Group 1 - The core viewpoint of the article is that the relocation of Shenzhen Chongda's factory and the transfer of production personnel to Zhuhai is progressing smoothly and has not significantly impacted the company's overall production capacity [2] - The Shenzhen base continues normal production, indicating that the transition is being managed effectively without disruption to current operations [2] - The Zhuhai production base is equipped with high multi-layer product manufacturing capabilities and is gradually taking on high-tech demand orders, which enhances the company's competitiveness in the market [2] Group 2 - The capacity layout adjustment is part of the company's long-term strategic optimization aimed at better matching high-end market demands through the technological and efficiency advantages of the Zhuhai base [2] - The transition work is proceeding smoothly, which is expected to further solidify the company's capacity foundation in high value-added sectors [2]

Core Viewpoint - Chongda Technology is actively collaborating with multiple domestic clients to develop GPU accelerator cards using PCBs, indicating a strategic focus on the AI service PCB sector [2] Group 1: Company Developments - The company is working with major clients such as H3C, Cloud Top, Baode, Inspur, Guoxin, Tongtaiyi, and ZTE to create PCB products primarily for server motherboards, storage devices, and GPUs [2] - Chongda Technology plans to increase R&D investment and optimize production capacity to enhance the performance and reliability of its PCB products for AI servers [2] Group 2: Market Outlook - The company aims to expand its customer base in the AI service PCB field, reflecting a commitment to growth in this high-demand sector [2]

Market Outlook - The global printed circuit board (PCB) market is expected to grow by 6.8% in value and 7.0% in shipment volume in 2025, driven by increased demand in mobile, server, and communication sectors [2][3] - The company anticipates a significant increase in sales orders in high-demand areas such as mobile and automotive sectors, supported by a recovery in market prices for high-layer boards and HDI products [2][3] Capacity and Production - Current overall capacity utilization is approximately 85% [3] - The company is accelerating the release of high-layer PCB capacity in its Zhuhai plants and planning to establish a new HDI factory in Jiangmen to meet growing customer demand [3][5] Profitability Improvement Measures - The company is focusing on high-value customers and optimizing its sales structure to improve profit margins, with initial positive results observed in early 2025 [4] - Strategies include enhancing the sales team's capabilities, managing costs effectively, and improving order delivery and customer service levels [4][5] Cost Management - The company is implementing detailed cost control measures to address rising raw material costs, including dynamic monitoring of costs and optimizing material usage [7][8] - A structural price adjustment strategy is being considered to ensure the feasibility of price changes in response to market conditions [7] U.S. Market Exposure - Currently, approximately 10% of the company's revenue comes from the U.S. market [9] - The company is diversifying its market strategy to reduce reliance on the U.S. market, with domestic sales now exceeding 50% of total revenue [9][10] Response to Tariffs - The company is negotiating with overseas clients regarding pricing and delivery terms to mitigate the impact of U.S. tariffs [10] - Plans to accelerate the establishment of overseas production bases, such as in Thailand, are underway to localize supply and reduce tariff costs [10]

Group 1 - The company is currently collaborating with several domestic clients to develop GPU accelerated card PCBs, including major clients such as H3C, Cloud Top, Baode, Inspur, Guoxin, Tongtaiyi, and ZTE [1] - The PCB products are primarily used in server motherboards, storage devices, and GPUs [1] - Looking ahead, the company plans to deepen its focus on the AI service PCB sector, increase R&D investment, optimize production capacity, and expand customer resources to provide higher performance and more reliable PCB products for AI servers and related fields [1]

证券代码：002815 证券简称：崇达技术 公告编号：2025-035 崇达技术股份有限公司 关于为子公司提供担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、公司担保事项概述 1、本次担保基本情况 崇达技术股份有限公司（以下简称"公司"）因子公司大连崇达电路有限公 司（以下简称"大连崇达"）日常生产经营需要，于 2025 年 8 月 6 日与平安银行 股份有限公司大连分行（以下简称"平安银行大连分行"）签署了《最高额保证 担保合同》。 平安银行大连分行为大连崇达提供综合授信额度 20,000 万元，其中 10,000 万元的授信额度属于低风险授信额度，如保证金授信业务等，无需公司提供信用 担保；公司本次仅对其他不超过 10,000 万元的授信额度提供全额信用保证。 2、公司本次担保额度的审议情况 2025 年 4 月 15 日，公司召开的第五届董事会第二十二次会议、第五届监事 会第十五次会议，以及 2025 年 5 月 9 日召开的 2024 年度股东会，审议通过了 《关于公司 2025 年度对子公司担保额度预计的议案》，同意公司为大连崇达 ...

Core Viewpoint - The company has successfully established a mSAP (modified semi-additive process) production line, which is set to officially commence operations in September 2023, focusing on high-end applications in RF packaging substrates, SiP packaging substrates, PMIC packaging substrates, and TPMS substrates [1] Group 1 - The mSAP production line has achieved a line width/spacing capability of 20/20 micrometers for mass production, while the ETS buried line process can reach 15/15 micrometers, meeting the mass production requirements for advanced packaging substrates [1] - The company is currently centered on advanced packaging substrates and is building a technological moat through mSAP process upgrades and customer certification systems [1] - The COWOP technology is still in the industry research and validation stage, and the company has not yet directly engaged in COWOP packaging, but its experience in high-precision PCB manufacturing and advanced packaging substrates positions it for potential future involvement in higher-level packaging technology integration [1] Group 2 - The company will continue to monitor industry trends and assess technology extension paths in conjunction with market demand and technological maturity [1]

Core Viewpoint - Chongda Technology (002815.SZ) has successfully established a mSAP (Modified Semi-additive Process) production line, which is set to officially commence production in September 2023, focusing on high-end applications in RF packaging substrates, SiP packaging substrates, PMIC packaging substrates, and TPMS substrates [1] Group 1 - The mSAP process has achieved mass production capabilities with a line width/spacing of 20/20 micrometers, while the ETS buried line process can reach a line width/spacing of 15/15 micrometers, meeting the demand for advanced packaging substrates [1] - Products made using the mSAP process are already being shipped in large quantities, indicating a successful transition to mass production [1] - The company is currently centered on advanced packaging substrates and is building a technological moat through mSAP process upgrades and customer certification systems [1] Group 2 - The COWOP technology is still in the industry research and validation phase, and the company has not yet directly engaged in COWOP packaging [1] - The company's experience in high-precision PCB manufacturing, advanced packaging substrates, and AI server fields provides potential for future involvement in higher-level packaging technology integration [1] - The company will continue to monitor industry trends and assess technology extension paths based on market demand and technological maturity [1]

Core Viewpoint - The company is experiencing strong demand for its products, particularly in the mobile phone, server, and communication sectors, which is expected to drive significant sales growth in 2025 [3][4]. Group 1: Company Performance and Market Outlook - The global printed circuit board (PCB) market is projected to grow by 6.8% in value and 7.0% in shipment volume in 2025 according to Prismark report [2]. - The company currently has an overall capacity utilization rate of approximately 85% [4]. - The company plans to enhance its production capacity by optimizing and expanding its facilities, including the construction of new plants in Zhuhai and Thailand [4][6]. Group 2: Sales Strategy and Customer Focus - The company aims to deepen its marketing strategy targeting major clients in key industries such as mobile phones, automotive, and servers, focusing on high-value orders [3][5]. - The company is actively managing its sales structure by eliminating loss-making orders and optimizing customer relationships to improve profit margins [5]. Group 3: Cost Management and Profitability - The company is implementing various measures to improve its gross profit margin, including enhancing material utilization and optimizing production processes [9]. - Strategies to mitigate rising raw material costs include dynamic cost monitoring, improving material efficiency, and selectively raising prices based on market conditions [9][8]. Group 4: Response to Tariffs and Market Diversification - Currently, approximately 10% of the company's revenue comes from the U.S. market, and the company is adapting to the changing tariff landscape by diversifying its market presence [10][11]. - The company is accelerating the establishment of overseas production bases to reduce tariff and logistics costs, thereby enhancing competitiveness in international markets [12].

每经AI快讯，崇达技术（SZ 002815，最新价：13元）发布公告称，2025年7月29日至8月1日期间，崇达 技术接受天治基金等投资者调研，公司余忠、朱琼华参与接待，并回答了投资者提出的问题。 2024年1至12月份，崇达技术的营业收入构成为：印制电路板制造行业占比90.83%，其他业务占比 9.17%。 （记者 王瀚黎） 每经头条（nbdtoutiao）——"我们也深陷残酷价格战"！德资巨头中国区高管警告：智驾绝不能免费， 否则会给全行业带来灾难 ...

Group 1 - The core viewpoint is that Tongyuan Investment has conducted research on a listed company, Chongda Technology, which is expected to see positive growth in the global PCB market by 2025, with strong order demand and rising product prices [1] - Chongda Technology's capacity utilization is at 85%, with new production capacities including three factories in Zhuhai and a production base in Thailand [1] - To improve profitability, Chongda Technology is focusing on high-value customers, optimizing sales structure, strengthening teams, enhancing cost management, improving order delivery and customer service, innovating product systems, and expanding capacity [1] Group 2 - The company is implementing cost management strategies to address rising raw material costs, enhancing material utilization, and adopting a structural price increase strategy [1] - The revenue from the US market accounts for 10% of Chongda Technology's total revenue, and the company is responding to tariff policy changes through market diversification, optimizing customer cooperation, and improving the efficiency of domestic production bases [1]