Group 1 - The National Integrated Circuit Industry Investment Fund's third phase has initiated its first project by investing up to 450 million RMB in the registered capital of Tuojing Jianke, which is a subsidiary of Tuojing Technology [1][5] - Tuojing Technology plans to raise up to 4.6 billion RMB through a private placement to enhance its main business [3][12] - The investment by Guotou Jixin will account for approximately 12.71% of Tuojing Jianke's registered capital after the capital increase [1][5] Group 2 - Tuojing Jianke focuses on advanced bonding equipment for three-dimensional integration, including hybrid bonding and fusion bonding devices [8] - The company has launched several products, including wafer-to-wafer hybrid bonding equipment and precision measurement devices, which are already being shipped to clients in advanced storage and logic sectors [8][10] - The market for hybrid bonding equipment is expected to grow significantly, with projections indicating a market size increase from 46.1 million USD in 2024 to over 150 million USD by 2027 [10] Group 3 - Tuojing Technology's financial data shows projected revenues of 97.3 million RMB and a net loss of 2.1 million RMB for 2024 [11] - The company aims to use the funds raised from the private placement for the construction of a high-end semiconductor equipment industrialization base and a cutting-edge technology research center [12][13] - The global investment in 300mm wafer fab equipment is expected to grow significantly, with China leading the investment scale [12][14]

Core Viewpoint - The company plans to raise up to 4.6 billion yuan through a private placement to invest in high-end semiconductor equipment industrialization and advanced technology R&D projects, as well as to supplement working capital [1][2]. Group 1: Investment and Project Details - The company intends to invest 1.5 billion yuan in the high-end semiconductor equipment industrialization base, which is part of a project initially funded with 268 million yuan from its IPO [1]. - The new industrialization base will be located in Shenyang, Liaoning Province, and will include clean rooms, automated warehouses, and testing laboratories, incorporating advanced production technologies to create a scalable, intelligent, and digitalized facility [1][2]. Group 2: Business Growth and Market Demand - The company has experienced rapid growth in business scale due to strong downstream market demand, with revenue figures of 1.706 billion yuan in 2022, 2.705 billion yuan in 2023, and a projected 4.103 billion yuan in 2024, resulting in a compound annual growth rate of 55.08% [2]. - The current production capacity is expected to be insufficient to meet future customer orders, prompting the need for increased capacity through the new projects [2]. Group 3: Technological Advancements and Industry Impact - The project will focus on hardware innovation, control systems, software development, and high-performance film process development to enhance the R&D and optimization of new high-end film deposition equipment [3]. - This initiative aims to support the overall domestic transformation of the semiconductor industry chain and improve the security and autonomy of the domestic semiconductor supply chain [3].

Core Viewpoint -拓荆科技 is seeking to enhance its subsidiary,拓荆键科, through a capital increase involving multiple external investors, including国投集新, which will become the second-largest shareholder post-investment [1][3]. Group 1: Investment and Financial Details - The capital increase aims to support the rapid development of拓荆键科 in the three-dimensional integration equipment sector [2][3]. - The total investment from six entities in this capital increase is structured, with拓荆科技 and国投集新 each contributing up to 450 million yuan, while employee stockholding platforms and other investors contribute smaller amounts [2][3]. - The pre-investment valuation of拓荆键科 is set at 2.5 billion yuan, reflecting a significant increase in value [3]. Group 2: Business Focus and Market Trends -拓荆科技 operates in the high-end semiconductor equipment sector, focusing on the research and production of three-dimensional integration equipment [2][4]. - The company is responding to the shift towards new architectural designs and chip stacking methods as the semiconductor industry approaches physical limits [2][5]. - The demand for high-end semiconductor equipment is expected to grow due to increased capital expenditures and capacity expansions in wafer fabrication plants driven by emerging fields like artificial intelligence and high-performance computing [5][6]. Group 3: Expansion Plans -拓荆科技 plans to invest 1.768 billion yuan in a high-end semiconductor equipment industrialization base to significantly enhance production capacity [5]. - An additional 2 billion yuan is allocated for a cutting-edge technology research and development center to optimize existing thin film deposition equipment [5][6]. - The company acknowledges the current limitations in domestic technology and aims to bridge the gap with international standards through these investments [5][6].

Group 1: Company Announcements - Tianpu Co., Ltd. will hold an investor briefing on September 16, 2025, to discuss the transfer of control [2] - Dongcai Technology's high-speed electronic resin products have been supplied to major server systems including Nvidia and Huawei, benefiting from the growth in the high-end server industry [3] - Tuojing Technology plans to raise no more than 4.6 billion yuan through a private placement to fund the construction of a high-end semiconductor equipment industrialization base [4] - Zhongchao Holdings signed a strategic cooperation agreement with Hefei Intelligent Robot Research Institute to collaborate on technology and application in intelligent robotics [5] - Demingli intends to adjust the investment amounts for its projects related to PCIe SSD storage control chips and embedded storage control chips, increasing the total investment for the PCIe project from 499 million yuan to 743 million yuan [6] Group 2: Market Performance and Contracts - Baiyun Airport reported a 4.33% year-on-year increase in passenger throughput for August [9] - China Construction's new contract amount from January to August increased by 1% year-on-year [9] - China Merchants Port handled a total of 18.312 million TEUs in August, reflecting a 5.6% year-on-year growth [9] - Huadong Technology's shareholders plan to transfer 4% of the company's shares through a pricing inquiry [9] Group 3: Shareholding Changes - Yujing Technology's controlling shareholder and actual controller reduced their holdings by 868,821 shares, decreasing their total shareholding from 16.70% to 15.73% [8] - The acquisition offer for Shangwei New Materials has not yet become effective, with ongoing compliance confirmation and share transfer procedures [7]

Core Viewpoint - The company plans to raise no more than 4.6 billion yuan through a private placement to fund the construction of a high-end semiconductor equipment industrialization base, a cutting-edge technology research and development center, and to supplement working capital [1][5]. Group 1: High-End Semiconductor Equipment Industrialization Base - The high-end semiconductor equipment industrialization base project will be located in Shenyang, Liaoning Province, and aims to create a large-scale, intelligent, and digitalized production facility [1][2]. - The total planned investment for this project has increased from 1.1 billion yuan to 1.768 billion yuan, with 1.5 billion yuan allocated from the new fundraising [1][2]. - The project has already secured land use rights and necessary permits, and a general construction contract has been signed [1]. Group 2: Revenue Growth and Market Demand - The company has experienced rapid growth in business scale, with revenues of 1.706 billion yuan, 2.705 billion yuan, and 4.103 billion yuan for the years 2022, 2023, and 2024, respectively, reflecting a compound annual growth rate of 55.08% [2]. - The current production capacity is expected to be insufficient to meet future customer orders due to increasing market demand and ongoing advancements in chip technology [2]. Group 3: Cutting-Edge Technology R&D Center - The cutting-edge technology R&D center will focus on developing advanced thin film deposition equipment, including PECVD, ALD, and trench filling CVD technologies [3][4]. - The project aims to achieve breakthroughs in core technologies and develop products with independent intellectual property rights, enhancing the company's competitive edge in the market [3][4]. Group 4: Working Capital Supplement - The company plans to use 1.1 billion yuan of the raised funds to supplement working capital, addressing the capital-intensive nature of the industry [5]. - The rapid growth in business scale has led to increased financial demands for raw material procurement, personnel salaries, and R&D expenditures, necessitating additional working capital to support future expansion [5].

证券日报网讯 9月12日晚间，拓荆科技发布公告称，同意提名袁训先生和张昊玳女士为公司第二届董事 会非独立董事候选人。 （文章来源：证券日报） ...

Group 1 - The company,拓荆科技, plans to issue shares to specific investors, raising a total of no more than 4.6 billion yuan, including the principal amount [1] - The net proceeds from the fundraising, after deducting issuance costs, are intended for investment in the construction of a high-end semiconductor equipment industrialization base, a cutting-edge technology research and development center, and to supplement working capital [1]

二、监事会会议审议情况 经投票表决，会议审议通过了全部议案，决议如下： （一）审议通过《关于公司符合向特定对象发行 A 股股票条件的议案》 证券代码：688072 证券简称：拓荆科技 公告编号：2025-054 拓荆科技股份有限公司 第二届监事会第十七次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、监事会会议召开情况 拓荆科技股份有限公司（以下简称"公司"）第二届监事会第十七次会议于 2025 年 9 月 12 日在公司会议室以现场结合通讯方式召开，公司于 2025 年 8 月 26 日以电子邮件发出审议议案十一及议案十二的会议通知，并于 2025 年 9 月 4 日发出调整会议的通知，增加议案一至议案十。本次会议应出席监事 3 人，实际 出席监事 3 人，本次会议由公司监事会主席季拓先生主持。本次会议的召集、召 开程序和方式符合《中华人民共和国公司法》（以下简称"《公司法》"）等法律 法规以及《拓荆科技股份有限公司章程》（以下简称"《公司章程》"）的有关规 定，会议决议合法、有效。 监事会认为：根据《 ...

证券代码：688072 证券简称：拓荆科技 拓荆科技股份有限公司 （辽宁省沈阳市浑南区全运路 109-3 号（109-3 号）14 层） 2025 年度向特定对象发行 A 股股票预案 二〇二五年九月 拓荆科技股份有限公司 2025年度向特定对象发行A股股票预案 公司声明 1、公司及董事会全体成员保证本预案内容真实、准确、完整，并确认不存 在虚假记载、误导性陈述或重大遗漏。 2、本预案按照《上市公司证券发行注册管理办法》等法规及规范性文件的 要求编制。 3、本次向特定对象发行股票完成后，公司经营与收益的变化由公司自行负 责；因本次向特定对象发行股票引致的投资风险，由投资者自行负责。 4、本预案是公司董事会对本次向特定对象发行股票的说明，任何与之相反 的声明均属不实陈述。 5、投资者如有任何疑问，应咨询自己的股票经纪人、律师、专业会计师或 其他专业顾问。 6、本预案所述事项并不代表审批机关对于本次向特定对象发行股票相关事 项的实质性判断、确认、批准或核准，本预案所述本次向特定对象发行股票相 关事项的生效和完成尚待公司股东大会审议通过、上交所审核通过并经中国证 监会作出予以注册决定。 1 拓荆科技股份有限公司 20 ...

拓荆科技股份有限公司（以下简称"公司"）于 2025 年 9 月 12 日召开的第 二届董事会第十八次会议及第二届监事会第十七次会议审议通过了公司 2025 年 度向特定对象发行 A 股股票（以下简称"本次发行"）的相关议案。 公司《2025 年度向特定对象发行 A 股股票预案》（以下简称"预案"）及相 关公告已于 2025 年 9 月 13 日在上海证券交易所网站（www.sse.com.cn）披露， 敬请广大投资者注意查阅。 本次发行预案及相关文件披露事项不代表审批、注册部门对于本次发行相关 事项的实质性判断、确认或批准，预案所述公司本次发行相关事项尚需公司股东 大会审议通过、上海证券交易所审核通过及获得中国证券监督管理委员会作出予 以注册决定后方可实施。公司将根据本次发行的进展情况，严格按照有关法律法 规及时履行相应的审议程序以及信息披露义务，敬请广大投资者注意投资风险。 特此公告。 拓荆科技股份有限公司董事会 证券代码：688072 证券简称：拓荆科技 公告编号：2025-046 拓荆科技股份有限公司 关于 2025 年度向特定对象发行 A 股股票预案 披露的提示性公告 本公司董事会及全体董事保证本公 ...