类载板(SLP)

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鹏鼎控股: 2025年半年度报告
Zheng Quan Zhi Xing· 2025-08-12 12:08
Core Viewpoint - The report highlights the strong financial performance of Avary Holding (Shenzhen) Co., Ltd. for the first half of 2025, with significant growth in revenue and net profit, driven by increased customer orders and market demand in the PCB industry [1][2]. Company Overview and Financial Indicators - The company reported a revenue of approximately 16.38 billion yuan, representing a 24.75% increase compared to the same period last year [2][19]. - The net profit attributable to shareholders reached approximately 1.23 billion yuan, marking a 57.22% increase year-on-year [2][19]. - The company plans not to distribute cash dividends or issue bonus shares [1]. Business Operations - The company operates in the printed circuit board (PCB) manufacturing industry, which is essential for various electronic products, including communications, consumer electronics, and automotive applications [3][4]. - The company employs a make-to-order production model, ensuring customized production to meet client needs [4][5]. - The company has established a robust supplier evaluation system to ensure quality and efficiency in procurement [5]. Industry Position - The company is recognized as one of the few large manufacturers capable of providing comprehensive PCB solutions, including FPC, SMA, SLP, HDI, RPCB, and Rigid Flex products [6][11]. - According to Prismark, the global PCB industry is projected to grow, with a total output value of approximately 79.13 billion USD in 2025, reflecting a 7.6% year-on-year increase [3][6]. Performance Drivers - The demand for FPC products is expected to grow significantly due to advancements in AI and mobile devices, with a projected annual growth rate of 4.5% from 2024 to 2029 [7][8]. - The company has a market share of over 30% in the global FPC market, positioning it as a leader in this segment [8][10]. - The high-density interconnect (HDI) products are also experiencing rapid growth, driven by the increasing performance requirements of AI servers [9][10]. Financial Management - As of June 30, 2025, the company maintained a low debt-to-asset ratio of 29.24% and had cash assets amounting to approximately 13 billion yuan [10][18]. - The company has consistently returned value to shareholders, with a cumulative dividend payout of approximately 9.72 billion yuan since its listing [18]. Revenue Composition - The revenue from communication boards accounted for approximately 62.7% of total revenue, while consumer electronics and computing boards contributed about 31.6% [19]. - The automotive/server board segment saw a remarkable growth of 87.42%, reflecting the increasing demand in the AI server market [16][19].
PCB为何飙涨?胜宏科技本轮拉升146%,电子ETF(515260)盘中涨超1.1%
Xin Lang Ji Jin· 2025-07-28 06:40
Group 1 - The PCB (Printed Circuit Board) industry stocks have seen significant gains, with notable increases in companies such as Pengding Holdings, Shenghong Technology, and Shennan Circuit [1][4] - The electronic ETF (515260) has also performed well, with a mid-day price increase of over 1.1% [1] - Since April 8, the PCB sector has shown strong performance, with Shenghong Technology rising over 146%, Dongshan Precision over 99%, and Shengyi Technology over 64% [2][4] Group 2 - Over 13.7 billion yuan of main funds have flowed into the electronic sector, with the components sector receiving a net inflow of 10.016 billion yuan, the highest among all secondary industries [3] - Shenghong Technology has attracted a net inflow of 2.111 billion yuan, ranking third in A-share capital absorption [3] Group 3 - The recent surge in the PCB industry is driven by several key factors, including the demand for high-end PCBs due to major companies like Meta, Google, and Amazon investing in self-developed AI chips [5] - The number of layers in AI server PCBs has increased from 20 to over 40, resulting in a value increase of 3-5 times [5] Group 4 - Breakthroughs in high-frequency materials and processes have occurred, such as the introduction of low-dielectric-loss materials by Shengyi Technology, which competes with Japanese companies [6] - Shenghong Technology has achieved mass production of 70-layer high-precision boards, with AI business revenue accounting for 60% [6] Group 5 - The automotive electronics and consumer electronics sectors are recovering, with the value of PCBs in electric vehicles increasing significantly due to the rise of smart driving technologies [7] - The demand for flexible boards and substrate-like PCBs is being driven by the iteration of AI in consumer electronics, with Pengding Holdings becoming the exclusive supplier for Apple's AI phone SL boards [8] Group 6 - The PCB industry's current growth is fundamentally driven by "AI computing infrastructure + technological upgrades + domestic substitution" [8] - The demand for AI servers and automotive electronics is expected to continue supporting high growth in performance [8] Group 7 - The electronic sector is anticipated to experience a series of catalysts, supported by strong performance in financial reports [8] - The North American computing power surge is becoming a major emotional driver for the industry [9]
新战场!一场围绕“电路板”的全球竞争正在升级
21世纪经济报道· 2025-06-22 15:42
Core Viewpoint - The PCB industry is experiencing a technological revolution driven by the demand from AI data centers, electric vehicles, foldable phones, and robotics, leading to a significant increase in PCB demand and domestic manufacturers accelerating high-end capacity expansion [1] Group 1: AI Servers - AI servers require advanced PCBs with increased layers, leading to a cost increase of 3 times compared to traditional boards, with prices for specialized materials being over 5 times that of standard materials [2][4] - Major manufacturers like Shenghong Technology and Huadian Co. have AI server PCB orders booked until Q1 2026, with some companies operating at full capacity 24/7 [4] - The global market for high-layer PCBs (18 layers and above) is expected to grow at a rate of 41.7% by 2025 [4] Group 2: Electric Vehicles - The value of PCBs in electric vehicles has doubled, with a single vehicle's PCB value reaching 1500-2000 RMB, which is twice that of traditional fuel vehicles [5] - Advanced driving systems require 16-layer HDI boards, with prices exceeding 5000 RMB, and domestic market share for these boards has increased from 30% in 2023 to 45% [6] - The global automotive PCB market is projected to reach 9.4 billion USD by 2025, driven by the production of 77GHz radar boards for Tesla's Robotaxi [9] Group 3: Consumer Electronics - The integration level in consumer electronics is increasing, with the mainboard area of the iPhone 16 Pro reduced by 20.7% while accommodating more AI chips, thanks to SLP technology [10] - Companies like Pengding Holdings are investing significantly in expanding high-end HDI production lines, with a 50% increase in capacity at their Huai'an factory [10] - The penetration rate of HDI boards in consumer electronics is expected to exceed 35% due to the rise of AI PCs, with monthly order growth of 20% for AI PC PCBs [10] Group 4: Robotics - The demand for PCBs in the robotics sector is structurally increasing, with companies like Yushu Technology and UBTECH focusing on high-density and high-reliability PCB requirements [11] - The robotics industry is pushing for upgrades in PCB technology, indicating a broad long-term growth potential [11] Group 5: Industry Outlook - The global PCB market is expected to grow at a CAGR of 5.2% from 2024 to 2029, with AI servers, 800G switches, and robotics applications driving a 3-5 percentage point increase in industry gross margins [13] - The PCB industry is currently in a dual-cycle resonance period of "technological upgrades and domestic substitution," with companies like Shenghong Technology and Shengyi Technology poised for breakthroughs in AI computing, automotive electronics, and robotics [13]
研判2025!中国类载板(SLP)行业产业链、市场现状、重点企业及未来前景分析:行业市场规模持续扩大,技术迭代加速高密度互联时代来临[图]
Chan Ye Xin Xi Wang· 2025-06-13 01:51
Industry Overview - Substrate-like PCB (SLP) is a new type of circuit board positioned between traditional PCBs and semiconductor packaging substrates, experiencing rapid development in recent years [1][4] - The global SLP market size is projected to reach 31.5 billion yuan in 2024, with a year-on-year growth of 6.06% [1][15] - SLP technology meets the increasing demand for miniaturization and high performance in electronic products, with line width/spacing reduced to 20/35 microns, allowing for double the component density compared to traditional HDI [1][15] Industry Development History - The SLP industry in China has gone through four stages: the initial stage (2010-2016), the startup phase (2017-2020), the scaling phase (2021-2023), and the internationalization phase (2024-present) [4][5][6] - The introduction of SLP technology by Apple in the iPhone X marked its commercial application, leading to increased demand from consumer electronics [4][5] - Chinese manufacturers like Pengding Holdings and Shenzhen Sannan Circuit began to break the technological monopoly of international firms during the startup phase [5][6] Industry Chain - The upstream of the SLP industry chain includes raw materials (copper foil, resin, glass fiber cloth, etc.) and production equipment (laser drilling machines, plating equipment, etc.) [9] - The midstream involves the manufacturing of SLP, while the downstream applications include smartphones, wearable devices, automotive electronics, data centers, and 5G communication devices [9] Market Size - The SLP market is expected to continue growing, driven by advancements in technology and increasing demand for high-density circuit boards [15][24] - The market is projected to expand further by 2030, particularly in China, due to the proliferation of 5G networks and upgrades in consumer electronics [24] Key Companies' Performance - Pengding Holdings, a leading PCB manufacturer, has achieved significant revenue growth, with SLP-related income accounting for over 45% of total revenue in 2024 [21] - Shenzhen Sannan Circuit has made advancements in SLP technology, achieving mass production of 25μm line width/spacing and continuously pushing towards 20μm [19][21] - Shenzhen Jingwang Electronics has established a strong position in the high-end PCB market, with a focus on SLP technology and significant revenue growth in 2025 [19][21] Industry Development Trends - The SLP technology is advancing towards higher density and finer lines, with line width/spacing shrinking to below 15/15 microns for applications in AR/VR and 6G communication [6][23] - The demand for high-performance PCBs is expected to drive industry expansion, with companies focusing on capacity expansion and technological upgrades to meet market needs [24][25] - Increased competition is anticipated, leading to higher market concentration, with leading companies solidifying their positions through innovation and market integration [25]
兴森科技(002436):坚定投入高端封装基板业务 持续推进量产
Xin Lang Cai Jing· 2025-04-29 02:43
Core Viewpoint - The company reported a revenue increase for 2024 but a significant decline in net profit, indicating challenges in profitability despite revenue growth [1] Financial Performance - In 2024, the company achieved a revenue of 5.817 billion yuan, a year-on-year increase of 8.53%, but reported a net profit of -0.198 billion yuan, a year-on-year decline of 193.88% [1] - For Q1 2025, the company reported a revenue of 1.580 billion yuan, a year-on-year increase of 13.77%, with a net profit of 0.009 billion yuan, a year-on-year decline of 62.24% [1] Business Segments - The PCB sample business is stable, with an optimized customer and product structure; revenue from the HDI board and SLP business grew due to strategic customer recovery in high-end mobile phones, generating 860.7646 million yuan in revenue and 136.1930 million yuan in net profit [2] - The FCBGA packaging substrate business faced high costs and losses from subsidiaries, with total expenses of 734.0358 million yuan for the FCBGA project, and losses of 131.7017 million yuan from Yixing Silicon Valley and 70.7008 million yuan from Guangzhou Xingke due to underutilization [2] Strategic Focus - The company is committed to high-end packaging substrate business, with semiconductor business revenue reaching 1.2848648 billion yuan, a year-on-year growth of 18.27%; the CSP packaging substrate business is expanding into storage and RF markets, benefiting from the recovery in the storage chip industry [3] - The FCBGA project is prepared for mass production, with ongoing customer certification and sample order deliveries, leading to improved yield rates [3] Investment Outlook - Revenue projections for 2025 to 2027 are 7.307 billion yuan, 9.206 billion yuan, and 11.784 billion yuan, with net profits of 0.154 billion yuan, 0.415 billion yuan, and 0.857 billion yuan respectively; the company is positioned as a key player in the domestic FCBGA substrate market amid a backdrop of domestic substitution [4] - The company is expected to reach a target price of 13.75 yuan based on a 56 times price-to-earnings ratio for 2026, maintaining a "Buy-A" investment rating [4]