Company Overview - The company operates in the electronics industry and is primarily engaged in semiconductor packaging [1] - The company's total market capitalization is 30.2 billion yuan, with a total of 1.518 billion shares outstanding [1] - The company's net asset value per share is 9.42 yuan, and its asset-liability ratio is 58.2% [1] Financial Performance - In H1 2024, the company achieved revenue of 11.08 billion yuan, a YoY increase of 11.83% [4] - Net profit attributable to the parent company reached 323 million yuan, a YoY surge of 271.91% [4] - Gross margin improved to 14.16%, up 3.74 percentage points YoY, while operating expenses decreased to 10.45%, down 3.98 percentage points YoY [8] Business Highlights - The company benefited from the recovery in computing and consumer electronics markets, with traditional frame products maintaining stable revenue [5] - Emerging product lines such as RF modules, communication SOC chips, memory, display drivers, and FC products showed strong growth momentum, exceeding 50% growth rates [5] - The company's advanced packaging business grew steadily, leveraging its long-term cooperation with industry leaders like AMD [6] Future Outlook - The company is expected to achieve revenue of 25.666 billion yuan in 2024, with a YoY growth of 15.3% [5] - Net profit is projected to reach 903 million yuan in 2024, representing a YoY increase of 432.9% [5] - The company's EPS is forecasted to be 0.59 yuan in 2024, with a P/E ratio of 33.4x [5] Investment Rating - The report maintains a "Recommend" rating for the company, citing its leading position in domestic semiconductor packaging and improving profitability [8] - The company's traditional packaging business is recovering, while its advanced packaging capabilities are enhancing, supported by strong customer relationships [8]

Investment Rating - The report maintains an "Outperform the Market" rating for Tongfu Microelectronics (002156.SZ) [1][4][20] Core Views - The company achieved a revenue of 11.08 billion yuan in the first half of 2024, representing a year-on-year growth of 11.83%, and a net profit attributable to shareholders of 323 million yuan, indicating a turnaround from losses [1] - The gross margin improved by 3.7 percentage points to 14.16% year-on-year, while R&D and management expense ratios decreased slightly [1] - The company is benefiting from the semiconductor cycle recovery and the implementation of AI applications, leading to an increase in capacity utilization and gross margin [1] Financial Performance Summary - Revenue and Profit Forecasts: - 2024E revenue is projected at 24.173 billion yuan, an increase of 8.6% from 2023 [2] - Net profit attributable to shareholders is expected to reach 984 million yuan in 2024E, a significant increase of 480.5% from 2023 [2] - Earnings per share (EPS) is forecasted to be 0.65 yuan in 2024E [2] - Key Financial Ratios: - EBIT margin is expected to improve to 6.4% in 2024E [2] - Return on equity (ROE) is projected to rise to 6.6% in 2024E [2] - Price-to-earnings (P/E) ratio is forecasted to be 29.4x in 2024E [2] Business Development Summary - The company is focusing on traditional framework products, which have shown stable market performance, while emerging markets such as RF modules and communication SoC chips are experiencing over 50% growth [1] - The company has upgraded its large-size multi-chip Chiplet packaging technology and is ramping up production of 16-layer chip stacking packaging products [1] - The company is actively expanding its production capacity in response to the demand for high-performance packaging from major clients like AMD, particularly in the AI sector [1]

Investment Rating - The investment rating for the company is "Buy" (maintained) [2][5] Core Views - The company reported significant year-on-year and quarter-on-quarter growth in Q2 2024, benefiting from the recovery in demand for advanced packaging [5][6] - The company is positioned as a leader in the domestic packaging and testing industry, with strong growth potential in advanced packaging and automotive electronics [5][6] Financial Performance Summary - For H1 2024, the company achieved revenue of 11.08 billion yuan, a year-on-year increase of 11.83%, and a net profit attributable to shareholders of 323 million yuan, up by 5.10 million yuan [5] - In Q2 2024, revenue reached 5.798 billion yuan, representing a year-on-year increase of 10.10% and a quarter-on-quarter increase of 9.77% [5] - The gross profit margin improved to 16.00% in Q2 2024, up by 4.73 percentage points year-on-year [5] Business Segment Performance - The company's subsidiaries showed varied performance, with Suzhou Chaowei achieving revenue of 3.584 billion yuan (up 21.00% YoY) and a net profit of 401 million yuan (up 285.58% YoY) [6] - The company is focusing on upgrading its Chiplet packaging technology and has initiated new processes to enhance chip protection [6] Future Outlook - The company maintains its profit forecasts for 2024-2026, expecting net profits of 977 million yuan, 1.259 billion yuan, and 1.639 billion yuan for the respective years [5][7] - The expected earnings per share (EPS) for 2024, 2025, and 2026 are projected to be 0.64 yuan, 0.83 yuan, and 1.08 yuan, respectively [5][7]

Financial Performance - The company's operating revenue for the first half of 2024 reached ¥11,080,086,982.96, representing an increase of 11.83% compared to ¥9,907,892,175.21 in the same period last year[24]. - The net profit attributable to shareholders of the listed company was ¥322,663,289.17, a significant recovery from a loss of ¥187,693,998.98 in the previous year[24]. - The net cash flow from operating activities increased by 24.50% to ¥1,844,455,652.90, compared to ¥1,481,483,490.80 in the same period last year[24]. - Basic earnings per share improved to ¥0.2130, compared to a loss of ¥0.1244 per share in the previous year[24]. - Operating profit was ¥414,871,594.43, a significant recovery from a loss of ¥315,938,911.49 in the previous year, driven by improved capacity utilization and revenue growth[54]. - The total comprehensive income for the first half of 2024 was CNY 388,057,144.35, compared to a loss of CNY 179,496,468.08 in the first half of 2023[193]. - The company reported a significant reduction in financial expenses, decreasing from CNY 540,683,508.83 in the first half of 2023 to CNY 214,022,936.37 in the first half of 2024[192]. Assets and Liabilities - Total assets at the end of the reporting period were ¥36,114,374,973.31, up 3.55% from ¥34,877,709,853.20 at the end of the previous year[24]. - The company's total equity reached CNY 15,111,464,179.65, an increase from CNY 14,693,841,910.33, indicating a growth of 2.84%[185]. - Total liabilities increased to CNY 21,002,910,793.66, up from CNY 20,183,867,942.87, representing a growth of 4.06%[185]. - Accounts receivable increased to 4,561,425,644.62, representing 12.63% of total assets, with a 1.48% increase compared to the previous year[59]. - The company's cash and cash equivalents decreased to CNY 1,738,299,861.13 from CNY 2,184,183,407.28, a decline of 20.34%[187]. Research and Development - R&D investment increased by 9.35% to ¥672,022,713.62, reflecting the company's commitment to innovation and technology development[54]. - The company has applied for a total of 1,589 patents, with nearly 70% being invention patents, and has registered 93 software copyrights[43]. - The company has made significant investments in R&D for advanced packaging technologies, enhancing its competitiveness in high-performance chip packaging[41]. Market and Industry Outlook - The AI chip market is expected to grow by 33% in 2024, reaching a market size of 71.3 billion USD, with server AI chip market projected to reach 21 billion USD[38]. - The company expects the consumer market to maintain a recovery in the second half of 2024, with continued growth in computing power demand and a significant growth potential in industrial and automotive chips[40]. - The semiconductor industry is expected to see a growth of over 10% in global sales by 2025, according to SIA[33]. Strategic Initiatives - The company plans not to distribute cash dividends or issue bonus shares[4]. - The company has established a strong strategic partnership with AMD, being its largest packaging supplier, accounting for over 80% of AMD's total orders[48]. - The company is actively expanding its domestic market revenue while solidifying its relationships with leading clients in Europe and the United States[40]. Environmental and Social Responsibility - The company has achieved compliance with wastewater discharge standards, with specific metrics reported for various pollutants[115]. - The company has established online pollutant detection equipment at discharge outlets, connected to local and national environmental protection departments for monitoring[116]. - The company donated 1.2 million RMB to the Nantong University Education Development Foundation in the first half of 2024 to support educational initiatives[126]. Risk Management - The company has highlighted risks related to industry and market fluctuations, new technology and product development, and raw material supply[3]. - The company faces risks related to industry and market fluctuations, which could impact operational performance due to demand changes and competitive pressures[89]. - The company is exposed to international trade risks, particularly if trade tensions escalate, which could lead to equipment and material shortages[93].

证券代码：002156 证券简称：通富微电 公告编号：2024-056 通富微电子股份有限公司 第八届董事会第六次会议决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 一、 董事会会议召开情况 通富微电子股份有限公司（以下简称"公司"）第八届董事会第六次会议， 于 2024 年 8 月 16 日以邮件等方式发出会议通知，各位董事已知悉与所议事项相 关的必要信息，公司第八届董事会第六次会议于 2024 年 8 月 27 日以通讯表决方 式召开。公司全体 8 名董事均行使了表决权，会议实际有效表决票 8 票。会议召 开符合有关法律、行政法规、部门规章、规范性文件和公司章程的规定。 二、 董事会会议审议情况 1、审议通过了《公司 2024 年半年度报告及摘要》 具体内容详见巨潮资讯网（http://www.cninfo.com.cn）披露的《2024 年 1- 6 月募集资金存放与实际使用情况的专项报告》。 表决结果：8 票同意；0 票反对；0 票弃权。 3、审议通过了《关于编制<舆情管理制度>的议案》 本议案已经第八届董事会审计委员会第四次会议审议通过，并 ...

万元 非经营性资 金占用 资金占用方名称 占用方与 上市公司 的关联关 系 上市公司核 算的会计科 目 2024 年期 初占用资 金余额 2024 年 1- 6 月占用 累计发生 金额（不 含利息） 2024 年 1- 6 月占用 资金的利 息(如有) 2024 年 1- 6 月偿还 累计发生 金额 2024 年 6 月末占用 资金余额 占用形成 原因 占用性 质 控股股东、 实际控制人 及其附属企 业 小计 前控股股 东、实际控 制人及其附 属企业 小计 其他关联方 及附属企业 小计 总计 其他关联资 金往来 资金往来方名称 往来方与 上市公司 的关联关 系 上市公司核 算的会计科 目 2024 年期 初往来资 金余额 2024 年 1- 6 月往来 累计发生 金额（不 含利息） 2024 年 1- 6 月往来 资金的利 息(如有) 2024 年 1- 6 月偿还 累计发生 金额 2024 年 6 月末往来 资金余额 往来形成 原因 往来性 质 控股股东、 实际控制人 及其附属企 业 南通华达微电子集团有限 公司 控股股东 应收账款 34.45 34.45 水电费 经营性 往来 南通华达微电子集团有限 公司 ...

证券代码：002156 证券简称：通富微电 公告编号：2024-057 通富微电子股份有限公司 2、审议通过了《公司 2024 年 1-6 月募集资金存放与实际使用情况的专项 报告》 具体内容详见巨潮资讯网（http://www.cninfo.com.cn）披露的《2024 年 1-6 月募集资金存放与实际使用情况的专项报告》。 表决结果：3 票同意；0 票反对；0 票弃权。 第八届监事会第五次会议决议公告 本公司及监事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 一、监事会会议召开情况 通富微电子股份有限公司（以下简称"公司"）第八届监事会第五次会议， 于 2024 年 8 月 16 日以邮件等方式发出会议通知，各位监事已知悉与所议事项相 关的必要信息。公司第八届监事会第五次会议于 2024 年 8 月 27 日以通讯表决方 式召开。公司全体 3 名监事均行使了表决权，会议实际有效表决票 3 票。会议召 开符合有关法律、行政法规、部门规章、规范性文件和公司章程的规定。 二、监事会会议审议情况 1、审议通过了《公司 2024 年半年度报告及摘要》 经审核，监事会认为董事 ...

证券代码：002156 证券简称：通富微电 公告编号：2024-060 通富微电子股份有限公司 2024 年 1-6 月募集资金存放与实际使用情况的专项报告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记载、误导性陈述或重 大遗漏。 根据《上市公司监管指引第2号—上市公司募集资金管理和使用的监管要求（2022年修订）》和《深 圳证券交易所上市公司自律监管指引第1号—主板上市公司规范运作》有关规定，现将通富微电子股份有 限公司（以下简称"公司"或"本公司"）2024年1-6月募集资金存放与使用情况说明如下： 一、募集资金基本情况 （一）实际募集资金金额、资金到位时间 1、2022年度非公开发行股票募集资金金额和资金到位情况 经中国证券监督管理委员会证监许可〔2022〕261号核准，并经深圳证券交易所同意，本公司由主 承销商海通证券股份有限公司采用向特定投资者非公开发行股票方式发行人民币普通股（A股） 184,199,721股，每股发行价格为14.62元，应募集资金总额为人民币269,299.99万元，扣除承销费和保 荐费1,367.32万元（含增值税）后的募集资金为人民币267,932.6 ...

通富微电子股份有限公司 关于参与投资设立产业基金募集完毕的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 通富微电子股份有限公司（以下简称"公司"）以自有资金 20,000 万元参与 投资设立南通全德学镂科芯二期创投基金管理合伙企业（有限合伙）（以下简称 "镂科芯二期基金"），具体内容详见公司于 2023 年 2 月 18 日刊登在巨潮资讯 网的《关于参与投资设立产业基金暨关联交易的公告》（公告编号：2023-010）。 2023 年 3 月 7 日，镂科芯二期基金完成相关工商登记手续取得营业执照， 并根据《证券投资基金法》和《私募投资基金监督管理暂行办法》等法律法规的 要求，在中国证券投资基金业协会完成了私募投资基金的备案手续，取得了《私 募投资基金备案证明》，具体内容详见公司于 2023 年 3 月 9 日刊登在巨潮资讯网 的《关于参与投资设立产业基金备案完成的公告》（公告编号：2023-012）。 近日，公司收到基金管理人全德学尔私募基金管理（上海）有限公司通知， 其所管理的镂科芯二期基金已于 2024 年 8 月 15 日完成募集，截至募集完成当 ...

通富微电子股份有限公司 关于与专业投资机构共同投资合伙企业备案完成的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 一、投资概述 通富微电子股份有限公司（以下简称"公司"）与中信建投资本管理有限公 司、中信建投投资有限公司签署了《厦门润信汇泽投资合伙企业（有限合伙）合 伙协议》，共同投资厦门润信汇泽投资合伙企业（有限合伙）（以下简称"合伙企 业"、"基金"或"本基金"）。合伙企业总认缴出资额为 18,081 万元（人民币， 下同），公司作为有限合伙人，以自有资金认缴 10,045 万元，占合伙企业认缴出 资总额的 55.56%。具体内容详见公司于 2024 年 7 月 4 日在巨潮资讯网 （www.cninfo.com.cn）披露的《关于与专业投资机构共同投资合伙企业的公告》 （公告编号：2024-051）。 二、进展情况 目前，合伙企业已完成相关工商登记手续并取得营业执照。近日，公司收到 基金管理人中信建投资本管理有限公司的通知，根据《证券投资基金法》和《私 募投资基金监督管理暂行办法》等法律法规的要求，本基金已在中国证券投资基 金业协会完成了私募投资 ...