2025年12月15日，多方可靠信息显示，苹果计划于明年9月推出首款可折叠形态的iPhone，该机型将与 iPhone 18 Pro系列一同亮相。据业内人士透露，这款设备目前采用"阔折叠"设计，屏幕比例接近华为 Pura X的方案，旨在兼顾展开体验与握持便携性。 影像系统方面，新机配备后置大底双摄模组，主摄像头 为4800万像素，支持传感器位移式光学防抖，保障成像 稳定性与画质表现。生物识别方案迎来重大调整，取消 沿用多年的Face ID，转而采用侧边电源键集成Touch ID 的设计，类似于当前iPad的指纹识别方案，此举有助于 节省机身内部空间，也是iPhone产品线多年后重新引入 指纹识别功能。 硬件配置上，该机型将搭载A20系列芯片，匹配 LPDDR5X内存与UFS 4.0闪存，整体性能水平与同期Pro 系列iPhone相当。通信方面，采用苹果第二代自研C2基 带，仅支持eSIM网络连接，不再设置物理SIM卡槽。 价格定位较高，预计在美国市场的起售价为1800至2500 在屏幕配置方面，新机将配备内外双屏。外屏尺寸为5.5英寸，分辨率达到2088×1422，像素密度为 460PPI，采用超小开孔的HI ...

Core Insights - The highly anticipated first foldable iPhone will feature the flagship A20 Pro chip [1] - The A20 series will continue Apple's dual-track strategy, with the standard iPhone 18 using the standard A20 chip, while the Pro series and the foldable model will utilize the A20 Pro [4] - There is no mention of the expected iPhone Air 2 in the leaked information, but it is anticipated that it will upgrade to the A20 Pro chip, completing the flagship product matrix [4] - Due to the cost pressures from the 2nm process and investments in foldable screen development, analysts predict a new round of price increases for next year's iPhone series [4]

Core Viewpoint - Apple's upcoming M5 chip for high-end MacBook Pro will feature a new Liquid Molded Plastic (LMC) supplied exclusively by Taiwan's Changxin Materials, which is expected to enhance performance and efficiency in the coming years [2][3]. Group 1: Chip Technology and Performance - The M5 chip will not fully utilize CoWoS technology initially, but the adoption of compatible materials is a strategic move for future iterations [3]. - LMC will provide advantages such as structural integrity, better heat dissipation, and higher manufacturing efficiency, contributing to stable performance and increased efficiency [3]. - Future M6 or M7 chips may fully adopt CoWoS or even CoPoS packaging technologies, allowing for larger and more complex processors capable of handling demanding workloads [3][4]. Group 2: Supply Chain and Procurement Strategy - Changxin Materials has outperformed Japanese suppliers Namics and Nagase to secure the contract, indicating a shift in Apple's procurement strategy towards greater reliance on Taiwanese suppliers [3]. - This change grants Apple more flexibility in control and R&D collaboration within advanced chip materials [3]. Group 3: Future Developments and Cost Considerations - Apple is exploring other packaging technologies to enhance chip performance and reduce costs, with the A20 series chips expected to transition from InFO to multi-chip module packaging (WMCM) by 2026 [6][7]. - WMCM will utilize Molding Underfill (MUF) technology, which integrates bottom filling and molding processes to reduce material consumption and improve yield and efficiency [7]. - Apple is also considering System on Integrated Chips (SoIC) technology for the M5 series, allowing for high-density connections between stacked chips to reduce latency and enhance performance [8].