Group 1 - Company Xiangrikui is planning to acquire controlling stakes in Xipu Materials and 40% of Beid Pharmaceutical, leading to a stock suspension [3] - Company Nanchin Technology intends to issue convertible bonds to raise no more than 1.933 billion yuan for research and industrialization of power management chips in the smart computing sector [2] - Company ST Pawa has received a notice of investigation from the China Securities Regulatory Commission [4] Group 2 - Company Junshi Biosciences has achieved the primary research endpoint in a Phase III clinical study for its anti-IL-17A monoclonal antibody treatment for moderate to severe plaque psoriasis [4] - Company Gansu Energy's Changle Company has officially put into commercial operation the 5th unit of its 2×1000 MW coal-fired unit expansion project [4] - Company Jidian has received 913 million yuan in renewable energy subsidy funds from the state for August [4]

Company Overview - Nanxin Technology (688484) plans to issue convertible bonds not exceeding 19.33 billion yuan, with a maximum of 19.33 million bonds at a face value of 100 yuan each, for a duration of six years [1] - The net proceeds will be allocated to the development and industrialization of power management chips for intelligent computing, automotive chips, and sensor and control chips for industrial applications, with respective allocations of 4.59 billion yuan, 8.43 billion yuan, and 6.31 billion yuan [1] - The company is a leading domestic designer of analog and embedded chips, focusing on power and battery management [1] Financial Performance - Nanxin Technology's revenue from 2022 to the first half of 2025 was 13.01 billion yuan, 17.8 billion yuan, 25.67 billion yuan, and 14.70 billion yuan respectively [1] - The net profit for the same period was 2.46 billion yuan, 2.61 billion yuan, 3.07 billion yuan, and 1.23 billion yuan, indicating an improvement in operational efficiency and profitability [1] Industry Context - The rapid development of the new energy vehicle industry highlights the urgent need for domestic automotive chip autonomy, with the overall localization rate of automotive chips in China being below 10% [2] - Major international automotive electronics companies dominate the global market due to their extensive technical accumulation and industry experience, while domestic manufacturers are still in a catch-up phase [2] Market Opportunities - The increasing penetration of new energy vehicles and the development of vehicle intelligence are expected to expand the automotive chip market [3] - The average number of sensors required for L3 autonomous driving is eight, while L5 requires 20, with traditional fuel vehicles needing 600-700 chips and electric vehicles requiring 1600 chips [3] - Nanxin Technology's automotive chip project, with an investment of over 8 billion yuan and a three-year construction period, aims to develop a complete ecosystem of automotive chips [3] R&D Capabilities - Nanxin Technology has a strong foundation in the automotive chip sector, with 756 R&D personnel, accounting for 68.35% of total employees, and over 150 dedicated to automotive applications [4] - The company possesses technologies such as Smart High Side Driver and ASIL-D power management chips, along with some automotive-grade IP to support project development [4] - Nanxin Technology employs a combined FOT and COT production model, demonstrating comprehensive self-research capabilities from process device development to SPICE models and PDK [4]

每经AI快讯，南芯科技（SH 688484，收盘价：46元）9月7日晚间发布公告称，公司第二届第九次董事 会会议于2025年9月5日在公司会议室以现场结合通讯方式召开。会议审议了《关于提请召开公司2025年 第三次临时股东会的议案》等文件。 2024年1至12月份，南芯科技的营业收入构成为：集成电路行业占比99.84%，其他业务占比0.16%。 截至发稿，南芯科技市值为196亿元。 （记者 曾健辉） 每经头条（nbdtoutiao）——疯狂囤黄金！全球央行黄金储备反超美债，系29年来首次！美元"霸权"落 幕？巨头：美国国债或迎"最糟糕十年" ...

Group 1 - The company plans to issue up to 19.33 million convertible bonds, raising a total of up to RMB 1.933 billion [1] - The initial conversion price will not be lower than the average trading price of the company's A-shares over the previous twenty trading days and the last trading day before the announcement [1] - The net proceeds from the fundraising will be used for the development and industrialization of power management chips in the intelligent computing field, automotive chips, and sensor and control chips for industrial applications [1]

Core Viewpoint - Shanghai Nanchip Semiconductor Technology Co., Ltd. plans to issue convertible bonds to unspecified investors, with a total fundraising amount not exceeding RMB 193,338.11 million, aimed at financing projects in the field of intelligent power management chips and industrial application sensors [13][19]. Board Meeting Details - The second board meeting of the company was held on September 5, 2025, with all 9 directors present, and the meeting was conducted in accordance with relevant laws and regulations [1][2]. Approval of Convertible Bonds - The board approved the proposal for the company to issue convertible bonds, confirming that the company meets the necessary conditions for such issuance under Chinese law [2][3]. - The proposed issuance includes up to 19,333,811 convertible bonds, each with a face value of RMB 100.00 [2][3]. Fundraising and Use of Proceeds - The total amount to be raised from the issuance of convertible bonds is capped at RMB 193,338.11 million, which will be allocated to specific projects in the semiconductor sector [3][13]. - The company will utilize its own or self-raised funds for project implementation before the proceeds from the bond issuance are available [13]. Bond Terms and Conditions - The bonds will have a maturity period of six years and will pay interest annually [4][5]. - The initial conversion price will be determined based on the average trading price of the company's A-shares over the 20 trading days prior to the announcement [5][6]. - The company has the right to adjust the conversion price under certain conditions, such as stock dividends or capital increases [6][7]. Rights and Obligations of Bondholders - Bondholders will have the right to convert their bonds into shares and participate in profit distributions on an equal basis with existing shareholders [11][12]. - The company will not provide guarantees for the bonds, and a credit rating agency will be engaged to assess the bonds [15][22]. Shareholder Meeting - A temporary shareholder meeting is scheduled for September 26, 2025, to review the bond issuance and related matters [24].

证券代码：688484 证券简称：南芯科技 公告编号：2025-060 上海南芯半导体科技股份有限公司 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： （三） 投票方式：本次股东会所采用的表决方式是现场投票和网络投票相结合 的方式 至2025 年 9 月 26 日 采用上海证券交易所网络投票系统，通过交易系统投票平台的投票时间为股 东大会召开当日的交易时间段，即 9:15-9:25,9:30-11:30，13:00-15:00；通过互联 网投票平台的投票时间为股东大会召开当日的 9:15-15:00。 （六） 融资融券、转融通、约定购回业务账户和沪股通投资者的投票程序 涉及融资融券、转融通业务、约定购回业务相关账户以及沪股通投资者的投 票，应按照《上海证券交易所科创板上市公司自律监管指引第 1 号—规范运作》 等有关规定执行。 （七） 涉及公开征集股东投票权 本次股东会审议议案及投票股东类型 投票股东类型 序号 议案名称 A 股股东 非累积投票议案 债券条件的议案》 方案的议案》 预案的议案》 方案论证分析报 ...

Core Viewpoint - Shanghai Nanchip Semiconductor Technology Co., Ltd. plans to issue convertible bonds to unspecified investors, with a total fundraising amount not exceeding RMB 193,338.11 million, aimed at financing projects in the field of intelligent power management chips and industrial application sensors [2][14][15]. Meeting Details - The second supervisory board's ninth meeting was held on September 5, 2025, with all three supervisors present, confirming the legality and validity of the meeting [1][2]. Resolutions Passed - The supervisory board approved the proposal for the company to issue convertible bonds, confirming compliance with relevant laws and regulations [2][17]. - The proposal for the issuance of convertible bonds was passed, with a maximum issuance of 19,333,811 bonds, each with a face value of RMB 100.00 [2][3]. - The bonds will have a duration of six years, with interest paid annually [3][4]. Fund Utilization - The raised funds will be allocated to the development and industrialization of intelligent power management chips and industrial application sensors, with the total amount earmarked for these projects being RMB 193,338.11 million [14][15]. Rights and Obligations of Bondholders - Bondholders will have the right to convert their bonds into shares and participate in profit distribution on par with existing shareholders [12][13]. - The company will not provide guarantees for the convertible bonds [16]. Conditions for Redemption and Sale - The company has outlined conditions under which it may redeem the bonds or allow bondholders to sell them back, including scenarios where the stock price remains below certain thresholds [9][10][11]. Future Planning - The company has proposed a three-year shareholder return plan for 2025-2027 to enhance transparency in profit distribution and cash dividends [22].

Group 1 - The report is a verification of the use of previously raised funds by Shanghai Nanchip Semiconductor Technology Co., Ltd. as of June 30, 2025 [1] - The report is intended solely for the purpose of applying for securities issuance and should not be used for any other purpose [1] - The board of directors is responsible for ensuring the report's content is true, accurate, and complete, without any false records or misleading statements [1] Group 2 - The responsibility of the registered accountants is to independently provide a verification conclusion on the report prepared by the board of directors [2] - The verification work was conducted in accordance with the relevant standards, ensuring that necessary procedures were implemented to obtain reasonable assurance regarding the absence of material misstatements [2] - The conclusion states that the attached report fairly reflects the use of previously raised funds in all material aspects according to the applicable regulatory guidelines [2]

Core Viewpoint - The company has established a three-year shareholder dividend return plan for 2025-2027 to ensure a scientific, sustainable, and stable dividend decision-making and supervision mechanism, aiming to actively return to shareholders and promote long-term and rational investment concepts [1] Group 1: Principles of the Plan - The board of directors has formulated the plan based on the company's articles of association, current operational realities, and project investment funding needs, balancing shareholder returns with long-term development [2] Group 2: Considerations for the Plan - The plan considers industry characteristics, development stages, strategic goals, funding costs, external financing environments, operational models, funding needs, future profit scales, cash flow conditions, and financing plans [2] Group 3: Dividend Distribution Methods - The company will distribute dividends through cash, stock, or a combination of both, prioritizing cash dividends when conditions allow [3] - Cash dividends will be implemented if the distributable profit is positive, cash flow is sufficient, and there are no significant capital expenditures [3] Group 4: Conditions for Cash and Stock Dividends - The company aims for a minimum cash dividend of 10% of the distributable profit each year, with higher percentages based on the company's development stage and capital expenditure needs [3] - In mature stages without significant expenditures, cash dividends should be at least 80% of the profit distribution [3] Group 5: Distribution Timing and Decision Mechanism - The company plans to conduct cash dividends annually, with the possibility of mid-term cash dividends based on profitability and cash flow [4] - The board will propose dividend plans for shareholder approval, ensuring independent directors can voice concerns if they believe the plan may harm shareholder interests [4][5] Group 6: Shareholder Communication and Approval - The company will actively communicate with shareholders, especially minority shareholders, to gather opinions before the annual meeting [5] - Any adjustments to the dividend policy must meet the conditions set in the articles of association and require a two-thirds majority approval from shareholders [5][6] Group 7: Information Disclosure - The company will disclose detailed information about the dividend distribution plan and cash dividend policy in regular reports, ensuring transparency and compliance with regulations [6] Group 8: Other Provisions - Any matters not covered in the plan will be executed according to national laws and the company's articles of association, with the board responsible for interpretation [7]

Core Business - The company is a leading domestic designer of analog and embedded chips, focusing on research, design, and sales of power and battery management solutions, providing high-performance and cost-effective solutions for clients [1][2] - The product portfolio includes mobile device power management chips, smart energy management chips, automotive electronics chips, and microcontrollers (MCUs), catering to consumer electronics and industrial applications [2][3] Fundraising and Investment Plans - The company plans to raise up to 1,933.38 million yuan through the issuance of convertible bonds, with the net proceeds allocated to specific projects [3][4] - The total investment for the smart power management chip project is 459.24 million yuan, aimed at developing power management products for high-current applications [5][6] Smart Power Management Chip Project - The project will address technical challenges in high-current scenarios, developing multi-phase controllers and high-current power management integrated circuits (PMICs) for CPUs and GPUs [5][6] - The project aligns with market trends in AI and high-performance computing, aiming to enhance the company's competitive position and profitability [6][10] Automotive Chip Development Project - The automotive chip project has a total investment of 843.44 million yuan, focusing on developing various chips for vehicle body systems, cockpit systems, and intelligent driving systems [17][18] - The project aims to increase the localization rate of automotive chips, addressing supply chain security and enhancing the company's market position in the automotive sector [18][19] Industrial Sensor and Control Chip Project - The industrial application project has a total investment of 630.80 million yuan, focusing on developing optical sensors, inertial sensors, and high-precision digital controllers [26][28] - The project aims to improve the localization rate of sensor chips and enhance the company's technological capabilities in the sensor market [27][28]