Core Viewpoint - Apple's upcoming M5 chip for high-end MacBook Pro will feature a new Liquid Molded Plastic (LMC) supplied exclusively by Taiwan's Changxin Materials, which is expected to enhance performance and efficiency in the coming years [2][3]. Group 1: Chip Technology and Performance - The M5 chip will not fully utilize CoWoS technology initially, but the adoption of compatible materials is a strategic move for future iterations [3]. - LMC will provide advantages such as structural integrity, better heat dissipation, and higher manufacturing efficiency, contributing to stable performance and increased efficiency [3]. - Future M6 or M7 chips may fully adopt CoWoS or even CoPoS packaging technologies, allowing for larger and more complex processors capable of handling demanding workloads [3][4]. Group 2: Supply Chain and Procurement Strategy - Changxin Materials has outperformed Japanese suppliers Namics and Nagase to secure the contract, indicating a shift in Apple's procurement strategy towards greater reliance on Taiwanese suppliers [3]. - This change grants Apple more flexibility in control and R&D collaboration within advanced chip materials [3]. Group 3: Future Developments and Cost Considerations - Apple is exploring other packaging technologies to enhance chip performance and reduce costs, with the A20 series chips expected to transition from InFO to multi-chip module packaging (WMCM) by 2026 [6][7]. - WMCM will utilize Molding Underfill (MUF) technology, which integrates bottom filling and molding processes to reduce material consumption and improve yield and efficiency [7]. - Apple is also considering System on Integrated Chips (SoIC) technology for the M5 series, allowing for high-density connections between stacked chips to reduce latency and enhance performance [8].

Core Viewpoint - Samsung's quarterly financial report indicates a significant decline in total operating profit by over 50% due to challenges in the semiconductor business, yet it highlights the upcoming Exynos 2600 chip as a key development, which will be the first 2nm chipset on the market [2]. Group 1: Exynos 2600 Chip Details - The Exynos 2600 will be manufactured using Samsung's 2nm Gate-All-Around (GAA) process and is set to launch alongside the Galaxy S26 series [2]. - The chip features a 1+3+6 core configuration with a single-core frequency of 3.55 GHz, performance cores at 2.96 GHz, and efficiency cores at 2.46 GHz [3]. - The Exynos 2600 is expected to include the Xclipse 960 GPU, which is projected to outperform Qualcomm's Adreno 830 by 15% [3]. Group 2: Product Launch and Market Position - The Exynos 2600 is anticipated to debut in the Galaxy S26 Pro and S26 Edge models, while the S26 Ultra will likely continue to utilize Qualcomm's Snapdragon 8 Elite 2 [3].

Market Performance - The main board led the gains with notable increases in stocks such as Chunzhong Technology (+10.00%), Zhongjia Bochuang (+10.00%), and Cambridge Technology (+9.99%) [1] - The ChiNext board saw significant growth with companies like Siquan New Materials (+20.00%), Digital Certification (+20.00%), and Yidian Tianxia (+20.00%) [1] - The Sci-Tech Innovation board was also strong, highlighted by Dongxin Co., Ltd. (+19.99%), Suochen Technology (+10.63%), and Dingtong Technology (+10.24%) [1] - Active sub-industries included SW Horizontal General Software (+3.04%) and SW Marketing Agency (+2.50%) [1] Domestic News - Lianhui Technology launched Homer AI assistive glasses, designed for visually impaired individuals, featuring real-time environmental perception and multi-modal interaction [1] - MediaTek reported a consolidated revenue of NT$150.37 billion for Q2 2025, a 1.9% decrease quarter-on-quarter but an 18.1% increase year-on-year, with a net profit of NT$28.06 billion [1] - Shengbang Microelectronics introduced the SGM4020, a low-drift, low-power, high-precision voltage reference device applicable in industrial, communication, and medical equipment [1] - MediaTek indicated strong growth momentum in several business areas, including flagship smartphones and communication products, and plans to enter the 2nm advanced process technology [1] Company Announcements - Shengshi Technology announced the acquisition of multiple invention patents, including technologies for automatic luggage packing locks and AI visual sealing devices [3] - Zhongke Jincai reported a total operating income of 345 million yuan for H1 2025, a year-on-year increase of 14.36%, but a net profit loss of 85 million yuan, down 71.51% year-on-year [3] - Ankai Micro disclosed the launch of the AK1037 series low-power lock control SoC chip, designed for smart locks, featuring a RISC-V core and high integration [3] - Zhiwei Intelligent announced a provision for inventory impairment losses amounting to 42.18 million yuan, representing 33.76% of the audited net profit for 2024 [3] Overseas News - Coherent opened a new factory in Vietnam with an investment of $127 million, focusing on the production of silicon carbide semiconductors and optical glass [3] - A trade agreement between the US and EU imposes a 15% tariff on European manufactured goods entering the US, with exemptions for certain categories like semiconductor manufacturing equipment [3] - WITS announced its subsidiary Beyondi's acquisition of Beacon INC's display business to enhance competitiveness in the display sector [3] - Samsung Electronics expects HBM3E chip sales to account for 90% of its total sales in the second half of the year and has begun distributing samples of the next-generation HBM4 chips [3]

Core Viewpoint - Fujitsu is transitioning its focus from high-performance computing to scalable traditional data center infrastructure with its next-generation processor, Monaka, which is designed for cloud-native workloads and aims for efficient, secure computing [1][2][37]. Group 1: Monaka Processor Overview - Monaka is built on a 2nm core chip with a 3D multi-core layout, optimized for air-cooled servers and conventional memory, targeting confidential computing and low-voltage operation [1][3][6]. - The processor will feature 144 Armv9-A cores per slot in a dual-slot configuration, totaling 288 cores, and is designed for standard 2U data center servers [3][6]. - Monaka aims to achieve generational improvements in application performance and performance per watt, with a projected launch in fiscal year 2027 [10][38]. Group 2: Design and Efficiency - The design incorporates advanced silicon for critical areas while using more cost-effective processes for larger SRAM and IO chips, aligning with Japan's energy efficiency goals [6][10]. - Monaka will utilize DDR5 and PCIe Gen6 for high throughput IO, avoiding special packaging or HBM to enhance memory bandwidth [6][10]. - The chip is expected to have a power consumption of less than 500W, suitable for standard server racks, focusing on scalability and efficient throughput rather than peak floating-point performance [6][10]. Group 3: Security and Reliability - Monaka emphasizes trust with hardware-level isolation, workload protection, and system resilience, positioning it as a confidential computing platform for multi-tenant environments [19][22]. - It features full memory encryption and a hardware root of trust to enhance system-level security and verify firmware authenticity [22][19]. - Reliability features include error detection and correction mechanisms, thermal control, and maintainability, aiming for high uptime in large-scale distributed deployments [22][19]. Group 4: Software and Ecosystem - Monaka is designed to run standard Linux stacks, supporting upstream distributions and common development tools, ensuring compatibility and accessibility for developers [24][27]. - The development stack will support LLVM, GCC, and Python, maintaining consistency with tools used in previous Fujitsu architectures [27][24]. - Monaka will support CXL 3.0 for composable infrastructure and PCIe Gen6 for compatibility with next-generation storage and networking devices [30][24]. Group 5: Market Positioning - Fujitsu positions Monaka as a "mainframe-class" processor, focusing on predictable behavior, lifecycle control, and secure leasing, rather than just throughput aggregation [31][34]. - The processor targets markets that require platform integrity, such as sovereign cloud deployments, telecommunications, and defense sectors, emphasizing reliability over raw performance [34][31]. - Monaka represents a continuation of Fujitsu's decades-long experience in processor design, transitioning from SPARC to Arm architecture while prioritizing control and integration [35][37].