来源：新浪证券-红岸工作室 12月29日，汇成股份跌0.84%，成交额3.61亿元，换手率2.53%，总市值141.48亿元。 异动分析 存储芯片+先进封装+OLED+芯片概念+人民币贬值受益 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下存储芯片的爆 发式需求。 主力没有控盘，筹码分布非常分散，主力成交额2.56亿，占总成交额的8.59%。 技术面：筹码平均交易成本为16.35元 3、2024年7月3日公司投资者关系活动记录表：公司目前OLED客户主要包括联咏、瑞鼎、奕力、云英 谷、集创北方、芯颖、傲显、昇显微、晟合微等。 4、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品是 集成电路封装测试。 5、根据2024年年报，公司海外营收 ...

资料显示，上海飞凯材料科技股份有限公司位于上海市宝山区潘泾路2999号，成立日期2002年4月26 日，上市日期2014年10月9日，公司主营业务涉及高科技领域适用的紫外固化材料等新材料的研究、生 产和销售。主营业务收入构成为：屏幕显示材料52.32%，半导体材料24.51%，紫外固化材料22.78%， 其他(补充)0.40%。 飞凯材料所属申万行业为：电子-电子化学品Ⅱ-电子化学品Ⅲ。所属概念板块包括：光刻胶、先进封 装、OLED、电子化学品、染料涂料等。 12月29日，飞凯材料（维权）盘中下跌2.02%，截至14:28，报22.75元/股，成交3.96亿元，换手率 3.06%，总市值128.98亿元。 资金流向方面，主力资金净流出6091.51万元，特大单买入2392.55万元，占比6.05%，卖出6758.13万 元，占比17.09%；大单买入8471.81万元，占比21.42%，卖出1.02亿元，占比25.78%。 飞凯材料今年以来股价涨45.32%，近5个交易日跌1.30%，近20日涨2.06%，近60日跌9.83%。 分红方面，飞凯材料A股上市后累计派现3.41亿元。近三年，累计派现1.59亿元。 ...

Core Viewpoint - ShenNan Circuit has shown significant stock performance with a year-to-date increase of 146.00%, indicating strong market interest and potential growth in the PCB industry [1][2]. Company Overview - ShenNan Circuit Co., Ltd. is located in Longgang District, Shenzhen, Guangdong Province, and was established on July 3, 1984. The company was listed on December 13, 2017, and its main business involves the research, production, and sales of printed circuit boards (PCBs) [1]. - The revenue composition of ShenNan Circuit includes: 60.01% from printed circuit boards, 16.64% from packaging substrates, 14.14% from electronic assembly, 5.80% from other supplementary products, and 3.40% from other products [1]. Financial Performance - For the period from January to September 2025, ShenNan Circuit achieved a revenue of 16.754 billion yuan, representing a year-on-year growth of 28.39%. The net profit attributable to shareholders was 2.326 billion yuan, reflecting a year-on-year increase of 56.30% [2]. - Since its A-share listing, ShenNan Circuit has distributed a total of 3.441 billion yuan in dividends, with 1.744 billion yuan distributed over the past three years [3]. Shareholder Information - As of September 30, 2025, the number of shareholders for ShenNan Circuit was 39,500, a decrease of 25.79% from the previous period. The average number of circulating shares per shareholder increased by 34.75% to 16,847 shares [2]. - The top ten circulating shareholders include Hong Kong Central Clearing Limited as the second-largest shareholder with 21.7066 million shares, an increase of 7.4697 million shares from the previous period. New entrants among the top shareholders include Yongying Technology Smart Selection Mixed Fund [3].

Core Viewpoint - The semiconductor industry is shifting from process competition to packaging innovation, with glass substrates emerging as a key material to overcome performance bottlenecks in advanced packaging [1][2]. Group 1: Industry Dynamics - Major companies like Samsung, Intel, AMD, and Nvidia are actively exploring glass substrates for next-generation chip development, indicating a strategic focus on this material [1]. - Recent developments include Japan's Rapidus exploring glass substrate technology and Samsung's plans to establish a joint venture with Sumitomo Chemical for glass substrate production [1][2]. Group 2: Advantages of Glass Substrates - Glass substrates offer significant advantages over traditional organic substrates and silicon interposers, including lower dielectric loss, excellent thermal stability, and high flatness [3][4]. - The electrical performance of glass substrates is superior, with signal transmission loss at 10GHz being only 0.3dB/mm, and dielectric loss reduced by over 50% compared to organic substrates [4]. - Glass substrates can achieve a thermal expansion coefficient (CTE) of 3-5ppm/°C, matching silicon chips and reducing warpage by 70% during thermal cycling [4]. Group 3: Types of Glass Substrates - Glass substrates are categorized into glass interposers and glass core substrates, each serving different roles in advanced packaging scenarios [3][6]. - Glass interposers are primarily used in 2.5D packaging, enabling high-density interconnections between multiple chips [6]. - Glass core substrates are aimed at 3D packaging and chiplet integration, providing a stable solution for increasing chip sizes and I/O counts [8]. Group 4: Industry Competition - The competition in the glass substrate market is intensifying, with companies like Intel, Samsung, TSMC, and new entrants like Rapidus and Absolics making significant investments and strategic moves [12][14][20]. - Intel has invested over $1 billion in developing glass substrate technology and aims for large-scale application by 2026-2030 [12][13]. - Samsung is pursuing a dual-line strategy, focusing on both rapid commercialization and long-term technological breakthroughs in glass substrates [14][15]. Group 5: Challenges and Barriers - The glass substrate industry faces challenges in scaling production, with many companies still in the early stages of development and validation [34][39]. - Key technical challenges include the efficiency and yield of TGV (Through Glass Via) processes, high-density wiring, and bonding reliability [35][41]. - Cost remains a significant barrier, with the production costs of glass substrates being substantially higher than traditional organic substrates, limiting their application in price-sensitive markets [39][40]. Group 6: Domestic Developments - Domestic companies in China are actively pursuing opportunities in the glass substrate market, leveraging their expertise in glass processing and precision manufacturing [23][30]. - Companies like BOE and Wog Glass are making strides in developing glass substrates for semiconductor packaging, with plans for mass production and technological advancements [24][25]. - The establishment of industry alliances and collaborations between academia and industry is fostering innovation and addressing common technical challenges in the glass substrate sector [30][31].

Core Viewpoint - Shengyi Technology has maintained its position as a leading global player in the rigid copper-clad laminate industry, focusing on high-end markets driven by the demand for AI and advanced packaging technologies [5][6]. Group 1: Company Overview - Shengyi Technology has been deeply engaged in the copper-clad laminate and related electronic materials sector for 40 years, consistently ranking second globally in sales since 2013 [5][6]. - The company’s copper-clad laminate production has grown from 600,000 square meters in 1985 to over 140 million square meters projected for 2024, achieving a global market share of 13.7% [6][7]. Group 2: Market Trends and Demand - The demand for high-end copper-clad laminates is increasing due to the rise of AI servers, data centers, and new communication technologies, which require materials with low dielectric loss and high reliability [6][7]. - The company is experiencing a surge in orders as downstream PCB manufacturers stock up in response to rising prices of core raw materials like copper [5][6]. Group 3: Product Development and Innovation - Shengyi Technology has developed a range of products that have received certification from advanced end customers, with applications in AI servers, 5G antennas, and communication networks [7][9]. - The company invests over 4.5% of its revenue in R&D annually, with a projected increase to 5.67% in 2024, reflecting a commitment to innovation and technology advancement [9]. Group 4: Global Expansion and Strategic Initiatives - Shengyi Technology is expanding its global footprint, with recent projects in Thailand aimed at enhancing production capacity and meeting market demands in Southeast Asia and beyond [11]. - The company has established long-term partnerships with major PCB manufacturers and tech giants, positioning itself within the supply chains of the top three global server manufacturers [11].

Core Insights - The report emphasizes that computing infrastructure will drive AI growth, focusing on the transformative "0 to 1" phase in the industry [1][3] - Storage price increases are expected to persist throughout 2026, with advancements in technologies like 4F2 and CBA becoming key development directions [1][3] - The consumer electronics sector faces both cost pressures and innovation opportunities, particularly with the emergence of edge AI chips [1][3] Investment Recommendations - The report suggests monitoring companies in various segments: - Computing: Cambrian, Haiguang Information, Moore Threads, and Muxi [3] - Advanced Manufacturing: SMIC and Huahong [3] - Advanced Packaging: Tongfu Microelectronics and Yongxi Electronics [3] - PCB: Shenghong Technology, Shenzhen South Circuit, and others [3] - Storage: Jiangbolong, Biwei Storage, and others [3] - Edge AI SoC: Amlogic, Hengxuan Technology, and others [3] - Autonomous Driving: Horizon Robotics and others [3] Industry Performance - The report notes that the semiconductor equipment and digital chip design sectors have shown significant revenue growth, with the semiconductor equipment sector achieving a 31% YoY increase [19][20] - The overall electronic industry saw a revenue increase of approximately 19% YoY, with net profits rising by 42% [19][20] - The Shenyuan Electronics Index outperformed the CSI 300 Index, with a growth of about 49.1% compared to 19.2% for the latter [14][15] AI Infrastructure and Market Trends - The demand for AI tokens has surged, with Google processing tokens reaching 1.3 trillion in October 2025, more than double the amount from May 2025 [26][27] - Major cloud service providers are increasing capital expenditures significantly, with North American firms expected to spend $34.96 billion in 2025, a 53% YoY increase [29][36] - The report highlights that the global storage market is projected to grow from $263.3 billion in 2025 to $407.1 billion by 2029, with a CAGR of approximately 11.5% [1][3] Challenges and Opportunities - The consumer electronics sector is expected to face an 8-10% increase in costs in 2025 and 5-7% in 2026 due to rising storage prices [1][3] - Domestic AI chip manufacturers are experiencing both opportunities and challenges, with significant revenue growth reported for companies like Haiguang Information and Cambrian [52][54] - The introduction of NVIDIA's H200 chip could create a "catfish effect," prompting domestic manufacturers to enhance their products and performance [54]

盛剑科技所属申万行业为：环保-环保设备Ⅱ-环保设备Ⅲ。所属概念板块包括：电子化学品、中芯国际 概念、节能环保、集成电路、先进封装等。 截至9月30日，盛剑科技股东户数1.56万，较上期减少5.35%；人均流通股9444股，较上期增加4.66%。 2025年1月-9月，盛剑科技实现营业收入8.31亿元，同比减少16.38%；归母净利润3070.71万元，同比减 少66.43%。 分红方面，盛剑科技A股上市后累计派现1.54亿元。近三年，累计派现7149.67万元。 12月25日，盛剑科技盘中上涨2.16%，截至13:52，报25.97元/股，成交1.09亿元，换手率2.89%，总市值 38.35亿元。 资金流向方面，主力资金净流出145.74万元，大单买入1272.93万元，占比11.72%，卖出1418.67万元， 占比13.06%。 盛剑科技今年以来股价涨0.79%，近5个交易日涨10.46%，近20日涨10.75%，近60日跌6.62%。 资料显示，上海盛剑科技股份有限公司位于上海市嘉定区汇发路301号盛剑大厦，成立日期2012年6月15 日，上市日期2021年4月7日，公司主营业务涉及泛半导体工艺废气治 ...

Core Viewpoint - The semiconductor industry has officially entered the "Wafer Foundry 2.0" era, characterized by deep integration of manufacturing, packaging, and testing, driven by the global AI boom, leading to higher quality growth [4][8]. Group 1: Market Overview - The global wafer foundry 2.0 market revenue is expected to grow by 17% year-on-year in Q3 2025, reaching $84.8 billion, primarily driven by the demand for AI GPUs in front-end wafer manufacturing and advanced packaging [4][8]. - TSMC continues to lead the pure wafer foundry market with a 41% year-on-year revenue growth, supported by the ramp-up of 3nm chips for Apple's flagship smartphones and strong demand from AI accelerator customers like NVIDIA and AMD [7][8]. - Non-TSMC wafer foundries experienced a modest 6% year-on-year revenue growth in Q3 2025, indicating a diminishing effect from previous tariff-related orders, although local subsidy policies in China still provide some support [8][12]. Group 2: Segment Performance - Non-storage IDM manufacturers saw a brief recovery with a 4% year-on-year revenue growth in Q3 2025, led by a 14% increase from Texas Instruments [8][12]. - The OSAT industry continued its growth momentum with a 10% year-on-year revenue increase in Q3 2025, driven by strong demand for advanced packaging, particularly from companies like ASE and SPIL [8][12]. Group 3: Future Outlook - The overall wafer foundry 2.0 market revenue growth for 2025 is projected to be around 15%, with the pure wafer foundry market expected to grow by 26%, supported by ongoing shipments of AI GPUs and ASICs [10]. - TSMC's advanced packaging capabilities are anticipated to continue driving revenue growth into 2026, with a focus on NVIDIA's AI GPU platforms [9][10]. - The OSAT sector is expected to see a significant increase in advanced packaging capacity by 100% in 2026, with AI GPU and ASIC demand becoming the primary growth engines for OSAT manufacturers [12].

Group 1 - The core viewpoint of the news is that ShuoBeide's stock has shown significant growth this year, with a year-to-date increase of 94.43% and a recent surge in trading activity [1][2] - As of December 25, ShuoBeide's stock price was 25.49 yuan per share, with a total market capitalization of 11.726 billion yuan [1] - The company has experienced a net outflow of main funds amounting to 79.98 million yuan, with large orders showing a buy-sell imbalance [1] Group 2 - ShuoBeide's main business involves the research, production, and sales of wireless communication terminal antennas, with revenue composition being 50.50% from antennas, 26.34% from harnesses and connectors, 13.73% from smart sensor modules, and 8.86% from heat dissipation devices [1][2] - For the period from January to September 2025, ShuoBeide achieved operating revenue of 1.990 billion yuan, representing a year-on-year growth of 50.25%, and a net profit attributable to shareholders of 50.71 million yuan, up 1290.66% [2] - The company has not distributed any dividends in the last three years, with a total payout of 116 million yuan since its A-share listing [3]

Core Viewpoint - HuaMao Technology's stock has shown significant growth this year, with a year-to-date increase of 96.14%, indicating strong market performance and investor interest [1]. Financial Performance - For the period from January to September 2025, HuaMao Technology reported revenue of 1.784 billion yuan, a year-on-year increase of 15.87% [2]. - The company's net profit attributable to shareholders was 172 million yuan, reflecting a year-on-year decrease of 12.06% [2]. Stock Market Activity - As of December 25, HuaMao Technology's stock price was 61.83 yuan per share, with a market capitalization of 20.372 billion yuan [1]. - The stock experienced a trading volume of 190 million yuan and a turnover rate of 0.92% on the same day [1]. - The company has appeared on the "Dragon and Tiger List" twice this year, with the most recent appearance on December 12 [1]. Shareholder Information - As of September 30, 2025, the number of shareholders increased by 44.49% to 28,500, while the average number of tradable shares per shareholder decreased by 30.70% to 11,549 shares [2]. - The top ten circulating shareholders include notable funds, with the fifth largest being Bosera Huixing Return Mixed Fund, holding 7.2994 million shares [3]. Business Overview - HuaMao Technology specializes in the research, production, and processing of automotive safety airbag fabrics and bags, with its main revenue sources being airbag bags (66.23%) and airbag fabrics (26.44%) [1]. - The company is classified under the automotive industry, specifically in the automotive parts sector, and is involved in various concept sectors including photoresists and advanced packaging [1].