之 法律意见书 地址：上海市浦东新区银城中路 501 号上海中心大厦 11、12 层 电话：021-20511000 传真：021-20511999 邮编：200120 上海市锦天城律师事务 所 法律意见书 目 录 上海市锦天城律师事务所 法律意见书 上海市锦天城律师事务所 关于芯联集成电路制造股份有限公司 发行股份及支付现金购买资产暨关联交易实施情况之 法律意见书 案号：01F20233741 致：芯联集成电路制造股份有限公司 上海市锦天城律师事务所（以下简称"本所"）接受芯联集成电路制造股份 有限公司（以下简称"公司""上市公司"或"芯联集成"）的委托，并根据上 市公司与本所签订的《法律服务委托协议》，作为上市公司本次发行股份及支付 现金购买资产暨关联交易事项（以下简称"本次交易"）的特聘专项法律顾问。 本所已于 2024 年 12 月 28 日出具了《上海市锦天城律师事务所关于芯联集 成电路制造股份有限公司发行股份及支付现金购买资产暨关联交易之法律意见 书》（以下简称"《法律意见书》"），于 2025 年 3 月 14 日出具了《上海市锦 天城律师事务所关于芯联集成电路制造股份有限公司发行股份及支付现金 ...

2025 年 7 月 18 日，公司收到中国证券监督管理委员会出具的《关于同意芯 联集成电路制造股份有限公司发行股份购买资产注册的批复》（证监许可〔2025〕 1502 号），中国证监会同意公司本次交易的注册申请。 本次发行股份及支付现金购买资产的定价基准日为上市公司第一届董事会 第二十四次会议决议公告日。经交易各方协商，上市公司确定本次发行股份购买 资产的发行价格为 4.04 元/股。本次向交易对方发行股份数量的具体情况如下： | 序号 | 交易对方 | 股份对价金 额（万元） | 发行数量 （股） | | --- | --- | --- | --- | | 1 | 绍兴滨海新区芯兴股权投资基金合伙企业（有限合伙） | 183,420.00 | 454,009,900 | | 2 | 深圳市远致一号私募股权投资基金合伙企业（有限合 | 73,368.00 | 181,603,960 | | | 伙） | | | | 3 | 厦门辰途华辉创业投资合伙企业（有限合伙） | 56,248.80 | 139,229,702 | | 4 | 厦门辰途华明创业投资基金合伙企业（有限合伙） | 55,026.00 | 1 ...

证券代码：688469 证券简称：芯联集成 上市地：上海证券交易所 芯联集成电路制造股份有限公司 发行股份及支付现金购买资产 暨关联交易 实施情况暨新增股份上市公告书 独立财务顾问 签署日期：二〇二五年九月 特别提示 1、本次发行股份购买资产的新增股份的发行价格为 4.04 元/股。 2、本次发行股份购买资产的新增股份数量为 1,313,601,972 股普通股（A 股）， 本次发行完成后公司股份数量为 8,382,687,172 股。 3、本公司就本次发行股份向中国证券登记结算有限责任公司上海分公司提 交相关登记材料，本次向特定对象发行新股数量为 1,313,601,972 股（其中限售 流通股数量为 1,313,601,972 股），2025 年 9 月 3 日，中国证券登记结算有限责任 公司上海分公司出具了《证券变更登记证明》。 4、本次发行完成后，上市公司股权分布仍满足《公司法》《证券法》及《上 市规则》等法律法规规定的股票上市条件。 1 上市公司声明 本公司及全体董事、监事、高级管理人员保证本报告书内容的真实、准确、 完整，不存在虚假记载、误导性陈述或重大遗漏，并承担个别和连带的法律责任。 中国证监 ...

证券代码：688469 证券简称：芯联集成 公告编号：2025-048 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担相应的法律责任。 重要内容提示 发行数量和价格 股票种类：人民币普通股（A 股） 资产过户情况 发行股票数量：1,313,601,972 股 发行股票价格：4.04 元/股 预计上市时间 本次发行股份购买资产新增股份已于 2025 年 9 月 3 日在中国证券登记 结算有限责任公司上海分公司办理完成登记手续。 本次发行新增股份在其限售期满的次一交易日在上海证券交易所上市 交易（预计上市时间如遇法定节假日或休息日，则顺延至其后的第一个交易 日），限售期自股份发行完成之日起开始计算。 本次交易标的资产的过户手续已办理完毕。 如无特别说明，本公告中涉及有关单位及术语的简称与上市公司同日在 上海证券交易所网站（http://www.sse.com.cn）披露的《芯联集成电路制造股 份有限公司发行股份及支付现金购买资产暨关联交易实施情况暨新增股份 上市公告书》中的释义相同。 1 一、本次发行概况 （一）本次发行履行的相关程序 1、 ...

证券代码：688469 证券简称：芯联集成 上市地：上海证券交易所 芯联集成电路制造股份有限公司 发行股份及支付现金购买资产 实施情况暨新增股份上市公告书 摘要 独立财务顾问 签署日期：二〇二五年九月 特别提示 1、本次发行股份购买资产的新增股份的发行价格为 4.04 元/股。 2、本次发行股份购买资产的新增股份数量为 1,313,601,972 股普通股（A 股）， 本次发行完成后公司股份数量为 8,382,687,172 股。 暨关联交易 3、本公司就本次发行股份向中国证券登记结算有限责任公司上海分公司提 交相关登记材料，本次非公开发行新股数量为 1,313,601,972 股（其中限售流通 股数量为 1,313,601,972 股），2025 年 9 月 3 日，中国证券登记结算有限责任公司 上海分公司出具了《证券变更登记证明》。 4、本次发行完成后，上市公司股权分布仍满足《公司法》《证券法》及《上 市规则》等法律法规规定的股票上市条件。 2 本次交易完成后，本公司经营与收益的变化，由本公司自行负责，由此变化 引致的投资风险，由投资者自行负责。投资者若对本公告书（摘要）存在任何疑 问，应咨询自己的股票经 ...

上海市锦天城律师事务所 关于芯联集成电路制造股份有限公司 发行股份及支付现金购买资产暨关联交易 实施情况 之 法律意见书 地址：上海市浦东新区银城中路 501 号上海中心大厦 11、12 层 电话：021-20511000 传真：021-20511999 邮编：200120 法律意见书 案号：01F20233741 致：芯联集成电路制造股份有限公司 上海市锦天城律师事务所（以下简称"本所"）接受芯联集成电路制造股份 有限公司（以下简称"公司""上市公司"或"芯联集成"）的委托，并根据上 市公司与本所签订的《法律服务委托协议》，作为上市公司本次发行股份及支付 现金购买资产暨关联交易事项（以下简称"本次交易"）的特聘专项法律顾问。 | | | 上海市锦天城律师事务所 法律意见书 上海市锦天城律师事务所 关于芯联集成电路制造股份有限公司 发行股份及支付现金购买资产暨关联交易实施情况之 本所已于 2024 年 12 月 28 日出具了《上海市锦天城律师事务所关于芯联集 成电路制造股份有限公司发行股份及支付现金购买资产暨关联交易之法律意见 书》（以下简称"《法律意见书》"），于 2025 年 3 月 14 日出具了《上 ...

华泰联合证券有限责任公司 关于芯联集成电路制造股份有限公司 发行股份及支付现金购买资产 暨关联交易 实施情况的 独立财务顾问核查意见 独立财务顾问 签署日期：二〇二五年九月 独立财务顾问声明 华泰联合证券有限责任公司（以下简称"华泰联合"、"本独立财务顾问"） 接受芯联集成电路制造股份有限公司（以下简称"芯联集成"、"上市公司"或"公 司"）委托，担任本次发行股份及支付现金购买资产暨关联交易（以下简称"本 次交易"）的独立财务顾问，就该事项向上市公司全体股东提供独立意见，并制 作本核查意见。 本独立财务顾问核查意见是依据《中华人民共和国公司法》《中华人民共和 国证券法》《上市公司重大资产重组管理办法》《上市公司并购重组财务顾问业务 管理办法》《公开发行证券的公司信息披露内容与格式准则第 26 号——上市公司 重大资产重组》《上市公司监管指引第 9 号——上市公司筹划和实施重大资产重 组的监管要求》和《上海证券交易所上市公司重大资产重组审核规则》等法律法 规及文件的规定和要求，以及证券行业公认的业务标准、道德规范，经过审慎调 查，本着诚实信用和勤勉尽责的态度，就本次交易认真履行尽职调查义务，对上 市公司相关的申 ...

Core Insights - The company has achieved mass production of power management chips for AI servers and AI acceleration cards, marking a significant milestone as the first domestic 55nm BCD integrated DrMOS chip has passed customer validation and is entering large-scale production [1] - The company has launched a second-generation high-efficiency power management chip manufacturing platform for data centers, which has already attracted key customer adoption [1] - The company is transitioning from a "single device supplier" to a "foundational infrastructure for the intelligent era" as it deepens its system foundry model involving silicon carbide, analog ICs, and MCUs [2] Business Development - The revenue contribution from AI-related businesses has reached 6% within six months after establishing AI as a new business focus [2] - The AI server power system covers a three-tier power supply structure from PSU to POL, capable of replacing over 50% of the total cost of AI server power [2] - The company anticipates that by 2026, the revenue share from AI-related businesses will exceed double digits, becoming the fourth growth curve after new energy vehicles (47%), industrial control (19%), and consumer electronics (28%) [2] Strategic Goals - The company aims to achieve comprehensive profitability by 2026, driven by three main factors: continuous cost reduction through technology, optimization of production capacity structure, and deepening domestic substitution [3] - In the silicon carbide sector, the company is reducing costs by 30% through 8-inch production compared to 6-inch, and increasing single wafer output by 40% with planar to trench technology, pushing costs closer to 1.5-2 times that of IGBTs [3] - The company plans to expand its 12-inch analog IC production capacity to 40,000 wafers per month based on downstream demand, with a focus on high-margin products to enhance profitability [3]

Core Viewpoint - The semiconductor wafer fabrication capacity is expected to grow from 31.5 million wafers per month in 2024 to 33.7 million wafers per month in 2025, driven by increasing chip demand, particularly from the AI and automotive electronics sectors [1][4] Group 1: Wafer Foundry Overview - Wafer foundry refers to the manufacturing of semiconductor wafers on behalf of integrated circuit design companies without engaging in design itself, playing a crucial role in the semiconductor industry [1] - The wafer foundry industry consists of upstream semiconductor materials, equipment, and design services, midstream wafer processing services, and downstream packaging/testing services, as well as end-use applications in consumer electronics, semiconductors, photovoltaic cells, and industrial electronics [1] Group 2: Manufacturing Processes - Wafer manufacturing processes can be categorized into advanced logic processes and specialty processes, with advanced processes defined as those below 14nm and mature processes as those 28nm and above [2] - The investment required for equipment significantly increases with process node evolution, with specialty processes requiring around $2-3 billion for every 50,000 wafers of capacity, while advanced processes require at least $4 billion [2] Group 3: Industry Advantages and Challenges - The wafer foundry industry currently benefits from a clear trend towards domestic production and sustained market demand [3] - Challenges include geopolitical instability, significant first-mover advantages for leading companies, reliance on key materials, and yield issues [3] Group 4: Market Status - The semiconductor industry is currently in a favorable economic cycle, with global semiconductor sales expected to grow at a compound annual growth rate (CAGR) of 9% from 2025 to 2030, surpassing $1 trillion by 2030 [4] - TSMC dominates the wafer foundry market with a 60% market share, while China is expected to lead in mature processes by 2027, with Taiwan maintaining dominance in advanced processes [4] Group 5: Key Domestic Players - Major domestic players include SMIC, Changhong Semiconductor, Jingxin Integrated Circuit, and Chipone Integrated Circuit, with SMIC being a leading global integrated circuit wafer foundry [5] - Huahong Semiconductor is recognized for its comprehensive specialty process platform, while Jingxin Integrated Circuit leads in the LCD panel driver chip foundry market [5] - Chipone Integrated Circuit focuses on power devices, MEMS, BCD, and MCU technology platforms, with AI being a new growth area [5] Group 6: Technology Development Trends - Global capacity is expanding, with market share concentrating among leading firms, and advanced processes like 3/2nm dominating the high-end market [6] - The collaboration between packaging and process technology is evolving, with 2nm processes expected to utilize GAAFET architecture, driven by increasing HPC demand due to AI advancements [6]

Group 1 - Cambricon expects to achieve an annual revenue of 5 billion to 7 billion yuan in 2025 [3] - Guolian Minsheng plans to establish a 1.22 billion yuan fund in collaboration with Guolian Life, focusing on new productivity and smart technology investments [4] - Chipone is planning to acquire equity in Chipwise Semiconductor Technology and will suspend trading for up to 10 trading days [5] - Dongxin shares will suspend trading for up to 3 trading days due to abnormal stock trading fluctuations [6] - Zhonghuan Hailu is planning a change in company control, leading to a suspension of trading for up to 2 trading days [7] - Jinghe Integrated plans to issue H-shares and list on the Hong Kong Stock Exchange, pending shareholder and regulatory approvals [9] Group 2 - SMIC reported a 35.6% year-on-year increase in net profit for the first half of the year, with revenue of 4.456 billion USD, up 22% [10] - Northern Huachuang achieved a net profit of 3.208 billion yuan in the first half of the year, a 14.97% increase, with revenue of 16.142 billion yuan, up 29.51% [11] - Gree Electric reported a net profit of 14.412 billion yuan, a 1.95% increase, with revenue of 97.325 billion yuan, down 2.46% [12] - Wancheng Group's net profit surged by 50,358% to 472 million yuan, with revenue of 22.583 billion yuan, up 106.89% [13] - ZTE Corporation's net profit decreased by 11.77% to 5.058 billion yuan, with revenue of 71.553 billion yuan, up 14.51% [14] - Longxin Bochuang's net profit increased by 1,121.21% to 168 million yuan, with revenue of 1.2 billion yuan, up 59.54% [15] - SF Holding reported a net profit of 5.738 billion yuan, a 19.37% increase, with revenue of 146.858 billion yuan, up 9.26% [16] - CITIC Securities achieved a net profit of 13.719 billion yuan, a 29.80% increase, with revenue of 33.039 billion yuan, up 20.44% [18] - Liou Co. turned a profit with a net profit of 478 million yuan, compared to a loss in the previous year, with revenue of 9.635 billion yuan, down 9.62% [19] - Guolian Minsheng's net profit skyrocketed by 1,185.19% to 1.127 billion yuan, with revenue of 4.011 billion yuan, up 269.40% [20] - Zhongke Shuguang's net profit increased by 29.39% to 729 million yuan, with revenue of 5.85 billion yuan, up 2.41% [21] - Lingzhi Software's net profit surged by 1,002% to 112 million yuan, with revenue of 516 million yuan, down 3.04% [22] - Huasheng Tiancheng turned a profit with a net profit of 140 million yuan, compared to a loss in the previous year, with revenue of 2.262 billion yuan, up 5.11% [23] - China Galaxy reported a net profit of 6.488 billion yuan, a 47.86% increase, with revenue of 13.747 billion yuan, up 37.71% [24] - Huahong's net profit decreased by 71.95% to 74.315 million yuan, with revenue of 8.018 billion yuan, up 19.09% [25] - XGIMI's net profit increased by 2,062% to 88.662 million yuan, with revenue of 1.626 billion yuan, up 1.63% [26] - Zhongjin Gold reported a net profit of 2.695 billion yuan, a 54.64% increase, with revenue of 35.067 billion yuan, up 22.90% [27] - Zhongwei Company achieved a net profit increase of 37% to 706 million yuan, with revenue of 4.961 billion yuan, up 43.88% [28] Group 3 - Aojie Technology's shareholder Alibaba Network plans to reduce its stake by up to 3% [32] - Hengsheng Energy's actual controller plans to reduce its stake by up to 2% [33] - Jinghua New Materials' controlling shareholder plans to reduce its stake by up to 3.01% [34] - Chunzong Technology's multiple shareholders plan to reduce their stake by up to 2% [35]