公司在晶圆级电性测试设备领域已具备深厚积累，其测试设备在精密定位、数据采集与分析等方面与硅 光测试需求高度契合。通过将电性测试领域的硬件设计与系统集成能力，与浙江大学在光电子器件方面 的科研优势相结合，公司有望开发出面向下一代硅光芯片的专用测试与良率管理解决方案。 广立微能够投入资源进行前瞻性的战略研发，离不开其稳健的业绩表现和强大的研发实力作为支撑。根 据公司2025年半年度报告，其上半年经营业绩呈现快速增长态势。公司实现营业收入2.46亿元，同比增 长43.17%；实现归属于上市公司股东的净利润1568.42万元，同比大幅增长518.42%。分业务来看，软件 开发及授权业务与测试设备及配件业务两大核心板块收入均保持超过38%的强劲增长。 公司始终坚持技术创新驱动发展，2025年上半年研发投入金额高达1.44亿元，占营业收入的比例达到 58.57%。截至报告期末，公司拥有众多研发人员与数百项知识产权，持续的高强度研发投入为公司在 高端技术领域的竞争和拓展构筑了坚实壁垒。 在全球半导体产业竞争加剧和供应链自主可控需求日益迫切的大背景下，广立微凭借其在EDA软件、 测试设备和数据分析领域的全流程解决方案，已成为 ...

近日，国家信息光电子创新中心发布全国产化12寸硅光全流程套件（PDK/ADK/TDK），这一突破标志 着我国在硅光芯片领域首次实现从设计、制造、测试到封装工艺的全流程标准化，可支撑全国产硅光芯 片大规模量产。 硅光技术是将传统微电子芯片与光子学融合的技术，也就是把电子元件和光学元件"挤"在同一片芯片 上。相比传统微电子芯片，硅光芯片传输速率更高、功耗更低，是5G/6G、AI算力网络、量子信息等领 域的底层技术，还可以绕开对EUV光刻机的依赖，实现芯片领域"换道超车"。 据国家信息光电子创新中心硅光技术部经理陈代高介绍，"有了全流程套件，芯片研发的各环节就能统 一使用标准化'语言'，实现设计即测试、测试完成即封装，避免重复验证，缩短研发周期，降低制造成 本。" 目前，该技术成果性能已达到量产要求，正支撑龙头企业进行高速硅光芯片的试产。全流程套件已有超 过20家企业与国家信息光电子创新中心达成初步合作意向。（文章来源：中国光谷） ...

转自：证券时报 人民财讯9月29日电，广立微(301095)9月29日公告，公司拟与浙江大学签署《共建"浙江大学-广立微硅 光技术及量测装备联合研发中心"协议》，共同开展晶圆级硅光测试设备、硅光器件良率提升解决方案 以及硅光高效量产光电监控方案研发，并建立校企深度融合联动的人才引进与培养机制。公司计划3年 内投入中心的资金规模不低于1500万元。 ...

Investment Rating - The report maintains an "Outperform" rating for the communication industry, indicating expected performance above the market benchmark by more than 10% [5][53]. Core Insights - The global cloud service provider (CSP) AI arms race is accelerating, benefiting the computing infrastructure development, which is considered a primary growth area. Key recommendations include focusing on optical devices and modules, communication equipment, liquid cooling solutions, and edge computing [4][50]. - The three major telecom operators are viewed as important assets for dividend allocation, with stable operations and increasing dividend payout ratios, suggesting a long-term investment strategy in these operators [4][50]. - The report highlights significant advancements in AI computing infrastructure, including Alibaba's launch of the new generation of AI servers and Nvidia's substantial investment in OpenAI, which is expected to deploy at least 10GW of Nvidia systems [2][3][4]. Summary by Sections Industry News Tracking - Alibaba Cloud launched the new generation of the "Panjun 128" ultra-node AI server, which supports 128 AI computing chips per cabinet and achieves a power density of 350kW [2][12]. - ZTE showcased a super-node server supporting 64 GPUs and introduced its self-developed 51.2T switching chip [3][29]. - Nvidia announced a $100 billion investment in OpenAI, with plans to deploy 10GW of systems, marking a historic investment in AI infrastructure [3][4]. Market Performance Review - The communication index fell by 0.28% this week, while the Shanghai and Shenzhen 300 index rose by 1.07%, resulting in a relative return of -1.35% [3][41]. - Within the sector, fiber optic cables, communication equipment manufacturers, and IDC showed relatively strong performance [3][41]. Company Earnings Forecast and Investment Ratings - Key companies such as China Mobile, Zhongji Xuchuang, and ZTE are rated as "Outperform" with projected earnings per share (EPS) for 2025 estimated at 6.72, 8.08, and 1.79 respectively [5][49]. - The report provides a detailed earnings forecast for various companies, indicating a positive outlook for the communication sector [49]. Investment Recommendations - The report emphasizes the importance of continuously monitoring the development of AI computing infrastructure and suggests a focus on specific companies such as China Mobile, Zhongji Xuchuang, ZTE, and Guanghetong for investment opportunities [4][50].

Investment Rating - The report maintains an "Outperform the Market" rating for the communication industry [5][53]. Core Viewpoints - The global cloud service providers (CSP) are accelerating the AI arms race, benefiting the computing infrastructure development, which is considered the main track for investment [4][50]. - The report highlights the importance of the three major telecom operators as significant assets for dividend allocation, emphasizing their stable operations and increasing dividend payout ratios [4][50]. - Key recommended stocks for the upcoming week include China Mobile, Zhongji Xuchuang, ZTE Corporation, and Guanghetong [4][50]. Summary by Sections Industry News Tracking - Alibaba Cloud launched the new generation of the "Panjun 128" ultra-node AI server, which supports various AI chips and has a power density of up to 350kW [2][12]. - ZTE Corporation showcased a super-node server supporting 64 GPUs and introduced its self-developed 51.2T switching chip [3][29]. - NVIDIA announced a $100 billion investment in OpenAI, with plans to deploy at least 10GW of NVIDIA systems [3][29]. Market Performance Review - The communication index decreased by 0.28% this week, while the Shanghai and Shenzhen 300 index increased by 1.07%, resulting in a relative return of -1.35% [3][41]. - Among the sub-sectors, fiber optic cables, communication equipment manufacturers, and IDC performed relatively well [3][41]. Key Company Earnings Forecast and Investment Ratings - China Mobile: Outperform the Market, with an estimated EPS of 6.72 in 2025 and a PE ratio of 15.74 [5]. - Zhongji Xuchuang: Outperform the Market, with an estimated EPS of 8.08 in 2025 and a PE ratio of 51.18 [5]. - ZTE Corporation: Outperform the Market, with an estimated EPS of 1.79 in 2025 and a PE ratio of 24.83 [5].

燕麦科技 20250924 Q&A 燕麦科技的主业是什么？其核心产品有哪些特点？ 燕麦科技成立于 2012 年，主要业务是 FPC 软板检测设备。FPC 软板是一种由 聚酯薄膜或聚酰亚胺为基材制成的硬质电路，可以嵌入电路设计在弯曲的轻薄 塑料片上，从而能够在狭小空间中堆叠大量精密元件，形成可弯曲的挠性电路。 FPC 软板具有重量轻、体积小、散热性好等特点，可以节约电子产品内部空间， 使组装加工更加灵活。 燕麦科技的 FPC 软板检测设备通过专用定制设备，用针 模等形式与软板上的金手指等电连接点接触，将测试信号输入软板，对整个电 路连通性、信号完整性进行测试。这类检测能够判断软板各个功能单元、电路 通断及信号传输质量等关键指标。燕麦科技的这类设备完全是非标定制化产品， 燕麦科技通过收购新加坡 Aces Tech 切入硅光赛道，后者专注于硅光晶 圆检测和光电耦合领域。硅光技术市场潜力巨大，预计到 2028 年市场 规模将突破 6 亿美元，年化复合增长率高达 44%。 硅光晶圆检测是硅光产业化的关键瓶颈，燕麦科技收购 ACCESS Tech 旨在获取其在硅光晶圆检测设备方面的领先技术。尽管 ACCESS Tech ...

Investment Rating - Industry investment rating: Positive (maintained) [1] Core Insights - The demand for AI computing power is driving the growth of the optical communication industry, with significant advancements in silicon photonics technology, which is becoming the mainstream solution for 1.6T high-speed optical modules [4] - The partnership between OpenAI and NVIDIA aims to deploy at least 10GW of AI data centers, which is expected to double NVIDIA's GPU shipments in 2025, indicating a strong market demand for AI infrastructure [3][4] - The introduction of NVIDIA's Rubin CPX GPU is anticipated to enhance AI application inference and increase demand for liquid cooling solutions, thereby benefiting the liquid cooling sector [5][6] Summary by Sections Industry Overview - The optical communication network is undergoing continuous upgrades, with a focus on new technologies such as OCS, hollow-core fibers, thin-film lithium niobate, and CPO, which are gaining attention and maturity [4] Market Opportunities - The competitive advantages of leading companies in the optical module sector are expected to strengthen, with rising demand for CW lasers and certain passive components [4] - The launch of the Rubin CPX GPU is projected to create additional liquid cooling demand, as it significantly increases processing capabilities and total power consumption [5][6] Recommended Stocks - Strong recommendations for leading companies in the optical module and liquid cooling sectors include: Zhongji Xuchuang, Xinyi Sheng, Yingweike, Tianfu Communication, and Yuanjie Technology [6]

Investment Rating - The report maintains a "Buy-A" rating for the company [1][9] Core Views - The company achieved significant revenue growth in Q2, with a year-on-year increase of 295.4% and a quarter-on-quarter increase of 57.6%, leading to a net profit growth of 338.4% year-on-year [2][4] - The company's production capacity for optical modules increased significantly, with production capacity and output reaching 15.2 million and 7.1 million units respectively, representing growth of 66.7% and 86.4% year-on-year [4] - The gross margin improved to 47.4%, up 2.7 percentage points from the previous year, indicating strong profitability driven by high-end product demand [4] Financial Performance - In the first half of 2025, the company reported revenue of 104.4 billion yuan, a year-on-year increase of 282.6%, and a net profit of 39.4 billion yuan, up 355.7% year-on-year [2][4] - The company expects net profits for 2025, 2026, and 2027 to be 76.8 billion, 147.3 billion, and 198.9 billion yuan respectively, with corresponding P/E ratios of 45.2, 23.6, and 17.5 [9][11] Product Outlook - The company is seeing rapid growth in its 1.6T products, with expectations for increased market share in the second half of the year and further growth in the following year [5] - The company is actively developing silicon photonics and has plans for AEC and CPO optical engine products, which are expected to create new growth opportunities [5] Market Trends - The North American ASIC custom chip market is projected to continue growing, with the company positioned as a key supplier benefiting from this trend [6] - The report highlights that major North American CSPs are increasing capital expenditures, which is expected to positively impact the company's growth trajectory [9]

Group 1 - The AI industry chain stocks, particularly CPO concept stocks, have seen a strong surge, with Dekoli and Huafeng Technology hitting a 20% limit up, reaching new highs [1] - The 26th China International Optoelectronic Expo showcased OCS (Optical Circuit Switch) as a mainstream direction for next-generation switching technology, with multiple manufacturers, including Guangku Technology and Lingyun Optics, presenting their OCS solutions and products [1] Group 2 - The demand for AI computing power is driving the continuous improvement of the optical communication industry, with ongoing upgrades in optical communication networks and the accelerated implementation of silicon photonics technology, which has become the mainstream solution for 1.6T high-speed optical modules [2] - The market is seeing a shift towards 3.2T technology as many manufacturers actively position themselves in this area, with 800G becoming mainstream and the overseas 1.6T market set to expand [2] - The focus on optical chips and passive components is increasing, with the market for hollow-core optical fibers gaining attention as passive components for optical modules accelerate their release [2][3] Group 3 - The competitive advantage and position of leading optical module companies are expected to continue to stand out in the high-speed silicon photonics era, with sustained demand for CW lasers and certain passive components [3] - New technologies such as OCS, hollow-core optical fibers, thin-film lithium niobate, and CPO are developing in parallel, potentially creating new market investment opportunities [3]

Core Viewpoint - The article discusses the rapid development and market potential of silicon photonics technology, highlighting its significance in high-speed optical modules and its projected growth in the semiconductor market by 2030 [2][3]. Group 1: Market Potential and Growth - The global silicon photonics semiconductor market is expected to reach $7.86 billion by 2030, with a compound annual growth rate (CAGR) of 25.7% [2]. - Silicon photonic chips are favored in key applications such as 5G communication, AI data centers, and autonomous driving due to their high integration, low cost, and high transmission bandwidth [2]. Group 2: Components of Silicon Photonic Chips - Silicon photonic chips consist of four key components: - Light source, typically using lasers or LEDs, which generates photons through specific doping or III-V compound materials [3]. - Waveguides, which direct the light along specific paths for efficient data transmission [3]. - Modulators, which alter the light signal's intensity, frequency, or phase to encode electrical signals into optical signals [3]. - Detectors, which convert received light signals back into electrical signals [3]. Group 3: Manufacturing Challenges - The performance of silicon photonic devices is sensitive to manufacturing precision, with minor errors potentially leading to significant performance degradation [4]. - There is a need for targeted optimization of silicon photonic manufacturing processes to enhance waveguide edge smoothness and improve device performance and reliability [4]. Group 4: Upcoming Events and Initiatives - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, focusing on advanced packaging technologies and fostering collaboration between industry and academia [5].