归还1000万元至募集 资金专户。截至2026年1月12日，公司累计归还2亿元，尚未归还的募集资金为6.75亿元，公司将在到期 日前归还并履行披露义务。 （文章来源：每日经济新闻） ...