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长电科技(600584):2024年年报点评:先进封装技术+产能全球化布局,变局中积蓄向上动能
Changjiang Securities· 2025-04-27 12:43
Investment Rating - The investment rating for the company is "Buy" and is maintained [7]. Core Insights - In 2024, the company achieved operating revenue of 35.962 billion yuan, a year-on-year increase of 21.24%, and a net profit attributable to shareholders of 1.610 billion yuan, up 9.44% year-on-year [2][4]. - The company continues to optimize its product structure and global layout, maintaining robust growth driven by the recovery of the semiconductor industry and structural differences in downstream applications [10]. - The company has made significant investments in advanced packaging technology and capacity expansion, particularly in AI and automotive electronics, which are expected to drive future growth [10]. Financial Performance - In Q4 2024, the company reported operating revenue of 10.984 billion yuan, a year-on-year increase of 18.99% and a quarter-on-quarter increase of 15.72%, with a net profit of 533 million yuan, up 7.28% year-on-year and 16.66% quarter-on-quarter [10]. - The gross margin for Q4 2024 reached 13.34%, an increase of 1.12 percentage points quarter-on-quarter, while the net profit margin rose to 4.93%, up 0.14 percentage points quarter-on-quarter [10]. - The company’s capital expenditure in Q4 2024 was 1.502 billion yuan, a year-on-year increase of 116.21% and a quarter-on-quarter increase of 23.17%, laying a strong foundation for future growth [10]. Market Segmentation - In 2024, the revenue breakdown by market application was as follows: Communication Electronics 44.8%, Consumer Electronics 24.1%, Computing Electronics 16.2%, Automotive Electronics 7.9%, and Industrial and Medical Electronics 7.0% [10]. - The computing electronics segment saw a year-on-year revenue growth of 38.1%, while the automotive segment grew by 20.5%, both outperforming market averages [10]. Subsidiary Performance - Key subsidiaries reported the following revenues: Xinke Jinpeng 12.185 billion yuan (up 7.39%), Changdian Korea 15.815 billion yuan (up 28.93%), and Changdian Advanced 1.688 billion yuan (up 35.36%) [10]. - Net profits for these subsidiaries were 1.893 billion yuan, 307 million yuan, and 325 million yuan, respectively, with net profit margins of 19.25% and 15.54% for Changdian Advanced and Xinke Jinpeng [10]. Research and Development - The company maintained a strong focus on R&D, with total R&D expenditure reaching 1.718 billion yuan in 2024, a year-on-year increase of 19.33% [10]. - Plans for 2025 include increased investment in advanced packaging R&D, targeting breakthroughs in high-end 3D packaging and other key areas [10].
金价一路高涨,封测厂被迫涨价
半导体行业观察· 2025-04-22 00:49
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容来自经济日报,谢谢。 国际金货价昨(21)日冲上每英两3,400美元新天价,半导体当中,用于面板驱动IC的金凸块封装 (gold bumping)制程因大量使用黄金作为原材料,金价一路飙高,国内两大面板驱动IC封测厂 颀邦、南茂「不忍了」,传近期同步调升报价,成为此波金价飙涨,半导体业者调高报价首例。 颀邦为全球最大专业驱动IC封测厂,终端客户包含苹果、索尼、京东方等国际大厂,掌握市场上 主要的金凸块封装制程订单。法人预计,这波金价上涨带来的材料成本调升,颀邦有机会反映在报 价上。 南茂在驱动IC封装制程同样手握不少订单,虽然代工价格不变,但同样可望调升封装报价。颀 邦、南茂等两大厂成为金价上涨带来涨价效益的半导体大厂。 法人指出,过去封测厂在驱动IC市场上价格竞争激烈,金价上涨可能使毛利率下滑,但现在因地 缘政治关系,专攻驱动IC厂商减少,厂商现在可以反映成本,降低黄金涨价对毛利率的冲击。 业界人士指出,晶圆凸块(wafer bumping)是在晶圆上所长的金属凸块,每个凸点皆是IC信号接 点。金属凸块多用于体积较小的封装产品上。凸块种类有金凸块、共晶锡铅 ...
半导体封测业绩哪家强?通富微电延长相关设备折旧年限致净利润大涨,汇成股份增收不增利
Mei Ri Jing Ji Xin Wen· 2025-04-15 13:29
Core Viewpoint - The recent performance reports of major semiconductor packaging and testing companies in the A-share market indicate a mixed outlook, with significant growth in net profits for Tongfu Microelectronics and Huada Semiconductor, while Huicheng Co., focused on display driver chip packaging, faces declining profits due to increased competition and lower gross margins [1][2][3]. Group 1: Performance Summary of Major Companies - Longji Technology reported a revenue of 35.96 billion yuan for 2024, a year-on-year increase of 21.2%, and a net profit of 1.61 billion yuan, up 9.5% [1]. - Tongfu Microelectronics achieved a revenue of 23.882 billion yuan, a growth of 7.24%, with a remarkable net profit increase of 299.9% to 677 million yuan [1][2]. - Huada Technology's revenue reached 14.462 billion yuan, reflecting a growth of 28%, while its net profit increased by 172.29% to 616 million yuan [1]. Group 2: Financial Dynamics and Challenges - The significant net profit growth for Tongfu Microelectronics and Huada Technology is based on a low comparison from 2023, where their profits had previously declined [2]. - Despite the net profit surge, Tongfu Microelectronics experienced a decline in net cash flow from operating activities, which fell by 9.68% to 3.877 billion yuan, attributed to increased depreciation expenses [2]. - The EBITDA for Tongfu Microelectronics was reported at 4.815 billion yuan, showing a modest growth of 9.38% [2][3]. Group 3: Industry Competition and Gross Margin Trends - Huicheng Co. reported a revenue of 1.501 billion yuan for 2024, a year-on-year increase of 21.22%, but its net profit decreased by 18.48% to 160 million yuan due to intensified competition in the display driver chip packaging sector [3][4]. - The average gross margin for Huicheng Co. was 22.34%, down 4.83 percentage points, while Tongfu Microelectronics and Huada Technology reported lower gross margins of 14.50% and 12.29%, respectively [4][5]. - The competitive landscape is expected to further pressure gross margins, as new entrants and expanded capacities in the display driver chip packaging market could lead to price declines [5].
长电科技(600584):2024年业绩快报、25Q1业绩预告点评:2024年营收创历史新高,业务结构持续优化
Dongguan Securities· 2025-04-09 08:52
Investment Rating - The report maintains a "Buy" rating for the company, indicating an expectation that the stock will outperform the market index by more than 15% in the next six months [6][8]. Core Insights - The company achieved a record high revenue of 35.96 billion yuan in 2024, representing a year-on-year growth of 21.2%. The net profit attributable to shareholders was 1.61 billion yuan, up 9.5% year-on-year, with a non-GAAP net profit of 1.55 billion yuan, increasing by 17.4% [2][5]. - For Q1 2025, the company anticipates a net profit of approximately 200 million yuan, reflecting a year-on-year growth of around 50% [2][5]. - The company is focusing on advanced packaging technology and high-value applications, particularly in automotive electronics, high-performance computing, storage, and 5G communications, which is expected to further optimize its business structure [3][5]. Summary by Sections Financial Performance - In 2024, the company reported a total revenue of 35.96 billion yuan, a 21.2% increase from the previous year. The net profit for the same year was 1.61 billion yuan, marking a 9.5% increase. The Q4 2024 net profit reached 534 million yuan, showing a significant year-on-year increase of 295.56% and a quarter-on-quarter growth of 16.85% [2][5]. - The company forecasts a net profit of 200 million yuan for Q1 2025, which, despite a seasonal decline, represents a 50% increase compared to the same period last year [5]. Industry Context - The global semiconductor industry is experiencing a recovery, with a projected sales increase of 19.1% in 2024, reaching 627.6 billion USD. The company, as a leading player in the packaging and testing sector, is capitalizing on this trend by focusing on key application markets such as communications, consumer electronics, computing, and automotive electronics [5][6].
A股反弹,A50直线上涨!
21世纪经济报道· 2025-04-08 04:14
作 者丨张赛男 编 辑丨巫燕玲 刘雪莹 ETF放量、富时中国A5 0指数期货直线拉升、创业板指反弹! 农业股持续大涨,北大荒等1 0余股涨停。大消费股震荡反弹,零售方向领涨,永辉超市等多股涨停。中字头、基建股一度冲高,中国中车接 近涨停。 港股走强,恒生指数涨1 . 5 8%,恒生科技指数涨3 . 5 7%。金山云、越疆、茶百道涨超1 0%,小米集团涨超5%。 4 月 8 日 早 盘 , 中 证 5 0 0ETF ( 5 1 0 5 0 0 ) 成 交 超 6 3 亿 , 南 方 中 证 1 0 0 0ETF ( 5 1 2 1 0 0 ) 、 华 夏 中 证 1 0 0 0ETF ( 1 5 9 8 4 5 ) 、 广 发 中 证 1 0 0 0ETF (5 6 0 0 1 0)、富国中证1 0 0 0ETF(1 5 9 6 2 9)成交超1 0亿元,均超昨日全天成交额。 | 159575 | 宽 创业板200ETF银华 | 1.021 | 0.033 | 3.34% | | --- | --- | --- | --- | --- | | 589630 | 宽 科创综指ETF国泰 | 0.841 | 0.0 ...
汇成股份: 合肥新汇成微电子股份有限公司向不特定对象发行可转换公司债券受托管理事务报告(2024年度)
Zheng Quan Zhi Xing· 2025-04-02 14:25
Group 1 - The company, Hefei Xinhui Microelectronics Co., Ltd., issued 1,148,700 convertible bonds with a total fundraising amount of RMB 1,148.70 million, netting RMB 1,142.53 million after deducting issuance costs [1][19] - The bonds have a maturity of 6 years, from August 7, 2024, to August 6, 2030, with an annual interest rate that increases from 0.20% in the first year to 2.00% in the sixth year [2][4] - The initial conversion price for the bonds is set at RMB 7.70 per share, with provisions for adjustments based on various corporate actions [6][10] Group 2 - In 2024, the company reported a revenue increase of 21.22% year-on-year, reaching RMB 150.10 million, while net profit decreased by 18.48% to RMB 15.98 million due to increased fixed costs and competitive pressures [19] - The company's gross profit margin declined by 4.83 percentage points to 22.34%, influenced by higher depreciation costs and increased financial expenses from prior investments [19] - The company’s total assets increased by 27.67% year-on-year, amounting to RMB 459.12 million at the end of 2024 [19]
华天科技披露2024年年报,这一细节值得关注
Mei Ri Jing Ji Xin Wen· 2025-04-01 15:12
Group 1: Company Developments - Huatian Technology (华天科技) reported its 2024 annual report, highlighting ongoing research and development in advanced packaging technologies, particularly focusing on Chiplet, automotive electronics, and board-level packaging [1] - The company has completed the construction and equipment debugging of its 2.5D production line, which is crucial for mainstream computing chips [1] - Huatian's R&D investment aims to develop 2.5D packaging technology for applications in AI, big data, and high-performance computing, with a goal to increase market share [1] Group 2: Industry Trends - Changdian Technology (长电科技) is also investing in 2.5D packaging technology, with its XDFOI®Chiplet series entering stable mass production [2] - This technology focuses on high-density heterogeneous integration solutions, covering 2D, 2.5D, and 3D integration technologies, indicating a trend towards collaborative design and integrated testing [2] - Both Huatian and Changdian are prioritizing R&D in high-performance computing 2.5D advanced packaging, while Tongfu Microelectronics (通富微电) has not reported similar projects in its 2023 annual report [3] Group 3: Competitive Landscape - Tongfu Microelectronics is upgrading its large-size multi-chip Chiplet packaging technology, developing new processes to enhance chip reliability, although it lacks a focus on 2.5D packaging [3] - The competitive landscape shows a clear focus among leading companies on advanced packaging technologies, particularly in the context of high-performance computing and AI applications [2][3]
电子行业2025年一季度业绩前瞻:1Q25业绩整体向好,重点关注算力国产化及存储涨价
申万宏源· 2025-03-25 08:49
Investment Rating - The report gives a positive outlook on the electronic industry, indicating a "Look Favorably" rating for 2025 [4][9]. Core Insights - The report highlights the benefits of domestic computing power and storage price increases, with significant advancements in AI model applications and cloud capital expenditures [5][6]. - The automotive sector is expected to see a commercial breakthrough in high-level autonomous driving, with a notable increase in penetration rates due to cost reductions [5]. - The storage sector is experiencing a supply contraction, with major manufacturers like Micron announcing price increases of over 10% for NAND flash memory [5]. - Semiconductor equipment and components are projected to see improved profitability, with revenue growth expected to exceed 40% in Q1 2025 [5]. - The report emphasizes the importance of domestic semiconductor manufacturing capabilities amid U.S.-China trade tensions, particularly in advanced processes [5]. - The consumer electronics market is showing signs of recovery, with new product launches from major brands like Apple and Xiaomi [5]. Summary by Sections Computing Power and Storage - The report notes the rise of domestic computing power chains benefiting from new AI models and increased capital expenditures from cloud service providers [5]. - Major storage manufacturers are adjusting prices upwards due to supply constraints, with a reported 35% reduction in NAND production capacity [5]. Automotive Sector - The report anticipates a significant increase in the adoption of high-level autonomous driving features, with mainstream automakers competing to offer these technologies in more affordable models [5]. Semiconductor Equipment - Revenue growth for semiconductor equipment companies is expected to exceed 40% in Q1 2025, driven by increased orders from wafer fabs [5][6]. - The report predicts a gradual increase in domestic component manufacturing rates, enhancing revenue growth prospects [5]. Consumer Electronics - The report highlights the launch of new consumer electronics products, indicating a recovery in demand, although smartphone shipments saw a year-on-year decline of 17% in January 2025 [5][6]. Key Company Predictions - The report provides detailed revenue and profit forecasts for various companies in the electronic sector, indicating strong growth for firms like North Huachuang and Zhongwei [6][9].