证券代码：688082 证券简称：盛美上海 公告编号：2025-068 盛美半导体设备（上海）股份有限公司 关于 2024 年度向特定对象发行 A 股股票 发行结果暨股本变动公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 预计上市时间：盛美半导体设备（上海）股份有限公司（以下简称"公 司"、"盛美上海"或"发行人"）本次发行新增股份38,601,326股已于2025年9 月26日在中国证券登记结算有限责任公司上海分公司办理完毕股份登记手续。本 次发行新增股份为有限售条件流通股，将于限售期届满后的次一交易日起在上海 证券交易所上市流通交易，如遇法定节假日或休息日，则顺延至其后的第一个交 易日。 本次发行完成后，发行对象认购的股份自发行结束之日起六个月内不得转让。 法律法规、规范性文件对限售期另有规定的，依其规定。发行对象基于本次交易 所取得的公司向特定对象发行的股票，因公司分配股票股利、资本公积转增股本 等情形所衍生取得的股份亦应遵守上述股份锁定安排。发行对象因本次交易取得 的公司股份在限售期届满后减持 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-069 盛美半导体设备（上海）股份有限公司 关于在手订单情况的自愿性披露公告 3、以上在手订单数据源自公司内部统计，未经审计，不能以此直接推算公 司全年营业收入、净利润等财务数据，仅供投资者及时了解公司日常经营概况。 具体准确的财务数据以公司正式披露的定期报告为准，敬请广大投资者注意投资 风险。 特此公告。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）从事对集成电 路制造与先进晶圆级封装制造行业至关重要的单晶圆及槽式湿法清洗设备、电镀 设备、无应力抛光设备、立式炉管设备、前道涂胶显影设备和等离子体增强化学 气相沉积设备等的研发、制造和销售。2025年以来，中国半导体行业设备需求持 续旺盛，公司凭借技术优势、产品成熟度和市场认可度，不断深耕现有市场、拓 展新市场，收入稳步增长。为让投资者更好地了解公司经营情况，现将截至2025 年9月29日的在手合同订单情况公告如下： 一、截至2025年9月29日在手订单情况 截至2025年9月29日，公司在手订单总金额为907,153.57万元，与上年同期 已自愿性披露的在手订单数据相比，在手订单总金额 ...

Core Viewpoint - Shengmei Shanghai (688082.SH) reported a total order backlog of 9.072 billion yuan as of September 29, 2025, representing a year-on-year increase of 34.10% [1] Group 1 - The total order backlog includes equipment orders that have been delivered to customers but not yet recognized as revenue, as well as equipment orders that will be delivered in the future [1]

Core Insights - The company announced that as of September 29, 2025, its total backlog of orders amounts to 9.072 billion yuan, representing a 34.10% increase compared to the same period last year [1] Summary by Categories Order Backlog - The total backlog includes equipment orders that have been delivered to customers but have not yet received customer confirmation of revenue, as well as equipment orders that will be delivered in the future [1] - The backlog data is sourced from the company's internal statistics and is unaudited, intended to provide investors with timely insights into the company's operational status [1] Financial Impact - The backlog is subject to specific execution and implementation progress, which introduces uncertainty regarding its impact on the company's current and future financial performance [1] - Accurate financial data will be disclosed in the company's formal periodic reports [1]

Core Viewpoint - The largest scale of competitive private placement in the semiconductor equipment industry in the past three years has been completed, with several public funds participating in the allocation [2][12]. Group 1: Fundraising Details - Semiconductor equipment leader, Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., has completed a private placement fundraising of nearly 4.5 billion yuan [2][3]. - The total number of shares issued in this private placement is 38.6013 million shares, with an issue price of 116.11 yuan per share, raising a total of 4.482 billion yuan [3][8]. - The funds raised will enhance the company's R&D capabilities in the semiconductor equipment field [2][8]. Group 2: Participating Institutions - Five public funds participated in the private placement, including E Fund, Xingsheng Global, and others, with E Fund acquiring 144 million yuan worth of shares [3][7]. - Shanghai Pudong New Industry Investment Co., Ltd. received the largest allocation of 1.5 billion yuan, followed by Caitong Fund with 544 million yuan [3][4]. Group 3: Company Performance - Shengmei Shanghai reported a revenue of 3.265 billion yuan in the first half of the year, a year-on-year increase of over 35%, with a net profit of nearly 700 million yuan, up approximately 57% [13]. - The company has seen continuous growth in revenue and net profit from 2018 to 2024, with revenue increasing from 550 million yuan to 5.618 billion yuan, and net profit from 93 million yuan to 1.153 billion yuan, with average annual growth rates exceeding 30% [13]. Group 4: Market Context - The semiconductor market is expected to shrink by 8% in 2023 but is projected to grow by 12% to 687.3 billion dollars by 2025 [12]. - The private placement market has seen a surge in interest in technology innovation sectors, with semiconductor industry private placements reaching 19.4 billion yuan in the first seven months of the year, a fivefold increase compared to the previous year [18][19].

Core Viewpoint - The semiconductor equipment industry has seen its largest scale private placement in three years, with multiple public funds participating in the allocation, indicating strong institutional interest in the sector [2][3][10]. Group 1: Fundraising Details - Semiconductor equipment leader, Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., completed a private placement raising approximately 4.482 billion yuan, with a share price of 116.11 yuan per share [5][10]. - A total of 17 institutions participated in the bidding, with all bids being valid and timely, leading to the allocation of 38.6 million shares [5][6]. - The largest allocation was to Shanghai Pudong New Industry Investment Co., Ltd., receiving 1.5 billion yuan, followed by Caitong Fund and Nord Fund with allocations of 544 million yuan and 533 million yuan, respectively [5][6]. Group 2: Use of Proceeds - The raised funds will enhance the company's R&D capabilities in semiconductor equipment, focusing on the construction of R&D and process testing platforms, high-end semiconductor equipment iteration projects, and supplementing working capital [3][11][14]. - Specific projects include the establishment of an integrated circuit equipment R&D and testing platform and further iterative development of existing equipment designs to ensure global competitive differentiation [12][13]. Group 3: Market Context and Performance - The semiconductor market experienced an 8% contraction in 2023, but is projected to grow by 12% to reach 687.3 billion USD by 2025 [15]. - Shengmei Shanghai reported a revenue of 3.265 billion yuan in the first half of the year, a year-on-year increase of over 35%, with net profit nearing 700 million yuan, reflecting strong domestic demand and effective order management [16]. - The company's revenue and net profit have consistently increased over the past several years, with revenue growing from 550 million yuan in 2018 to 5.618 billion yuan in 2024, representing an average annual growth rate exceeding 30% [16]. Group 4: Institutional Participation Trends - Major public funds, including E Fund, have been actively participating in private placements, particularly in high-growth sectors such as AI, robotics, innovative pharmaceuticals, and semiconductors, indicating a trend towards investing in "hard technology" [20][21]. - The private placement market has seen significant activity, with 28 fund companies participating in 218 projects this year, amounting to 5.864 billion yuan, which is five times the total from the previous year [20][21].

Group 1 - Changchuan Technology's stock rose over 7%, reaching a new historical high [1] - Other companies such as Yingji Chip, Shengmei Shanghai, Jingyi Equipment, Zhengfan Technology, and Zhongwei Company also experienced stock increases [1]

盛美上海涨7.29%，报197.9元/股，股价再创新高，总市值突破873.31亿元，成交额达10.90亿元。（AI 生成） ...

博时上证科创板综合价格指数增强A（023891）成立日期2025年4月29日，最新规模8890.3万。成立以来 收益38.12%。 9月29日，盛美上海涨5.17%，截至发稿，报193.99元/股，成交9.75亿元，换手率1.20%，总市值856.06 亿元。 资料显示，盛美半导体设备(上海)股份有限公司位于中国(上海)自由贸易试验区丹桂路999弄5、6、7、8 号全幢，成立日期2005年5月17日，上市日期2021年11月18日，公司主营业务涉及半导体专用设备的研 发、生产和销售。主营业务收入构成为：销售商品99.72%，提供服务0.28%。 从基金十大重仓股角度 数据显示，博时基金旗下1只基金重仓盛美上海。博时上证科创板综合价格指数增强A（023891）二季 度持有股数1.82万股，占基金净值比例为1.65%，位居第九大重仓股。根据测算，今日浮盈赚取约17.36 万元。 博时上证科创板综合价格指数增强A（023891）基金经理为刘玉强。 截至发稿，刘玉强累计任职时间2年242天，现任基金资产总规模20.72亿元，任职期间最佳基金回报 45.28%， 任职期间最差基金回报6.27%。 风险提示：市场有风险， ...

Core Viewpoint - The article emphasizes the critical importance of domestic semiconductor equipment manufacturing in China, particularly in the thin film deposition sector, as a response to U.S. export restrictions and the need for technological independence [2][40]. Group 1: Industry Overview - The thin film deposition equipment market in China reached approximately 47.9 billion yuan in 2023, with a domestic production rate of less than 25%, indicating significant potential for domestic substitution [6][41]. - The semiconductor manufacturing process requires a growing number of thin film layers, with the number of deposition steps increasing from about 40 for 90nm processes to over 100 for 3nm processes [3][63]. - The global semiconductor capital expenditure (Capex) is expected to enter a new growth phase, driven by advanced products and increasing production capacity [48]. Group 2: Technological Developments - The transition from 2D to 3D chip structures has fundamentally changed the technology focus and market structure for thin film deposition equipment [9]. - ALD (Atomic Layer Deposition) technology is becoming essential for advanced nodes and 3D structures due to its atomic-level thickness control and 100% step coverage [19][20]. - PECVD (Plasma-Enhanced Chemical Vapor Deposition) holds the largest market share (33%) among thin film deposition technologies, particularly suited for 28nm and below nodes [13][41]. Group 3: Domestic Manufacturers - Key domestic manufacturers in the thin film deposition equipment sector include North Huachuang, Tuo Jing Technology, and Micro Company, each focusing on different aspects of the market [7][41]. - Domestic manufacturers are adopting a multi-dimensional strategy to break through the monopolistic barriers set by international giants, focusing on specialized equipment like HDPCVD and SACVD [25][70]. Group 4: Investment Insights - Investment focus should be on companies that can achieve a closed loop in specific advanced process windows rather than merely replacing single machines [28]. - Companies with dual capabilities in PEALD and Thermal ALD, particularly those that have validated their technology in specific applications, are expected to hold the highest value [29]. - The importance of core components and subsystems, such as plasma sources and vacuum systems, is highlighted as critical for the success of semiconductor equipment [34][36]. Group 5: Conclusion - The U.S. technology blockade has catalyzed a more resilient and innovative semiconductor equipment industry in China, moving from mere substitution to defining next-generation processes [38]. - The journey of domestic equipment manufacturers reflects a broader trend of understanding and meeting the specific needs of Chinese manufacturing, paving the way for long-term value discovery in the semiconductor sector [38].