Financial Performance - The company's revenue for Q3 2024 was ¥1,094,363,694.54, representing a decrease of 8.70% compared to the same period last year[2]. - Net profit attributable to shareholders for Q3 2024 was ¥106,926,919.15, down 26.89% year-on-year[2]. - The net profit after deducting non-recurring gains and losses was ¥119,181,794.21, a decrease of 15.21% compared to the previous year[2]. - Total operating revenue for Q3 2024 was CNY 3,201,213,308.67, a decrease of 6.4% compared to CNY 3,419,896,944.07 in the same period last year[15]. - The company reported a net profit of CNY 358,931,951.29 for Q3 2024, a decrease of 12.5% from CNY 409,000,000 in the same quarter last year[15]. - Net profit attributable to shareholders of the parent company was CNY 304.4 million, down 17.4% from CNY 368.4 million in the same period last year[16]. - The total comprehensive income for Q3 2024 was CNY 172.8 million, significantly lower than CNY 404.7 million in Q3 2023[16]. - The basic earnings per share for Q3 2024 were CNY 0.6321, down from CNY 0.7650 in the same quarter last year[16]. Cash Flow and Assets - The company's cash flow from operating activities for the first nine months was ¥206,144,046.81, down 48.79% year-on-year[7]. - The company reported a net cash flow from operating activities of CNY 206.1 million, a decline of 48.8% compared to CNY 402.6 million in Q3 2023[18]. - Cash and cash equivalents decreased to CNY 3,292,629,477.44 from CNY 3,927,271,066.93 at the beginning of the period, a decline of 16.2%[12]. - Cash and cash equivalents at the end of the period stood at CNY 3.29 billion, slightly up from CNY 3.26 billion at the end of Q3 2023[19]. - The company experienced a decrease in sales revenue from CNY 3.61 billion in Q3 2023 to CNY 3.24 billion in Q3 2024, reflecting a decline of 10.2%[18]. - The company reported a net cash outflow from investing activities of CNY 701.3 million, compared to a net outflow of CNY 548.5 million in Q3 2023[18]. - The net cash flow from financing activities was negative CNY 105.8 million, worsening from negative CNY 22.3 million in Q3 2023[19]. - The total assets at the end of Q3 2024 were ¥12,818,014,057.04, an increase of 0.60% from the end of the previous year[2]. - Total liabilities were CNY 883,572,969.03, down from CNY 912,503,963.52 at the beginning of the period, reflecting a decrease of 3.2%[13]. - The company’s total equity increased to CNY 11,934,441,088.01, up from CNY 11,829,522,975.89, marking a growth of 0.9%[14]. - Inventory rose to CNY 2,547,736,447.03, an increase of 5.9% from CNY 2,404,780,777.28 at the beginning of the period[12]. Shareholder Information - The total number of common shareholders at the end of the reporting period is 68,233[8]. - The largest shareholder, Beijing Yitang Shengxin Semiconductor Industry Investment Center, holds 12.57% of shares, totaling 60,546,704 shares[9]. - Liu Qiang, a significant shareholder, holds 8.40% of shares, amounting to 40,475,544 shares, with 30,356,658 shares under lock-up[10]. - The total number of shares held by the top ten shareholders accounts for a significant portion of the company's equity, with the top three shareholders alone holding over 29%[9]. - The company has a total of 65,801,522 restricted shares at the beginning of the period, with 3,822,210 shares released during the period[11]. - The total number of shares held by the top ten unrestricted shareholders is 168,000,000, indicating strong institutional support[9]. - Liu Qiang and Li Jie are identified as acting in concert, indicating potential strategic alignment among major shareholders[9]. - The company has not reported any changes in the top ten shareholders due to margin trading activities[10]. Operational Insights - Revenue from storage chips for the first nine months was ¥198,660.81 million, a decline of 10.52% compared to the previous year[5]. - Revenue from analog and interconnect chips increased by 16.49% year-on-year, reaching ¥34,730.15 million for the first nine months[5]. - Financial expenses for the first nine months amounted to -¥81,085,164.97, a decrease of 50.27% year-on-year due to increased interest income[6]. - The company reported a significant decrease in cash flow from financing activities, with a net outflow of -¥105,781,253.65, down 374.16% year-on-year[7]. - The company plans to continue promoting its new chip models in the market despite the overall low demand in the automotive and industrial sectors[5]. - The company plans to continue its market expansion and product development strategies, focusing on semiconductor technology[10]. - The company maintains a focus on R&D for new technologies and products to enhance its competitive position in the semiconductor market[10]. - Research and development expenses increased to CNY 527,574,995.27, representing a rise of 4.3% compared to CNY 506,237,233.89 in the previous year[15].

证券代码：300223 证券简称：北京君正 公告编号：2024-050 北京君正集成电路股份有限公司 关于股东股份减持计划完成情况的公告 公司股东上海武岳峰集成电路股权投资合伙企业（有限合伙）保证向本公司 提供的信息内容真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 北京君正集成电路股份有限公司（以下简称"公司"）于 2024 年 8 月 10 日在中国证监会指定的创业板信息披露网站巨潮资讯网（www.cninfo.com.cn） 披露了《关于公司股东股份减持计划预披露公告》，持本公司 5%以上股份的股 东上海武岳峰集成电路股权投资合伙企业（有限合伙）（以下简称"武岳峰集电"） 拟通过集中竞价方式减持公司股份不超过 870,000 股，占公司总股本比例不超过 0.1807%。 公司近日收到上述股东出具的关于本次减持计划已实施完毕的书面文件，根 据相关规定，现将其股份减持计划的实施情况公告如下： 一、减持计划的实施进展情况 | | T T | | | | --- | --- | --- | --- | | 庆名称 | 減持方式 | 减持 ...

证券代码：300223 证券简称：北京君正 公告编号：2024-049 北京君正集成电路股份有限公司 关于子公司为子公司提供担保的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 一、 担保情况概述 近期，为保证北京君正集成电路股份有限公司（以下简称"公司"）全资子公 司络明芯微电子国际有限公司（以下简称"络明芯国际"）的生产经营需要，公 司全资子公司北京矽成半导体有限公司（以下简称"北京矽成"）为络明芯国际委 托合肥晶合集成电路股份有限公司（以下简称"晶合公司"）制造产品之逾期应 付货款、利息提供担保，并签署了《连带保证书》。 二、被担保人基本情况 名称：络明芯微电子国际有限公司 成立日期：2005年3月21日 注册地点：香港九龙观塘成业街6号泓富广场8楼801-5室 法定代表人：刘强 注册资本：1290美元 主营业务：集成电路产品的生产、销售、一般贸易等 与本公司的关系：公司下属全资子公司 最近一年又一期主要财务数据： 单位：万美元 根据《深圳证券交易所上市公司自律监管指引第 2 号—创业板上市公司规范 运作》等相关规定，本次担保事项属于上市公司控股子 ...

证券代码：300223 证券简称：北京君正 公告编号：2024-048 北京君正集成电路股份有限公司 关于公司股东股份减持计划预披露公告 公司股东北京屹唐盛芯半导体产业投资中心（有限合伙）保证向本公司提供 的信息内容真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 特别提示： 1、北京君正集成电路股份有限公司（以下简称"公司"）持股 5%以上股东 北京屹唐盛芯半导体产业投资中心（有限合伙）（以下简称"屹唐盛芯"）计划 以集中竞价方式减持所持有的公司股份不超过 800,000 股，占公司总股本比例不 超过 0.1661%； 2、本次减持计划拟通过集中竞价方式减持，自 2024 年 10 月 30 日至 2024 年 11 月 10 日实施该减持计划，符合首次卖出的 15 个交易日前预先披露减持计 划的要求； 3、截至本公告披露日，屹唐盛芯持有公司股份 60,546,704 股，占本公司总 股本比例 12.57%。 公司于近日收到屹唐盛芯关于减持计划的书面文件，现将相关情况公告如 下： | 序号 | 股东名称 | 持股数量（股） | 占公司 ...

证券代码：300223 证券简称：北京君正 北京君正集成电路股份有限公司 投资者关系活动记录表 编号：20240923 | --- | --- | --- | |-----------------------|-------------------------------------------------------|--------------------------------------------------------| | | | | | 投资者关系活动 | ■特定对象调研 | □分析师会议 | | 类别 | □媒体采访 | □业绩说明会 | | | □新闻发布会 | □路演活动 | | | □现场参观 | | | | □其他 （ | ） | | 参与单位名称及 | Jefferies：Edison Lee 、 | Nick Cheng、Jacky He ； Allianz Global | | 人员姓名 | Investors：Stephen 等 | Chow；HSBC Asset Management：Lily Ma | | 时间 | 2024 年 9 月 23 日 | | | 方式 | 线 ...

证券代码：300223 证券简称：北京君正 北京君正集成电路股份有限公司 投资者关系活动记录表 | --- | --- | --- | --- | --- | |-------------------------|------------------------------------------|-------------|-------|-------| | | | | | | | 投资者关系活动 | ■特定对象调研 | □分析师会议 | | | | 类别 | □媒体采访 | □业绩说明会 | | | | | □新闻发布会 | □路演活动 | | | | | □现场参观 | | | | | | □其他 （ ） | | | | | 参与单位名称及 人员姓名 | 国中长城资产：刘志强；中信证券：邵籽杰等 | | | | | 时间 | 2024 年 9 月 11 日 | | | | | 方式 | 线下交流会 | | | | | 上市公司接待人 员姓名 | 董事会办公室工作人员 | | | | | | 一、公司基本情况介绍 二、问答环节 | | | | | | | | | | | | | | | | | | | ...

证券代码：300223 证券简称：北京君正 公告编号：2024-047 北京君正集成电路股份有限公司 关于变更独立财务顾问主办人的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 北京君正集成电路股份有限公司（以下简称"公司"）发行股份及支付现金 购买北京矽成半导体有限公司 59.99%股权、上海承裕资产管理合伙企业（有限 合伙）100%财产份额并募集配套资金（以下简称"本次交易"）于 2019 年 12 月 经中国证券监督管理委员会核准，于 2020 年 5 月完成标的资产过户，并于 2020 年 9 月完成募集配套资金发行。中德证券有限责任公司为本次交易的联席独立财 务顾问、联席主承销商，张建磊先生、姜海强先生为独立财务顾问主办人。 截至公告日，公司本次交易募集配套资金尚未使用完毕，独立财务顾问将 就公司未使用完毕的募集资金使用情况继续履行持续督导责任。 附：管仁昊先生简历 特此公告。 北京君正集成电路股份有限公司 董事会 二○二四年九月十日 近日，公司收到中德证券有限责任公司《关于更换北京君正集成电路股份有 限公司重大资产重组独立财务顾问主办人的说明 ...

Investment Rating - The investment rating for the company is "Accumulate" (maintained) [1] Core Views - The consumer market continues to recover, and the industry market is gradually approaching recovery [1] - The company reported a revenue of 2.11 billion yuan for the first half of 2024, a year-on-year decrease of 5.2%, with a net profit attributable to the parent company of 200 million yuan, down 11.1% year-on-year [1] - The second quarter of 2024 saw a revenue of 1.1 billion yuan, a year-on-year decrease of 4.5% but a quarter-on-quarter increase of 9.2% [1] - The company’s gross profit margin for the first half of 2024 was 37.6%, an increase of 1.1 percentage points year-on-year [1] - The storage chip segment reported a revenue of 1.32 billion yuan in the first half of 2024, a year-on-year decrease of 12.3% [2] - The analog and interconnect chip segment achieved a revenue of 230 million yuan in the first half of 2024, a year-on-year increase of 23.4% [2] - The company expects the consumer electronics market demand to continue improving, while the automotive and industrial sectors remain relatively sluggish [2] Financial Summary - The company’s revenue for 2023 was 4.531 billion yuan, with a projected revenue of 4.530 billion yuan for 2024, indicating a year-on-year change of 0.0% [3] - The net profit attributable to the parent company for 2023 was 537 million yuan, with a projected net profit of 503 million yuan for 2024, reflecting a year-on-year decrease of 6.5% [3] - The gross margin is expected to improve from 37.1% in 2023 to 37.9% in 2024 [3] - The earnings per share (EPS) is projected to be 1.04 yuan in 2024, with a price-to-earnings (P/E) ratio of 44.74 [3][4]

Group 1: Financial Performance - The gross margin for storage chips decreased by 0.71% in the first half of the year, which is considered a normal fluctuation [1] - The gross margin for storage chips was around 30% before price increases in 2021, and it improved after price hikes [1] - The overall revenue for storage chips is still relatively low, with a year-on-year decline observed in the first half of the year [2] Group 2: Market Outlook - The second quarter showed a slight increase in revenue compared to the first quarter, and the market is expected to stabilize in the second half of the year [2] - The company anticipates potential year-on-year growth in the fourth quarter [2] - The DRAM market is expected to gradually shift to 21nm technology, with sample products expected to be launched in the second half of the year [3] Group 3: Product Development - The company is expanding its product line, particularly in the consumer-grade market, with new products aimed at enhancing competitiveness [2] - The SRAM market is stable with good gross margins, while the DRAM market has a projected niche market space of around $10 billion [3] - The LED driver chip market is expected to grow significantly, with a global market size projected to be around $2-3 billion [3] Group 4: Cost Management - The improvement in gross margins is attributed to product structure and cost reductions rather than price increases [3] - The company is monitoring wafer factory pricing but has not received any notifications of price increases from its main partners [4]

北京君正集成电路股份有限公司 2024 年半年度募集资金存放与使用情况的专项报告 2024 年 1 月 1 日至 2024 年 6 月 30 日 （本专项报告除特殊说明外，均以人民币元列示） 北京君正集成电路股份有限公司 2024 年半年度度募集资金存放与使用情况的专项报告 一、募集资金基本情况 （一）实际募集资金金额、资金到位情况 1、2020 年度非公开发行股份募集资金 经中国证券监督管理委员会出具的《关于核准北京君正集成电路股份有限公司向北 京屹唐半导体产业投资中心（有限合伙）等发行股份购买资产并募集配套资金的批复》 （证监许可[2019]2938 号）核准，公司 2020 年度非公开发行股份募集配套资金不超过 150,000.00 万元。本次募集配套资金采用非公开发行股份方式，发行人民币普通股（A 股）18,181,818股，发行价格为人民币82.50元/股，募集资金总额为人民币1,499,999,985.00 元。截至 2020 年 8 月 28 日，公司实际收到募集资金人民币 1,499,999,985.00 元。 上述募集资金到位情况已经北京兴华会计师事务所（特殊普通合伙）验证，并由其 出具了[ ...