Core Insights - The domestic PCB market is projected to grow from $41.213 billion to $49.704 billion from 2024 to 2029, with a CAGR of 3.8% [1] - The fastest-growing downstream sector for PCBs is servers/data storage, expected to have a CAGR of 11.6% during the same period [1] Group 1: PCB Market Growth - The demand for PCBs is driven by explosive growth in computing power, particularly in AI servers and switches, which require higher performance [1] - The requirements for PCB materials are evolving, with a focus on low Dk/Df properties for core materials like resin, fiberglass, and copper foil [1] Group 2: Resin Demand and Supply - PPO and hydrocarbon resins are ideal for high-frequency and high-speed applications, with expected global demand reaching 4,558 tons and 1,216 tons by 2025, reflecting year-on-year growth of 41.89% and 41.62% respectively [2] - Major global suppliers of PPO and hydrocarbon resins include Sabic, Asahi Kasei, and Mitsubishi Gas, while domestic companies like Dongcai Technology and Shengquan Group are rapidly improving their product performance and production capabilities [2] Group 3: Low-DK Electronic Fabrics - Low-DK electronic fabrics are essential for M7 and above CCL, with the market expected to reach $2.3 billion by 2033, growing at a CAGR of 7.50% from 2024 to 2033 [3] - The supply of low-DK electronic fabrics is concentrated among Japanese, Taiwanese, and domestic companies, with domestic firms accelerating their production capabilities [3] Group 4: HVLP Copper Foil - HVLP copper foil is a core material for high-frequency PCBs, with a projected market growth from $2 billion to $5.95 billion between 2024 and 2032, achieving a CAGR of 14.6% [4] - The high-end copper foil market is currently dominated by Japanese and Korean companies, but domestic firms like Defu Technology and Tongguan Copper Foil are making significant advancements [4] Group 5: Key Companies - Notable companies to watch include Shengquan Group (605589.SH), Dongcai Technology (601208.SH), Zhongcai Technology (002080.SZ), Honghe Technology (603256.SH), International Composite Materials (301526.SZ), Defu Technology (301511.SZ), Tongguan Copper Foil (301217.SZ), and Longyang Electronics (301389.SZ) [5]

新材料 PCB 材料行业报告 领先大市-B(维持) 乘 AI 之风，PCB 材料向高频高速升级 2025 年 12 月 18 日 行业研究/行业深度分析 化学原料板块近一年市场表现 投资要点： 资料来源：常闻 相关报告： 稳定奔跑，产品量产在即推动产业发展 加 速 - 新 材 料 周 报 （ 251201-1205 ） 2025.12.10 【山证新材料】宇树科技 IPO 辅导收 官，有望推动人形机器人产业发展加速- 新材料周报（251124-1128） 2025.12.2 冀泳洁 博士 执业登记编码：S0760523120002 邮箱：jiyongjie@sxzq.com 王锐 执业登记编码：S0760524090001 邮箱：wangrui1@sxzq.com 申向阳 邮箱：shenxiangyang@sxzq.com AI 服务器快速发展，拉动高频高速 PCB 需求。根据 Prismark 预测，2024- 2029 年国内 PCB 产值将从 412.13 亿美元提升至 497.04 亿美元，CAGR 为 3.8%。服务器/数据储存是 PCB 增速最快的下游领域，2024-2029 年 CAGR 达到 ...

格隆汇12月18日丨德福科技(301511.SZ)在互动平台表示，公司的产品广泛应用于新能源汽车、无人 机、机器人、储能系统、汽车电子、AI服务器、5G基站等领域。 ...

德福科技（301511.SZ）12月18日在投资者互动平台表示，公司产品广泛应用于新能源汽车、无人机、 机器人、储能系统、汽车电子、AI服务器、5G基站等领域。 （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：公司有生产铜管业务，适用于空调核心铜管零部件那 种吗？公司与空调企业或者汽车企业有业务往来吗？ ...

截至12月17日收盘，PET铜箔概念上涨2.73%，位居概念板块涨幅第9，板块内，39股上涨，江南新材涨 停，骄成超声、德福科技、东材科技等涨幅居前，分别上涨13.54%、12.53%、8.92%。跌幅居前的有光 莆股份、同益股份、汇成真空等，分别下跌1.85%、1.64%、1.06%。 今日涨跌幅居前的概念板块 | 概念 | 今日涨跌幅（%） | 概念 | 今日涨跌幅（%） | | --- | --- | --- | --- | | 共封装光学(CPO) | 3.76 | 海南自贸区 | -2.09 | | 铜缆高速连接 | 3.55 | 赛马概念 | -1.08 | | 液冷服务器 | 3.35 | 网约车 | -0.90 | | 金属铅 | 3.20 | 自由贸易港 | -0.90 | | 中国AI 50 | 3.18 | 军工信息化 | -0.70 | | AI PC | 3.11 | 转基因 | -0.65 | | 同花顺果指数 | 3.08 | 租售同权 | -0.64 | | 光纤概念 | 2.99 | 粮食概念 | -0.60 | | PET铜箔 | 2.73 | 生态农业 | -0.55 | ...

每日经济新闻 每经AI快讯，12月17日，电池板块短线拉升，德福科技涨超10%，铜冠铜箔、厦钨新能、天华新能、武 汉蓝电、华盛锂电等跟涨。 ...

证券日报网讯12月15日，德福科技（301511）在互动平台回答投资者提问时表示，截至2025年12月10 日，公司的股东人数为45000户。 ...

Group 1 - Muxi Co., Ltd. will list its common stock on the Sci-Tech Innovation Board on December 17, 2025 [1] - Xinghua New Materials signed a strategic cooperation agreement with Guoteng Company to collaborate in the quantum technology field [2] - TCL Technology's subsidiary plans to acquire a 10.7656% stake in Shenzhen Huaxing Semiconductor for 60.45 billion RMB [3] Group 2 - Jingjia Micro's subsidiary has completed key stages of its edge AI SoC chip, marking a significant project breakthrough [4] - Cambricon plans to use 2.778 billion RMB of its capital reserve to offset losses [5] - Bojun Technology's subsidiary intends to invest 600 million RMB in an automotive lightweight component production base in Chongqing [6] Group 3 - Longqi Technology plans to invest approximately 1.5 billion RMB to build an AI + smart terminal digital benchmark factory in Nanchang [7] - Taili Technology signed a strategic cooperation framework agreement with Jinan University to establish an advanced functional materials research institute with an investment of 100 million RMB [8][9] - Pengding Holdings plans to invest a total of 4.297 billion RMB in a production facility in Thailand by 2026 [10] Group 4 - China Metallurgical Group reported a new contract amount of 958.13 billion RMB from January to November 2025, a decrease of 8.6% year-on-year [16] - 吉祥航空 reported an 8.92% year-on-year increase in passenger turnover in November 2025 [17] - Hainan Airport's passenger throughput reached 2.0909 million in November 2025, a year-on-year increase of 8.16% [20] Group 5 - Xinhua Insurance reported a cumulative original insurance premium income of 188.85 billion RMB from January to November 2025, a year-on-year increase of 16% [21] - Huafeng Aluminum's controlling shareholder plans to reduce its stake by up to 2.17% [22] - Digital Vision plans to repurchase shares worth 80 million to 120 million RMB [23]

Group 1 - The core point of the article is that Defu Technology (SZ 301511) announced that its major shareholders, Fuhe Group and its concerted parties, did not reduce their holdings as per the planned reduction timeline, which has now concluded [1] - As of the announcement date, Defu Technology's revenue composition for the first half of 2025 is as follows: lithium battery copper foil accounts for 77.53%, electronic circuit copper foil accounts for 14.8%, and other businesses account for 7.66% [1] - The current market capitalization of Defu Technology is 22.4 billion yuan [1]

人民财讯12月15日电，德福科技(301511)12月15日公告，此前公告，股东富和集团及其一致行动人德福 股权计划减持不超1.5%公司股份。截至本公告披露日，股东富和集团及其一致行动人德福股权本次减 持计划期限已届满，未减持公司股份。 转自：证券时报 ...