| 交易日 | 融资净买入(元) | 融资余额(元) | 占流通市值比 | | --- | --- | --- | --- | | 2025-10-15 | 88.24万 | 13.90亿 | 4.67% | | 2025-10-14 | 1891.26万 | 13.89 Z | 4.68% | | 2025-10-13 | 1833.44万 | 13.70亿 | 4.36% | | 2025-10-10 | 1.12亿 | 13.52亿 | 4.57% | | 2025-10-09 | 5668.28万 | 12.39亿 | 3.81% | 融券方面，当日融券卖出5.26万股，融券偿还15.98万股，融券净买入10.72万股，融券余量270.27万股， 近20个交易日中有13个交易日出现融券净卖出。 | 交易日 | 融券冷卖出(股) | 融券会重(股) | 融券余额(元) | | --- | --- | --- | --- | | 2025-10-15 | -10.72万 | 270.27万 | 1816.20万 | | 2025-10-14 | 18.84万 | 280.99万 | 1882.60万 | ...

Core Points - In September 2025, A-share listed companies in China executed 15 private placements, marking a 200% year-on-year increase, with total funds raised amounting to approximately 144.71 billion yuan, a staggering 10,359% increase year-on-year [1][2] - A total of 33 private placement proposals were disclosed in September 2025, with a proposed fundraising scale of approximately 32.6 billion yuan, reflecting a 37.45% year-on-year increase [1][7] Company Summaries - China Shipbuilding ranked first in actual fundraising, raising 114.77 billion yuan by issuing 3.053 billion shares at a price of 37.59 yuan per share, with funds intended for the merger with China Shipbuilding Industry Corporation [4][5] - ChipLink Integrated raised 5.307 billion yuan through the issuance of approximately 1.314 billion shares at 4.04 yuan per share, with the funds aimed at acquiring 72.33% equity in ChipLink Integrated Circuit Manufacturing (Shaoxing) Co., Ltd. [4][5] - Guosen Securities raised 5.192 billion yuan by issuing shares at 8.25 yuan per share, with the net proceeds intended for the acquisition of 96.08% of Wanhe Securities [4][5] Industry Analysis - The industrial sector led the private placements with 5 instances, raising a total of approximately 122.44 billion yuan, followed by the information technology sector with 4 placements, and the materials sector with 2 placements [6][7] - The information technology and industrial sectors each disclosed 8 private placement proposals in September 2025, with the information technology sector proposing a total fundraising amount exceeding 6.9 billion yuan [14][15]

Core Insights - The collaboration between ChipLink Integrated and Li Auto has reached a significant milestone with the mass production of silicon carbide (SiC) products, marking a new phase in their strategic partnership [2] - The SiC products are expected to enhance the efficiency and range of Li Auto's electric vehicles, particularly in the i-series models [2] - ChipLink Integrated has reported over 1 billion yuan in SiC revenue for 2024, reflecting a year-on-year growth of over 100% [3] Group 1 - The partnership event between ChipLink Integrated and Li Auto signifies the successful implementation of their strategic cooperation in the SiC product domain [2] - The mass production of SiC products is a critical component of Li Auto's pure electric strategy [2] - The SiC products demonstrate superior performance in terms of conduction resistance and application junction temperature compared to mainstream market products [2] Group 2 - ChipLink Integrated has established the first domestic 8-inch SiC MOSFET production line, achieving mass production with industry-leading performance metrics [3] - The company has completed customer validation for China's first integrated DrMOS 55nm BCD chip, with mass production expected in the second half of the year [3] - ChipLink Integrated anticipates that revenue from AI-related projects will reach double digits as several projects, including server power chips and robotic laser radar chips, are expected to ramp up production by 2026 [3]

Core Viewpoint - ChipLink Integrated has shown significant stock price growth this year, with a notable increase in trading activity and institutional holdings, indicating strong market interest and potential for future growth [1][2][3] Group 1: Stock Performance - As of October 13, ChipLink Integrated's stock price increased by 2.10%, reaching 6.82 CNY per share, with a trading volume of 2.90 billion CNY and a turnover rate of 0.98%, resulting in a total market capitalization of 571.70 billion CNY [1] - Year-to-date, the stock price has risen by 32.94%, with a 6.07% increase over the last five trading days, 19.86% over the last 20 days, and 41.79% over the last 60 days [2] Group 2: Company Overview - ChipLink Integrated Circuit Manufacturing Co., Ltd. was established on March 9, 2018, and went public on May 10, 2023. The company specializes in wafer foundry and module packaging testing in the MEMS and power device sectors, providing one-stop system foundry solutions [2] - The revenue composition of ChipLink Integrated includes 85.96% from integrated circuit wafer manufacturing foundry, 9.24% from module packaging, 3.58% from other services, and 1.21% from research and development services [2] Group 3: Financial Performance - For the period from January to June 2025, ChipLink Integrated reported a revenue of 34.95 billion CNY, reflecting a year-on-year growth of 21.38%. However, the net profit attributable to shareholders was -1.70 billion CNY, showing a year-on-year increase of 63.82% in losses [2] Group 4: Institutional Holdings - As of June 30, 2025, the largest shareholder of ChipLink Integrated is the Huaxia SSE Sci-Tech Innovation Board 50 ETF, holding 266 million shares, an increase of 27.72 million shares from the previous period. Other significant shareholders include the E Fund SSE Sci-Tech Innovation Board 50 ETF and the Southern CSI 500 ETF, with new entries from the Guolian An CSI All-Index Semiconductor Products and Equipment ETF [3]

Core Viewpoint - The company, ChipLink Integration, confirmed that its MEMS sensors and power chips can be utilized in humanoid robots for various applications such as voice interaction, posture recognition, motion capture, robotic manipulation, environmental perception, and navigation [1] Product Applications - The company's products include microphones, inertial sensors, pressure sensors, as well as laser radar light sources and scanning mirrors, which are essential for humanoid robot functionalities [1]

【导读】上证指数盘中突破3900点，续创10年新高 | 上证指数 | 深证成指 | | 北证50 | | | --- | --- | --- | --- | --- | | 3908.28 | 13677.13 | | 1525.15 | | | +25.50 +0.66% | +150.62 +1.11% | | -3.48 -0.23% | | | 科创50 | 创业板指 | | 万得全A | | | 1559.66 | 3273.72 | | 6406.42 | | | +64.38 +4.31% | +35.55 +1.10% | | +57.48 +0.91% | | | 沪深300 | 中证500 | | 中证A500 | | | 4688.12 | 7493.63 | | 5679.31 | | | +47.43 +1.02% | +81.26 +1.10% | | +60.60 +1.08% | | | 中证1000 | 深证100 | | 中证红利 | | | 7629.64 | 6024.45 | | 5450.78 | | | +54.67 +0.72% | +65.92 +1.11% ...

Group 1 - The stock price of ChipLink Integrated-U reached a historical high, increasing by 9.42% to 7.20 yuan, with a trading volume of 93.06 million shares and a transaction amount of 643 million yuan, resulting in a turnover rate of 2.10% [2] - The latest total market capitalization of the company in A-shares is 60.36 billion yuan, with a circulating market capitalization of 31.90 billion yuan [2] - The electronic industry, to which ChipLink Integrated-U belongs, has an overall increase of 2.83%, with 387 stocks rising and 4 stocks hitting the daily limit, while 90 stocks declined [2] Group 2 - As of September 30, the latest margin trading balance for ChipLink Integrated-U is 1.19 billion yuan, with a financing balance of 1.18 billion yuan, reflecting a recent increase of 150 million yuan, a 14.56% month-on-month growth [2] - The company's semi-annual report indicates that it achieved an operating income of 3.495 billion yuan in the first half of the year, representing a year-on-year growth of 21.38%, while the net profit was -170 million yuan, showing a year-on-year increase of 63.82% [2] - The basic earnings per share for the company is -0.0200 yuan [2]

证券代码：688469 证券简称：芯联集成 公告编号：2025-051 芯联集成电路制造股份有限公司 关于 2024 年限制性股票激励计划 首次授予部分第一个归属期（第二批次）归属结果公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 本次归属股票数量：158.2338 万股 股票来源：公司从二级市场回购的公司 A 股普通股。 根据中国证监会、上海证券交易所、中国证券登记结算有限责任公司上海分公司 有关业务规则的规定，芯联集成电路制造股份有限公司（以下简称"公司"）于 2025 年 9 月 29 日收到中国证券登记结算有限责任公司出具的《过户登记确认书》，公司 2024 年限制性股票激励计划（以下简称"本激励计划"）首次授予部分第一个归属期 （第二批次）的股份已完成过户。现将有关情况公告如下： 一、本次限制性股票授予已履行的决策程序和信息披露情况 （一）2024 年 4 月 13 日，公司召开第一届董事会第二十一次会议，会议审议通 过了《关于公司<2024 年限制性股票激励计划（草案）>及其摘要的议案》《关于公 司<20 ...

上海市锦天城律师事务所 关于芯联集成电路制造股份有限公司 2025 年第二次临时股东大会之 法律意见书 地址：上海市浦东新区银城中路 501 号上海中心大厦 11/12 层 电话：021-20511000 传真：021-20511999 邮编：200120 案号：01G20231137 致：芯联集成电路制造股份有限公司 敬启者： 上海市锦天城律师事务所（以下简称"本所"）接受芯联集成电路制造股份 有限公司（以下简称"公司"）委托，根据《中华人民共和国公司法》（以下简 称"《公司法》"）《上市公司股东会规则》（以下简称"《股东会规则》"） 等法律、行政法规和其他规范性文件（以下简称"法律、法规"）以及《芯联集 成电路制造股份有限公司章程》（以下简称"《公司章程》"）的有关规定，就 公司召开 2025 年第二次临时股东大会（以下简称"本次股东会"）的有关事宜 出具本法律意见书。 上海市锦天城律师事务所 法律意见书 上海市锦天城律师事务所 关于芯联集成电路制造股份有限公司 2025 年第二次临时股东大会之 法律意见书 本法律意见书仅就本次股东会的召集和召开程序、出席本次股东会人员的资 格、召集人资格、会议表决程序是 ...

证券代码：688469 证券简称：芯联集成 公告编号：2025-052 芯联集成电路制造股份有限公司 2025年第二次临时股东大会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 （二） 股东大会召开的地点：浙江省绍兴市越城区皋埠街道临江路 518 号芯联 集成电路制造股份有限公司会议室 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 1,362 | | --- | --- | | 普通股股东人数 | 1,362 | | 2、出席会议的股东所持有的表决权数量 | 3,321,039,124 | | 普通股股东所持有表决权数量 | 3,321,039,124 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 39.6178 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 39.6178 | （四） 表决方式是否符合《公司法》及公司章程的规定，大会主持情况等。 本次会议由公 ...