证券之星消息，2025年11月28日晶盛机电（300316）发布公告称长江证券、西部利得、弘尚资产、国寿安保基金、泓德 基金、华商基金、长证国际、建信理财、百年保险资管、东兴基金、合众资产、南方基金、光大保德信、国泰海通资 管、龙航资产、正圆投资、东方基金、道生投资、双安资产、博裕资本、开思私募基金、仙人掌资产、博时基金、三耕 资产、国华兴益、诺安基金、华西基金、青骊投资、金融街证券、笃诚投资、誉辉资本、利位投资、五地、鹏华基金、 智诚海威、山海资本、博远基金、从容投资、磐泽资产、金鹰基金、磐厚动量、富安达基金、泉果基金、同泰基金、太 保资产、恒邦兆丰、聚鸣投资、敦颐资产、淳厚基金、钦沐资产、海富通基金、恒健远志、中邮理财、睿亿投资、无锡 汇蠡投资、前海开源基金、赋格投资、泉汐投资、Marshall Wace、农银汇理、国联安、中银基金于2025年11月27日调研 我司。 具体内容如下： 问：请介绍一下碳化硅衬底材料的应用前景？ 答：SiC是第三代半导体材料的核心代表，因其耐高压、高频、高效等特性，广泛应用于新能源汽车、智能电网、5G通信 等重点行业。同时，在 R设备、CoWoS先进封装中间基板等新兴应用领域 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 近日，三安光电旗下的湖南三安半导体有限责任公司（以下简称"湖南三安"）在长沙隆重举行 以"全'芯'力量，共赴理想"为主题的三安碳化硅芯片上车仪式。此次活动不仅是对湖南三安车规级 碳化硅芯片在性能、可靠性及批量交付能力上获得市场客户认可的重要见证，也标志着湖南三安与 理想汽车自 2022年开展合作以来，战略协同取得实质性突破，双方合作正式进入规模化、深度化 新阶段。 仪式现场，湖南三安总经理江协龙先生发表致辞。他表示："此次碳化硅芯片的成功上车，是湖南 三安从技术攻坚迈向市场引领的关键一步。这一成果充分验证了我们全产业链垂直整合模式在保障 产品品质与供应链稳定上的显著优势。"江协龙强调，未来湖南三安将继续坚定推进以"车规化、平 台化、高效能、全链自主"为核心的发展战略，致力于为理想汽车这样的行业领军企业提供更领 先、更可靠的功率半导体解决方案，共同推动新能源汽车产业的技术进步。 理想汽车动力驱动研发副总裁刘强博士对合作成果给予高度评价。他在发言中指出："与三安的合 作是理想汽车在核心电驱系统供应链上进行前瞻性、深度布局的关键环节。湖南三安在第三代半导 体技术领域的战略布 ...

Investment Rating - The report assigns an IPO-specific rating of 5.1 out of 10 for the company, based on operational performance, industry outlook, valuation, and market sentiment [7]. Core Insights - The company is a leading manufacturer of self-produced silicon carbide (SiC) epitaxial wafers, with a significant market share in China and globally. It has achieved mass production of 4-inch, 6-inch, and 8-inch wafers, with the 6-inch wafers being the core product [1][3]. - The company is positioned as the largest self-produced SiC epitaxial wafer manufacturer in China and the third largest globally, with a revenue market share of 30.6% in China and 6.7% globally for 2024 [1][3]. - The demand for SiC wafers is driven by high-growth sectors such as electric vehicles and power supply, indicating a clear long-term demand support [1][4]. Company Overview - The company has a production capacity of 420,000 wafers per year as of May 2025, with a new production base expected to be operational by the end of 2025, further consolidating its scale advantage [1][4]. - Financial performance shows revenue growth from 437 million yuan in 2022 to 1.171 billion yuan in 2023, but a projected loss of 500 million yuan in 2024. However, in the first five months of 2025, revenue was 257 million yuan, showing a 13.6% year-on-year decline, but net profit turned positive at 9.515 million yuan [2][11]. Industry Status and Outlook - The global market for self-produced SiC epitaxial wafers is expected to grow, with the company capturing a significant share. The industry is characterized by high demand due to the properties of SiC, which are suitable for high-temperature and high-voltage applications [3][4]. - The company benefits from the "new infrastructure" policy in China, which supports semiconductor localization, positioning it favorably for future growth [4]. Strengths and Opportunities - The company has a strong market position as the largest domestic manufacturer of SiC epitaxial wafers, with a significant production capacity and ongoing expansion plans [4]. - It has a robust R&D capability with 84 patents, including 33 invention patents, and is involved in multiple national and international standard-setting projects [4]. - The increasing demand from sectors like electric vehicles and power equipment is expected to drive growth, particularly for 8-inch products, which are becoming mainstream due to their efficiency advantages [4]. Weaknesses and Risks - The average selling price of the 6-inch wafers has decreased significantly from 9,631 yuan per piece in 2022 to 3,138 yuan in the first five months of 2025, which poses a challenge to revenue [5]. - The company faces ongoing capital expenditure pressures, with a cumulative investment of 2.45 billion yuan from 2022 to 2024, and plans for further significant investments in capacity expansion [5].

证券代码：300316 证券简称：晶盛机电 浙江晶盛机电股份有限公司投资者关系活动记录表 编号：2025-12 | 投资者关系活动 | √特定对象调研 □分析师会议 □媒体采访 □业绩说明会 | | --- | --- | | 类别 | □新闻发布会 □路演活动 □现场参观 □电话会议 □其他 | | 参与单位名称及 | 参见附件：参会投资者清单。 | | 人员姓名 | | | 时间 | 年 月 日 2025 11 27 | | 地点 | 电话会议 | | 上市公司接待人 | 投资者关系 林婷婷 | | 员姓名 | | | | 1、请介绍一下碳化硅衬底材料的应用前景？ | | | 是第三代半导体材料的核心代表，因其耐高压、高频、 答：SiC | | | 高效等特性，广泛应用于新能源汽车、智能电网、5G 通信等重点行 | | | 业。同时，在 AR 设备、CoWoS 先进封装中间基板等新兴应用领域， | | | SiC 也正逐步成为推动技术突破的关键材料。 | | | 12 寸碳化硅衬底材料的进展？ 2、请问公司 | | 投资者关系活动 | 答：9 月 26 日，公司首条 12 英寸碳化硅衬底加工中试线在子 | ...

Core Viewpoint - The successful launch of the SiC chip by Hunan Sanan Semiconductor marks a significant milestone in the collaboration between Sanan and Li Auto, indicating a new phase of deep and large-scale cooperation in the automotive semiconductor sector [1][2]. Group 1: Company Developments - Hunan Sanan Semiconductor held a ceremony for the launch of its automotive-grade silicon carbide (SiC) chips, which have gained recognition from top market clients for their performance, reliability, and mass delivery capabilities [1]. - The general manager of Hunan Sanan emphasized that the successful deployment of the SiC chips is a critical step from technological breakthroughs to market leadership, showcasing the advantages of their vertically integrated supply chain model [1]. - Hunan Sanan plans to continue advancing its development strategy centered on "automotive-grade, platform-based, high efficiency, and full-chain self-control" to provide leading power semiconductor solutions for industry leaders like Li Auto [2]. Group 2: Industry Collaboration - Li Auto's Vice President of Powertrain R&D praised the collaboration with Sanan as a key element in the forward-looking and in-depth layout of their core electric drive system supply chain [2]. - The technical exchange session highlighted discussions on enhancing electric drive system efficiency and optimizing charging performance through the use of SiC chips, with both parties recognizing the importance of Hunan Sanan's expertise in 8-inch substrate technology and low defect density processes [2]. - Hunan Sanan presented Li Auto with an 8-inch SiC MOSFET chip product as a symbol of their advanced technological capabilities, commemorating this milestone in their partnership [2]. Group 3: Future Outlook - Over the next three to five years, Sanan plans to increase R&D investment in automotive-grade SiC MOSFET and GaN manufacturing service platforms, aiming to accelerate the ramp-up of its 8-inch production line and improve yield rates [3].

资料显示，安徽楚江科技新材料股份有限公司位于安徽省芜湖市鸠江区龙腾路88号，成立日期2005年12 月21日，上市日期2007年9月21日，公司主营业务涉及有色金属(铜金属)材料的研发、加工、销售,新材 料热工装备业务,高性能碳纤维复合材料预制件生产业务。主营业务收入构成为：铜基材料96.79%，高 端装备、碳纤维复合材料2.09%，钢基材料1.12%。 楚江新材所属申万行业为：有色金属-工业金属-铜。所属概念板块包括：新型工业化、无人机、机器人 概念、低空经济、第三代半导体等。 11月28日，楚江新材盘中上涨2.03%，截至14:13，报11.58元/股，成交4.15亿元，换手率2.25%，总市值 187.94亿元。 资金流向方面，主力资金净流出1058.59万元，特大单买入2211.28万元，占比5.33%，卖出2863.05万 元，占比6.90%；大单买入8251.66万元，占比19.88%，卖出8658.48万元，占比20.86%。 楚江新材今年以来股价涨41.22%，近5个交易日涨7.32%，近20日跌13.13%，近60日涨17.09%。 今年以来楚江新材已经1次登上龙虎榜，最近一次登上龙虎榜为1 ...

Group 1 - The semiconductor-themed ETFs have collectively risen, with notable increases in the Kweichow Moutai Semiconductor ETF (588170), Kweichow Moutai Semiconductor Equipment ETF (588710), and Kweichow Moutai Semiconductor ETF Penghua (589020), all gaining over 3% [1] - Specific performance metrics include Kweichow Moutai Semiconductor ETF at 1.383 with a 3.36% increase, Kweichow Moutai Semiconductor ETF Penghua at 1.121 with a 3.32% increase, and Kweichow Moutai Semiconductor Equipment ETF at 1.425 with a 3.19% increase [2] - The semiconductor industry chain has shown strength, with the third-generation semiconductor sector experiencing significant gains, including a 20% limit-up for Qianzhao Optoelectronics and similar strong performances from Youa Shares and Yaguang Technology [3]

Core Viewpoint - Yandong Microelectronics has shown a significant increase in stock price and trading activity, indicating positive market sentiment and potential growth in the semiconductor sector [1][2]. Stock Performance - Yandong Microelectronics' stock price increased by 26.33% year-to-date, with a recent 11.34% rise over the last five trading days and a 3.26% increase over the last 20 days [2]. - As of November 28, the stock was trading at 25.33 CNY per share, with a market capitalization of 36.162 billion CNY [1]. Trading Activity - The stock experienced a net inflow of 176.14 thousand CNY from main funds, with large orders accounting for 19.20% of total buying and 16.39% of total selling [1]. - Yandong Microelectronics has appeared on the "Dragon and Tiger List" once this year, with the last appearance on October 9, where it recorded a net buy of -62.5807 million CNY [2]. Financial Performance - For the period from January to September 2025, Yandong Microelectronics reported a revenue of 1.167 billion CNY, reflecting an 18.03% year-on-year growth [3]. - The company recorded a net profit attributable to shareholders of -13.4004 million CNY, which is an improvement of 89.02% compared to the previous year [3]. Shareholder Information - As of September 30, 2025, the number of shareholders increased by 24.34% to 21,200, while the average number of tradable shares per person decreased by 19.58% to 27,621 shares [3]. - The company has distributed a total of 47.9642 million CNY in dividends since its A-share listing [4]. Institutional Holdings - Among the top ten circulating shareholders, Yongying Semiconductor Industry Smart Selection Mixed Fund is the seventh largest with 13 million shares, marking a new entry [4]. - The Jiashi Shanghai Stock Exchange Science and Technology Innovation Board Chip ETF holds 6.4795 million shares, an increase of 779,600 shares from the previous period [4].

Core Viewpoint - The stock of Henan Power Diamond Co., Ltd. experienced a decline of 2.41% on November 27, with a trading volume of 365 million yuan and a market capitalization of 9.591 billion yuan [1] Company Overview - Henan Power Diamond Co., Ltd. specializes in the research, production, and sales of synthetic diamond products, including cultivated diamonds, diamond single crystals, and diamond micro-powder [2] - The company was established on November 9, 2010, and went public on September 24, 2021. Its main revenue sources are cultivated diamonds (50.73%), diamond single crystals (35.17%), diamond micro-powder (11.38%), and other products (2.72%) [6] - As of September 30, 2025, the company reported a revenue of 402 million yuan, a year-on-year decrease of 25.36%, and a net profit attributable to shareholders of 46.272 million yuan, down 73.84% year-on-year [6] Industry Application - The company's products are widely used in the processing of third-generation semiconductor materials, particularly in cutting, grinding, and polishing applications [2] - Power Diamond is recognized as one of the early companies in China to achieve mass production of special-shaped octahedral diamond tips for ultra-precision processing of IC chips, with high technical standards and product quality [2] Financial Analysis - The stock's average trading cost is 40.81 yuan, with recent reductions in holdings, although the pace of reduction has slowed. The current stock price is near a resistance level of 37.52 yuan, indicating potential for a price correction if this level is not surpassed [5] - The main capital inflow for the stock today was negative at 24.7081 million yuan, with no clear trend in the main capital flow observed [3][4] Shareholder Information - As of September 30, 2025, the number of shareholders decreased by 1.71% to 26,300, with an average of 7,409 circulating shares per person, an increase of 1.74% [6] - The company has distributed a total of 421 million yuan in dividends since its A-share listing, with 361 million yuan distributed over the past three years [7]

Investment Rating - The report suggests a cautious subscription for Tianyu Semiconductor (2658.HK) [4] Core Insights - The company focuses on the manufacturing of self-produced silicon carbide (SiC) wafers, which are essential raw materials for power semiconductor devices. Compared to traditional semiconductor materials like silicon, SiC offers significant performance advantages, making it suitable for high-voltage, high-temperature, and high-frequency environments [2] - According to Frost & Sullivan, the company ranks as the third-largest SiC wafer manufacturer in China, with a market share of 6.7% by revenue and 7.8% by volume as of 2024 [2] - The global market for SiC power semiconductor devices is projected to grow significantly, from USD 600 million in 2020 to USD 3.2 billion in 2024, representing a compound annual growth rate (CAGR) of 49.8%. The market is expected to reach USD 15.8 billion by 2029, with a CAGR of 40.5% from 2025 to 2029 [3] Summary by Sections IPO Details - The IPO price is set at HKD 58 per share, with a total fundraising amount of HKD 1.6711 billion. The total number of shares offered is approximately 3,007,050 shares, with 90% allocated for international placement and 10% for public offering [1] Financial Performance - The company's revenues for 2022, 2023, and 2024 were RMB 436.86 million, RMB 1,171.21 million, and RMB 519.62 million, respectively. The net profits for the same years were RMB 6.95 million, RMB 101.44 million, and RMB -492.45 million, indicating a decline in 2024 primarily due to reduced market prices and overseas sales of SiC wafers [3] Market Position - The company has an annual production capacity of approximately 420,000 6-inch and 8-inch wafers, making it one of the largest producers in China for these sizes [2] - The presence of Huawei's Hubble Technology as an investor is expected to provide significant growth opportunities for the company in the medium to long term [4]