TAIPEI, Jan 15 (Reuters) - TSMC, the world's main producer of advanced AI chips and a major supplier ​to Nvidia, on Thursday posted a 35% jump ‌in fourth-quarter profit to record levels that handily beat market forecasts ‌on Thursday. Benefiting from surging demand for advanced chips used in artificial intelligence applications, Taiwan Semiconductor Manufacturing Co said net profit for October-December climbed to T$505.7 billion ($16 billion), its seventh ⁠straight quarter of double-digit ‌growth. That ...

台积电美股夜盘直线拉升涨近2%。此前公司公布业绩，第四季度净利润达5057亿新台币，2025年资本 支出达409亿美元。 本文源自：金融界AI电报 ...

台积电：第四季度每股盈余为新台币19.50元（折合美国存托凭证每单位为3.14美元）。 本文源自：金融界AI电报 ...

TSMC, the world's largest contract chipmaker, posted a 35% jump in fourth-quarter net profit on Thursday, beating market forecasts and hitting a record as it benefited from surging demand for semicond... ...

台积电：第四季度净利润5,057亿元台币，市场预估4,670亿元台币；第四季度毛利率62.3％，市场预估 60.6％。 风险提示及免责条款 市场有风险，投资需谨慎。本文不构成个人投资建议，也未考虑到个别用户特殊的投资目标、财务状况或需要。用户应考虑本文中的任何 意见、观点或结论是否符合其特定状况。据此投资，责任自负。 ...

NEW YORK (AP) — Wall Street steadied on Thursday as stocks in the artificial-intelligence industry bounced back following an encouraging report from a Taiwanese chip giant and as oil prices eased sharply. The S&P 500 rose 0.3% and snapped the two-day losing streak it had been on since setting an all-time high. The Dow Jones Industrial Average added 292 points, or 0.6%, and the Nasdaq composite rose 0.2%. Nvidia and other formerly high-flying AI stocks helped lift the market after Taiwan Semiconductor Man ...

Core Viewpoint - The global semiconductor market is expected to be dominated by AI, particularly in the data center sector, while demand for consumer electronics like PCs and smartphones remains stagnant [2][3]. Group 1: NVIDIA and AI - NVIDIA continues to emphasize its leadership in AI, with plans to launch the new product "Rubin" in 2026, potentially priced between $100,000 and $120,000 [4][6]. - The company is focusing on "physical AI" applications, which are essential for real-world implementations such as autonomous driving and robotics [6]. Group 2: TSMC's Market Position - TSMC's market share in the foundry business is projected to exceed 60% in 2024 and possibly 70% in 2025, maintaining its dominance in advanced process technologies [7]. - TSMC has begun mass production of 2nm technology, with Apple expected to be its first major customer [7]. Group 3: Intel's Manufacturing Challenges - Intel's manufacturing division is facing significant financial losses, with a reported $20 billion loss in the manufacturing sector for the fiscal year 2024, raising concerns about its long-term viability [8]. - Discussions about potential funding and management for Intel's manufacturing operations are ongoing, but no concrete plans have emerged [8]. Group 4: Semiconductor Market Growth - The global semiconductor market is forecasted to grow from $772.2 billion in 2025 to $975.5 billion in 2026, translating to approximately 151.2 trillion yen [11]. - Japan's semiconductor industry is at risk of declining market share, potentially falling below 5% due to rapid global market growth driven by AI [11]. Group 5: DRAM Market Dynamics - The DRAM market is experiencing volatility due to increased demand from AI applications, with contract prices rising sharply [16]. - There are concerns that aggressive investments in DRAM production could lead to a market downturn in the latter half of 2026 [16]. Group 6: Emerging Competitors - Chinese power device manufacturers are gaining competitiveness, with a significant portion of the market share in power devices expected to shift towards them [17]. - The potential for oversupply in the power device market is a risk that needs monitoring as demand dynamics evolve [17]. Group 7: Nexperia's Market Position - Nexperia holds a 20% market share in the small signal transistor market, with over 50% of its revenue coming from the automotive sector, indicating potential vulnerabilities [19]. Group 8: TSMC's Expansion in Japan - TSMC's expansion in Japan is becoming increasingly important, with plans to introduce advanced process nodes in its facilities, despite current underutilization of existing capacity [20].

2026.01. 15 本文字数：953，阅读时长大约1.5分钟 作者 | 第一财经 郑栩彤 据央视消息，当地时间1月14日，美国白宫宣布，从15日起对部分进口半导体、半导体制造设备和衍 生品加征25%的进口从价关税。 将被加征25%关税的产品，包括英伟达AI芯片H200和AMD MI325X。25%的加征关税适用于一小部 分半导体产品。一些可用于支持美国技术供应链建设的产品被豁免，例如一些用于美国数据中心、涉 及在美国维修或更换、被美国初创公司使用、其他有助于加强美国技术供应链建设的产品。 对一些进口半导体加征关税的同时，美国近年在推动半导体本土制造。美国白宫在一份公告中提到， 美国本土的半导体制造能力不足以满足不断增长的商业产业需求。美国消耗了全球约1/4的半导体， 但仅能在本土完全生产约10%的芯片。 虽然已在推动美国本土制造，但以英伟达为例，这家全球最大的AI芯片公司仍依赖海外供应链。 英伟达供应链上的重要合作伙伴包括晶圆代工厂台积电。上周CES（国际消费电子展）演讲中，英伟 达CEO黄仁勋宣布推出新一代芯片架构Rubin的六颗芯片，其中Rubin GPU的算力相比Blackwell明显 提升，其中就 ...

虽然美国已在推动本土制造，但以英伟达为例，这家全球最大的AI芯片公司仍依赖海外供应链。 据央视消息，当地时间1月14日，美国白宫宣布，从15日起对部分进口半导体、半导体制造设备和衍生 品加征25%的进口从价关税。 将被加征25%关税的产品，包括英伟达AI芯片H200和AMD MI325X。25%的加征关税适用于一小部分半 导体产品。一些可用于支持美国技术供应链建设的产品被豁免，例如一些用于美国数据中心、涉及在美 国维修或更换、被美国初创公司使用、其他有助于加强美国技术供应链建设的产品。 对一些进口半导体加征关税的同时，美国近年在推动半导体本土制造。美国白宫在一份公告中提到，美 国本土的半导体制造能力不足以满足不断增长的商业产业需求。美国消耗了全球约1/4的半导体，但仅 能在本土完全生产约10%的芯片。 虽然已在推动美国本土制造，但以英伟达为例，这家全球最大的AI芯片公司仍依赖海外供应链。 英伟达供应链上的重要合作伙伴包括晶圆代工厂台积电。上周CES（国际消费电子展）演讲中，英伟达 CEO黄仁勋宣布推出新一代芯片架构Rubin的六颗芯片，其中Rubin GPU的算力相比Blackwell明显提 升，其中就有晶体 ...

Summary of Key Points from the Conference Call Industry Overview - The semiconductor industry is experiencing a unique phase characterized by a significant supercycle, with high demand for advanced logic, DRAM, and NAND products. Chipmakers are struggling to expand capacity quickly enough, and there may soon be limitations due to fab equipment supply [1][2] - Despite the booming demand, technological advancements in scaling, power consumption, and chip costs have slowed considerably, leading to a perception that Moore's Law has become a "Moore's Wall" [1][2] Innovations and Developments - The semiconductor industry has a history of overcoming skepticism, with promising innovations on the horizon for the next decade [3][4] - Memory prices are surging, making 3D NAND technology relevant again. The report discusses SK Hynix's latest V9 NAND technology and Samsung's improvements using molybdenum (Mo) [5][6] NAND Technology Insights - NAND scaling is critical due to rising demand and limited cleanroom space for capacity expansion. Memory producers are constrained to upgrading existing lines, with leading fabs utilizing a 3xx-layer 3D NAND process yielding approximately 20-30 Gb/mm² of memory, equating to over 30 TB on a single 12" wafer [8] - SK Hynix's 321-layer process offers 44% more memory per wafer compared to the previous 238-layer technology, making upgrades a clear choice for manufacturers facing cleanroom space constraints [10] Scaling Methods - Four main avenues for scaling NAND storage capacity per wafer include logical scaling, vertical scaling, lateral scaling, and architecture scaling [11][12][13] - Vertical scaling is currently the most cost-effective method, with NAND layer counts increasing rapidly [19][20] Challenges in Manufacturing - Increasing the number of layers per deck presents significant challenges, with Hynix reporting a 30% increase in overall process steps and a 20% increase in etch steps from V8 to V9, while layer counts increased by nearly 35% [28] - The complexity of manufacturing processes increases with the number of layers, and achieving high yields in production remains a challenge [27][55] Competitive Landscape - Hynix's 321L V9 product faces commercial challenges, as its density of 21 Gb/mm² is comparable to Micron's 276L G9, which achieves similar density with fewer decks, resulting in lower costs [33][34] - Samsung's upcoming 332L BiCS10 technology is expected to outperform Hynix's offerings, achieving densities of 29 Gb/mm² for TLC and over 37 Gb/mm² for QLC [34] Next-Gen Interconnects - As semiconductor nodes scale below 10 nm, traditional copper interconnects face critical bottlenecks, prompting the exploration of ruthenium (Ru) as a superior alternative [59] - Samsung's introduction of Grain Orientation Engineering through Ru Atomic Layer Deposition (ALD) has shown promising results, achieving a 46% reduction in resistance for ultra-fine interconnects [60][61] Conclusion - The semiconductor industry is at a crossroads, balancing unprecedented demand with technological challenges. Innovations in NAND technology and interconnect materials are crucial for maintaining competitive advantages and meeting future market needs.