Core Viewpoint - Apple's upcoming M5 chip for high-end MacBook Pro will feature a new Liquid Molded Plastic (LMC) supplied exclusively by Taiwan's Changxin Materials, which is expected to enhance performance and efficiency in the coming years [2][3]. Group 1: Chip Technology and Performance - The M5 chip will not fully utilize CoWoS technology initially, but the adoption of compatible materials is a strategic move for future iterations [3]. - LMC will provide advantages such as structural integrity, better heat dissipation, and higher manufacturing efficiency, contributing to stable performance and increased efficiency [3]. - Future M6 or M7 chips may fully adopt CoWoS or even CoPoS packaging technologies, allowing for larger and more complex processors capable of handling demanding workloads [3][4]. Group 2: Supply Chain and Procurement Strategy - Changxin Materials has outperformed Japanese suppliers Namics and Nagase to secure the contract, indicating a shift in Apple's procurement strategy towards greater reliance on Taiwanese suppliers [3]. - This change grants Apple more flexibility in control and R&D collaboration within advanced chip materials [3]. Group 3: Future Developments and Cost Considerations - Apple is exploring other packaging technologies to enhance chip performance and reduce costs, with the A20 series chips expected to transition from InFO to multi-chip module packaging (WMCM) by 2026 [6][7]. - WMCM will utilize Molding Underfill (MUF) technology, which integrates bottom filling and molding processes to reduce material consumption and improve yield and efficiency [7]. - Apple is also considering System on Integrated Chips (SoIC) technology for the M5 series, allowing for high-density connections between stacked chips to reduce latency and enhance performance [8].